US Launches $3 Billion Effort to Boost Advanced Chip Packaging
- First packaging funding opportunity to open early next year
- US has 3% of global packaging capacity, while most in Asia
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The US Commerce Department is launching a $3 billion program to stimulate the domestic chip-packaging industry, a key link in the semiconductor supply chain that Washington worries has become dominated by Asia.
The packaging program is the first major research and development investment from the 2022 Chips and Science Act, which aims to revive semiconductor production in the US as the development of critical electronic components has become a geopolitical battleground between the US and China.