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via technologies inc (2388) Details

VIA Technologies, Inc. develops integrated embedded platform and system solutions for M2M, Internet of Things (IoT), and smart city applications worldwide. The company provides Android signage players, industrial fanless PCs, fanless panel PCs, ruggedized tablets, and small form factor PCs, as well as accessories, including active optical cables, wireless, and SSD series. It also offers smart industry solutions, such as energy management and industrial automation solutions; and smart transportation solutions comprising in-station and in-vehicle solutions, such as scalable systems, starter kits, and IoT acceleration platforms, as well as a selection of scalable systems and platforms. In addition, the company provides IoT studio solutions, including VIA Alegro 100, a multiprotocol home gateway router; VIA document telestrator; and VIA wireless display system. Further, it offers embedded boards, such as mini-ITX boards, 3.5 inch boards, pico-ITX boards, and COM Express and ETX modules. Additionally, the company offers a suite of hardware, software, and cloud engineering services. VIA Technologies, Inc. was founded in 1987 and is headquartered in New Taipei City, Taiwan.

Founded in 1987

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via technologies inc
VIA Technologies, Inc. Unveils VIA Smart Recognition Platform at Embedded World 2018

VIA Technologies, Inc. announced that it will debut the VIA Smart Recognition Platform for high-performance computer vision systems and kiosks at Embedded World 2018 from February 27 to March 1. The VIA booth is located at #2-551 in Hall 2 of the Nuremberg Exhibition Center. The VIA Smart Recognition Platform combines the video, graphics, and compute capabilities of the Qualcomm® Snapdragon™ 820 quad-core processor with a wealth of camera and display integration, I/O enablement, and wireless connectivity options to provide a flexible and scalable path for building highly-sophisticated security, surveillance, traffic monitoring, building management, and consumer engagement system applications. With its support for object and facial recognition, including emotion, age and gender detection, as well as people counting and tracking, the platform can be rapidly customized to meet specific installation and deployment requirements – ranging from office building access control and tracking systems for staff and visitors to retail signage kiosks that deliver personalized advertising and promotions to shoppers. Facial and object recognition speed and accuracy are ensured by the platform’s advanced AI algorithm. The VIA Smart Recognition Platform is based on the VIA SOM-9X20 system module powered by the Qualcomm Snapdragon 820 embedded platform. Measuring a mere 8.2cm x 4.5cm, the module features 64GB eMMC Flash memory and 4GB LPDDR4 SDRAM onboard and offers rich I/O and display expansion options through its MXM 3.0 314-pin connector, including USB 3.0, USB 2.0, HDMI 2.0, SDIO, PCIe, MIPI CSI, MIPI DSI, and multi-function pins for UART, I2C, SPI, and GPIO. It also provides a full set of advanced wireless connectivity features including GPS, BT 4.1, and Wi-Fi 802.11 a/b/g/n/ac through an integrated combo module featuring two antenna connectors. The SOMDB2 multi-I/O carrier board is also available to accelerate system development. Customers can also utilize VIA’s extensive technical support and design assistance services to develop their own custom baseboard. The VIA Smart Recognition Platform comes with a BSP that features Android 7.1.1 as well as the VIA Smart ETK (Embedded Tool Kit) comprising a number of APIs, including Watchdog Timer (WDT) for safeguarding against system crashes, GPIO access, RTC for auto-power on, and a sample app. A BSP supporting Linux Kernel 3.18.44 is also under development. A full set of hardware and software customization services that speed up time to commercialization and minimize development costs is also available.

VIA Technologies Launches VIA SOM-9X20 Featuring Qualcomm® Snapdragon™ 820 Embedded Platform

VIA Technologies, Inc. announced the launch of the VIA SOM-9X20 system-on-module (SoM) powered by the Qualcomm® Snapdragon™ 820 embedded platform, a product of Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated. The VIA SOM-9X20 is an ultra-compact SoM that harnesses the performance and low power consumption of the Snapdragon 820 embedded platform to provide a highly-flexible solution for enabling the rapid development of a variety of Enterprise IoT and embedded system applications ranging from human-machine interface (HMI), surveillance, and digital signage to robotics, cameras, and video conferencing. The Snapdragon 820 processor includes the following features: Qualcomm® Kryo™ CPU: Designed to deliver maximum performance and low power consumption, Kryo is Qualcomm Technologies’ first custom 64-bit quad-core CPU, manufactured in advanced 14nm FinFET LPP process; Qualcomm® Adreno™ 530 GPU: Up to 40% better graphics and compute performance for improved visual fidelity while reducing power consumption than previous generations; Qualcomm Spectra™ 14-bit dual image signal processors (ISPs) engineered to deliver high resolution DSLR-quality images using heterogeneous compute for advanced processing and additional power savings, supports up to 28MP sensors with zero shutter lag; Qualcomm® Hexagon™ 680 DSP includes Hexagon Vector eXtensions (HVX) and Sensor Core with Low Power Island for constant sensor processing. The VIA SOM-9X20 is a highly-integrated system-on-module powered by the Qualcomm Snapdragon 820 embedded platform. Measuring a mere 8.2cm x 4.5cm, the module features 64GB eMMC Flash memory and 4GB LPDDR4 SDRAM onboard and offers rich I/O and display expansion options through its MXM 3.0 314-pin connector, including USB 3.0, USB 2.0, HDMI 2.0, SDIO, PCIe, MIPI CSI, MIPI DSI, and multi-function pins for UART, I2C, SPI, and GPIO. The VIA SOM-9X20 module also provides a full set of advanced wireless connectivity features including GPS, BT 4.1, and Wi-Fi 802.11 a/b/g/n/ac through an integrated combo module featuring two antenna connectors. A multi-I/O evaluation carrier board is available to accelerate system development. Customers can also utilize VIA’s extensive technical support and design assistance services to develop a custom baseboard.

VIA Technologies Launches VPai Slide 360-Degree Video Camera Platform

VIA Technologies, Inc. announced the VPai Slide 360-degree video camera turnkey platform. VPai Slide provides a production-ready iPhone®-compatible solution for companies planning to enter the rapidly-growing panoramic camera market. It combines a sleek and stylish form factor with a user-friendly software app that provides a rich array of real-time immersive capture, stitching, editing, and sharing features. Multiple color combinations and other customization options are available. VPai Slide shoots 360-degree photos and video at resolutions of up to 5MP, and features an integrated Lightning connector and dedicated battery and storage. Its detachable design makes it easy to capture images and video whenever inspiration strikes – no matter whether it’s plugged into the user's iPhone, attached to a tripod, or held in the palm of the user hand. The VPai Slide software app offers a rich array of real-time immersive video and image capture, composition, and sharing features including: Views: Panorama, Asteroid, Crystal Ball, and VR modes. Filters: Twelve color filters to preview or edit captured media within the app, including a black and white filter, a range of beauty enhancements for close-ups of people, and the Skelton filter which transforms a scene into a sketch-like drawing. Space: The VPai sharing platform which allows users to upload photos and videos to the VPai cloud to be enjoyed by others in the VPai community. Time-Lapse: This feature allows users to explore a whole new dimension of 360° capture by creating time-lapse videos. Screen Capture: Users can take screenshots directly in the app to share Asteroid and Crystal Ball views of 360° images across any social platform from Pinterest and Instagram to Google+ and Twitter. Live Streaming: User can livestream their 360° videos direct to leading social media networks including Facebook, YouTube, and Weibo.

 

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Valuation 2388 Industry Range
Price/Earnings 100.0x
Price/Sales 4.1x
Price/Book 5.3x
Price/Cash Flow 352.4x
TEV/Sales 2.9x
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