March 17, 2018 10:49 PM ET

Semiconductors and Semiconductor Equipment

Company Overview of SUSS MicroTec, Inc.

Company Overview

SUSS MicroTec, Inc. designs and manufactures electrical measuring products. It offers precision lithography tools, including mask aligners, and spin and spray coaters; wafer and device bonders; and test systems. The company serves research institutions, packaging products, MEMS, nanotechnology, compound semiconductor, silicon-on-insulator, and 3D interconnect markets. The company was formerly known as Karl Suss Inc. and changed its name to SUSS MicroTec, Inc. in 2001. The company was founded in 1980 and is based in Waterbury Center, Vermont. SUSS MicroTec, Inc. operates as a subsidiary of Suss MicroTec AG.

228 Suss Drive

Waterbury Center, VT 05677-8296

United States

Founded in 1980





Key Executives for SUSS MicroTec, Inc.

SUSS MicroTec, Inc. does not have any Key Executives recorded.

SUSS MicroTec, Inc. Key Developments

SUSS MicroTec, Inc. Presents at Needham & Co. 20th Annual Growth Conference, Jan-18-2018 01:30 PM

SUSS MicroTec, Inc. Presents at Needham & Co. 20th Annual Growth Conference, Jan-18-2018 01:30 PM. Venue: Lotte New York Palace Hotel, 455 Madison Avenue at 50th Street, New York, New York, United States.

SUSS MicroTec Launches XBS200

SUSS MicroTec launched a brand-new automated permanent wafer bonding system. The XBS200 is a universal platform, designed for aligned wafer bonding of wafer sizes up to 200 mm. Its versatility and modular design offer maximum process flexibility in all permanent bonding tasks. A novel aligned wafer transfer method eliminates the complexity of traditional systems and offers consistent process results with excellent system availability. The XBS200 platform provides low cost of ownership for high-volume production of MEMS, LED and 3D stacked devices. Its new bond aligner uses SUSS MicroTec's proprietary Inter-Substrate Alignment (ISA) technology and delivers consistent submicron alignment. Automated calibration and overlay verification ensures optimum repeatability. The bond chamber is based on the very successful stand-alone XB8 bonder. It offers a wide parameter window with temperatures of up to 550 C and bond forces of up to 100kN. Its innovative mechanical and thermal chamber design results in optimal bonding force and temperature distribution across the wafer and therefore ensures high yield.

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