Semiconductors and Semiconductor Equipment
Company Overview of 3D Micromac AG
3D Micromac AG develops, manufactures, and supplies laser micromachining systems for laser micro cutting, drilling, engraving, and structuring applications. It offers its laser systems for semiconductor processing and MEMS fabrications; medical device technology applications; laser processing of crystalline solar cells; and marking of ophthalmic glasses and contact lenses. The company also provides its systems for coating and structuring of flexible thin film materials. In addition, it offers application support, spare part management, and training services. The company offers its products through distributors, and sales and service partners in North America, Asia, and Europe. 3D Micromac AG...
Founded in 2002
Key Executives for 3D Micromac AG
Chairman and Chief Executive Officer
Chief Operation Officer and Member of The Management
Head of Service Department
Chief Technology Officer and Member of The Management
Compensation as of Fiscal Year 2017.
3D Micromac AG Key Developments
3D Micromac AG Installs Three of its microCELL OTF Laser Systems at Hanwha Solarone's Production Facility in Qidong
Nov 28 17
3D-Micromac AG announced that it has installed three of its microCELL OTF laser systems at Hanwha SolarOne's production facility in Qidong, Jiangsu-province, China. The successful installation was followed by an additional order of a fourth laser system to support the conversion of Hanwha SolarOne's aluminum back surface field (Al-BSF) technology production to high-efficiency Passivated Emitter Rear Contact (PERC) solar cells. PERC solar cells have the potential to deliver a significantly higher level of energy efficiency compared to standard solar cells. A critical step in the manufacturing process of PERC solar cells is laser contact opening (LCO), where laser ablation is used to perforate a thin passivation layer onto the rear side of the solar cell. This process reduces electrical losses in the cell, resulting in approximately 1% (absolute) higher conversion efficiency. 3D-Micromac addresses this critical step with its microCELL OTF laser platform, high-productivity and low cost-of-ownership solution for mono- and polycrystalline silicon solar cells. Featuring "on-the-fly" technology, the laser process takes place while the wafer runs in continuous motion through the machine, boosting the throughput by eliminating dead cycles for motion encountered with competing approaches. The microCELL OTF achieves throughput values above 4,000 wafers per hour (wph) with single-lane systems and above 8,000 wph with dual-lane systems. Another unique selling point of the microCELL OTF is its contactless wafer handling, which holds the wafer in place on an air cushion during processing, thereby reducing or eliminating surface defects and microcracks, and enabling maximum yields. Mechanical wafer handling, on the other hand, can increase the likelihood of surface defects and microcracks occurring, which can result in additional wafer damage during subsequent process steps.
Allotex Inc. and 3D-Micromac Enter into Master Cooperative Agreement
Dec 14 16
Allotex Inc. and 3D-Micromac announced they have entered into a master cooperative agreement. The two companies will work together to develop and market a laser system for precisely shaping human corneal allografts used to create natural lenses, which can be administered in an outpatient visit. Made from human collagen, Allotex's natural allograft lenses can be used to treat the most common refractive errors that cause people to need vision correction. To be implanted successfully, these lenses must be produced to exacting dimensions much smaller than the thickness of a human hair. Under the agreement, 3D-Micromac will design, develop and produce – exclusively for Allotex – a high-precision, compact excimer laser system for machining the lenses. Allotex will handle sales and marketing of the system to ophthalmologists and ophthalmic clinics. 3D-Micromac will deliver the first prototype, developed in conjunction with Allotex experts, to the Allotex R&D facility in Zurich, Switzerland, in January 2017, with a second system slated for delivery to Allotex's commercial facility in Boston, Mass. Allotex expects to begin European trials in the second quarter of 2017 and commercial rollout of 3D-Micromac's laser systems and Allotex lenses in early 2018.
3D-Micromac AG Brings Enabling, Low Cost-Of-Ownership Laser Micromachining Solution to Volume Semiconductor Wafer and Power Device Processing
Jul 6 16
3D-Micromac AG, announced that its microDICE laser micromachining system has been adopted by a major industrial manufacturer for volume production of high-power diodes. Leveraging 3D-Micromac's proprietary TLS-Dicing technology, the microDICE system provides fast, clean and cost-effective dicing of wafers used for advanced semiconductors and power device applications. Its unique approach uses thermally induced mechanical stress to separate brittle semiconductor materials such as silicon, silicon carbide (SiC) germanium (Ge) and gallium arsenide (GaAs). TLS-Dicing is a contact- and residue-free process that provides significantly higher throughput, higher yields and greater functionality compared to traditional die-separation technologies.
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