Arizona and TSMC Talking Advanced Chip Packaging, Governor Says
- US delegation visits Taiwan to discuss semiconductor ties
- TSMC has two fabs and $40 billion in investments in Arizona
TSMC’s commitment to Arizona now spans two fabs and $40 billion in investment, and adding advanced packaging to that endeavor would again raise the ceiling on what’s possible to produce there.
Photographer: Caitlin O'Hara/BloombergTaiwan Semiconductor Manufacturing Co. and Arizona authorities are talking about adding advanced chip packaging capacity to the company’s plants in the state, Governor Katie Hobbs said in Taipei on Tuesday.
Hobbs is part of a broader US delegation visiting the island, with discussions among officials and companies focused on Taiwan’s key role in the semiconductor supply chain. Under Secretary of Commerce Laurie E. Locascio said the US is talking to TSMC about research and development for the first time, in an effort to bring more of the world’s biggest contract chipmaker’s technology onshore.