Chinese AI Chipmaker Biren to Revisit $300 Million Hong Kong IPO Plan
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Shanghai Biren Intelligent Technology Co. is considering an initial public offering in Hong Kong, people familiar with the matter said, reviving a listing plan after also looking at Shanghai.
Biren could seek to raise about $300 million in the IPO, the people said, asking not to be identified discussing private information. The artificial intelligence chipmaker is working with China International Capital Corp., BOC International Holdings Ltd. and Ping An Securities Co. on the potential share sale, which could take place this year, the people said.