Broadcom Ships New AI Chip to Fujitsu, Plans Wider Rollout

Broadcom Inc. is shipping a new custom AI chip design to Fujitsu Ltd. that stacks components to save energy — an approach it expects big data center operators to adopt later this year.

Broadcom’s 3.5D eXtreme Dimension System in Package takes two pieces of the chip called dies and stacks them top to top, rather than a previous system pioneered by Advanced Micro Devices Inc. that piles them top to bottom. The stack allows for more data to be transferred with better power efficiency, said Harish Bharadwaj, vice president of marketing in the company’s custom chip unit.