Illustration: Stephanie Davidson
A New Front Is Opening Up in the US-China Conflict Over Chips
The emerging field of advanced packaging is being hailed as an inflection point for the semiconductor industry. China is moving in on the same arena.
President Joe Biden has adopted a two-pronged approach to constrain China’s high-tech progress, curbing Beijing’s access to leading-edge chips while bolstering semiconductor production in the US.
He’s about to ratchet up the pressure further, shifting focus to an emerging arena of the contest for technological supremacy: the process of packaging semiconductors that’s increasingly seen as a path to achieving higher performance.