May 23, 2018 5:55 AM ET

Semiconductors and Semiconductor Equipment

Company Overview of National Center for Advanced Packaging Co., Ltd.

Company Overview

National Center for Advanced Packaging Co., Ltd. is engaged in the research, development, and commercialization of packaging, testing, and system integration solutions for the IC packaging and testing industry. Its technology and applications include design and simulation, system integration, PoP, optical-electronic packaging, packaging substrates, TSV, microelectronics assembly, and IP. It also offers electrical simulation, thermal management and thermal mechanical reliability simulation, and process simulation services; advanced packaging services; and testing services, which include electrical test, reliability test and failure analysis, and thermal test services. The company was incorpor...

Building D1

China Sensor Network International Innovation Park

200 Linghu Boulevard

Wuxi,  214000


Founded in 2012


86 510 6667 9336


86 510 6678 8653

Key Executives for National Center for Advanced Packaging Co., Ltd.

Chief Executive Officer
Technical Director
Technical Director
Technical Director
Compensation as of Fiscal Year 2017.

Recent Private Companies Transactions

No transactions available in the past 12 months.

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