June 17, 2018 10:31 PM ET

Semiconductors and Semiconductor Equipment

Company Overview of 1366 Technologies, Inc.

Company Overview

1366 Technologies, Inc. develops and builds multi-crystalline solar wafers for photovoltaics industry. It develops Direct Wafer, a technology that forms a multi-crystalline wafer directly from molten silicon. The company was founded in 2007 and is based in Bedford, Massachusetts. It has a commercial solar wafer manufacturing facility in Genesee County, New York.

6-8 Preston Court

Bedford, MA 01730

United States

Founded in 2007





Key Executives for 1366 Technologies, Inc.

Co-Founder, Chief Executive Officer, President and Director
Chief Operating Officer
Director of Cell Technology
Compensation as of Fiscal Year 2017.

1366 Technologies, Inc. Key Developments

1366 Technologies Introduces '3D' Wafer Feature

1366 Technologies unveiled the first of a series of R&D achievements that have the potential to change the way the solar industry thinks about wafer features. The company’s proprietary Direct Wafer process has demonstrated the ability to grow a “three dimensional” wafer or a thin wafer with a thick border, an advancement impossible with conventional ingot-based production technologies. The 3D feature further reduces the amount of silicon required for each wafer without sacrificing strength, durability or performance. It also allows the dominant crystalline silicon PV supply chain to lower costs while leveraging its existing infrastructure. To decrease the amount of silicon used by photovoltaic wafers, manufacturers have long pursued methods to reduce wafer thickness. While wire sawing can be used to produce wafers thinner than the standard 180-200 micron thickness, these thin wafers have reduced mechanical integrity and break during cell fabrication, electrical interconnection and encapsulation in modules. As such, standard industry wafer thickness has remained between 180-200 microns. 1366’s Direct Wafer process has the unique ability to locally-control wafer thickness and provide standard 180-200 micron thickness in stress-critical areas such as wafer perimeter or ribs where busbar soldering will occur, while reducing thickness to 100-120 microns for the remainder of the wafer. The result cuts silicon consumption to 1.5 g/W and creates a strong, thin wafer able to withstand typical manufacturing stresses. 1366’s Direct Wafer technology is a transformative manufacturing process that offers significant advantages over traditional ingot-based wafer production technologies, including the ability to introduce new wafer features that reduce cost and increase efficiency. The process makes wafers in a single step, pulling them directly from molten silicon instead of today’s multi-step, energy- and capital-intensive approach, resulting in significant wafer production cost savings.

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Recent Private Companies Transactions

Private Placement
October 18, 2017

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