6147 On Other Exchanges
6147 is not on other exchanges.

chipbond technology corp (6147) Snapshot

Previous Close
Day High
Day Low
52 Week High
-- - --
52 Week Low
-- - --
Market Cap
Average Volume 10 Days
Shares Outstanding
Dividend Yield
Current Stock Chart for CHIPBOND TECHNOLOGY CORP (6147)

Related News

No related news articles were found.

chipbond technology corp (6147) Related Businessweek News

No Related Businessweek News Found

chipbond technology corp (6147) Details

Chipbond Technology Corporation provides services for backend assembly processing of LCD driver ICs in Taiwan, the United States, and internationally. It offers turnkey services, which comprise bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; wafer surface processing services, such as back side metal and dielectric layer coating process services; wafer grinding, dicing, and picking and placing services; package and testing services comprising driver and non-driver IC testing, driver IC package, and wafer level chip scale packaging services; final inspection and failure analysis services; and chip tray design and manufacturing services. The company was founded in 1997 and is headquartered in Hsinchu City, Taiwan.

Founded in 1997

chipbond technology corp (6147) Top Compensated Officers

No compensation data is available at this time for the top officers at this company.

Executives, Board Directors

chipbond technology corp
Chipbond Technology Corporation Approves Dividend Distribution; Appoints Wang, William as Director

The shareholders of Chipbond Technology Corporation approved at its AGM to distribution dividend of TWD 2.35 per ordinary share. The shareholders approved that the appointment of Wang, William as director of the company.

Chipbond Technology Corporation Proposes Dividend Distribution

The Board of Directors of Chipbond Technology Corporation proposed dividend distribution of TWD 2.35000000 per share. Total amount of cash dividends to shareholders is TWD 1,537,515,695.

Chipbond Technology Corporation Provides Earnings Guidance for the Second Quarter and Full Year of 2018

Chipbond Technology Corporation provided earnings guidance for the second quarter and full year of 2018. For the quarter, the company expects the revenue will increase by 10% compared to the first quarter. For the full year, the company expects operating profit will be better than last year. If included non-operating income, the full year EPS will be up to TWD 6~TWD 7.


The information and data displayed in this profile are created and managed by S&P Global Market Intelligence, a division of S&P Global. Bloomberg.com does not create or control the content. For inquiries, please contact S&P Global Market Intelligence directly by clicking here.

Stock Quotes

Market data is delayed at least 15 minutes.

Company Lookup

6147 Competitors

Market data is delayed at least 15 minutes.

Company Last Change
No competitor information is available for 6147.
View Industry Companies

Industry Analysis


Industry Average

Valuation 6147 Industry Range
Price/Earnings 16.5x
Price/Sales 2.1x
Price/Book 1.6x
Price/Cash Flow 16.9x
TEV/Sales 1.6x

Sponsored Financial Commentaries

Sponsored Links

Request Profile Update

Only a company representative may request an update for the company profile. Documentation will be required.

To contact CHIPBOND TECHNOLOGY CORP, please visit www.chipbond.com.tw. Company data is provided by S&P Global Market Intelligence. Please use this form to report any data issues.

Please enter your information in the following field(s):
Update Needed*

All data changes require verification from public sources. Please include the correct value or values and a source where we can verify.

Your requested update has been submitted

Our data partners will research the update request and update the information on this page if necessary. Research and follow-up could take several weeks. If you have questions, you can contact them at bwwebmaster@businessweek.com.