LG Electronics Shares Jump on Report of AI Chip Gear Development

LG Electronics Inc. shares advanced in Seoul after a local media report that the company is developing cutting-edge tools for making the memory chips that work alongside AI processors designed by Nvidia Corp. and others.

The Korean company is targeting mass production of hybrid bonders for high-bandwidth memory chips in 2028, Seoul Economic Daily reported, citing unidentified sources. LG Electronics said it is conducting technical research on hybrid bonders for HBM, but the specific timing of mass production has not been confirmed.