(Updates video to add Huang’s comment that TSMC can consider collaborations on advanced packaging if it makes sense for customers and the wafer business; updates video description with additional comments.) Taiwan Semiconductor Manufacturing Co. Chief Financial Officer Wendell Huang said the company will try to accelerate the transfer of its advanced chipmaking expertise to the US in the future, though it will still develop and maintain its most cutting-edge fabrication techniques at home. He said TSMC can consider collaborations on advanced packaging if it makes sense for customers and the company’s wafer business. There have been no discussions about potential investments in Intel Corp., Huang said.