November 17, 2017 2:44 PM ET

Semiconductors and Semiconductor Equipment

Company Overview of GLOBALFOUNDRIES Inc.

Company Overview

GLOBALFOUNDRIES Inc. designs and manufactures semiconductors for the technology sector. It offers direct and indirect supplementary, post-wafer-manufacturing, prototyping, mask, APM framework, supply chain management, and turnkey services. The company was founded in 2009 and is based in Santa Clara, California with manufacturing centers in Germany; Singapore; New York, New York; and Vermont, Canada. It has regional sales and support offices in Shanghai, China; Yokohama, Japan; Hsinchu, Taiwan; Austin, Texas; Amsterdam, the Netherlands; and Munich, Germany.

2600 Great America Way

Santa Clara, CA 95054

United States

Founded in 2009



Key Executives for GLOBALFOUNDRIES Inc.

Chief Executive Officer
Age: 53
Chief Account Officer and Acting Chief Financial Officer
Age: 62
Senior Vice President of Global Operations
Age: 63
Chief Technology Officer and Head of Research and Development
Chief Legal Officer, Senior Vice President and Secretary
Age: 62
Compensation as of Fiscal Year 2017.

GLOBALFOUNDRIES Inc. Key Developments

GLOBALFOUNDRIES Introduces New Automotive Platform to Fuel Tomorrow’s Connected Car

GLOBALFOUNDRIES unveiled AutoPro, a new platform designed to provide automotive customers a broad set of technology solutions and manufacturing services that minimize certification efforts and speed time-to-market. The company offers the industry’s broadest set of solutions for a full range of driving system applications, from informational Advanced Driver Assistance Systems (ADAS) to high-performance real-time processors for autonomous cars. Building on 10 years of automotive experience, the company’s AutoPro technology platform includes offerings in silicon germanium (SiGe), FD-SOI (FDX), CMOS and advanced FinFET nodes, combined with a broad range of ASIC design services, packaging and IP. GF’s CMOS and RF solutions deliver an optimal combination of performance, integration and power efficiency for advanced sensors (radar, lidar, cameras), ADAS and autonomous processing (sensor fusion and AI compute) and body and powertrain control, with embedded eNVM technology for in-vehicle MCUs, as well as connectivity and infotainment systems. The company’s BCD and BCDLite® technologies provide high-voltage capabilities, with a path to supporting 48 volts that enable automotive power solutions for electric powertrain, Hybrid-electric (HEVs) and Internal Combustion Engine (ICE) vehicles.

GLOBALFOUNDRIES Announces the Availability of First RF SOI Foundry Solution

GLOBALFOUNDRIES announced the availability of the first RF SOI foundry solution manufactured on 300mm wafers. The company's most advanced RF SOI technology, 8SW SOI, delivers significant performance, integration and area advantages in front-end modules (FEMs) for 4G LTE and sub-6 GHz 5G mobile and wireless communication applications. The 300mm RF silicon-on-insulator (SOI) based technology gives designers a cost-effective platform with an optimal combination of performance, integration and power efficiency with greater digital integration ability. GFs 8SW technology incorporates a specialized substrate optimization that maximizes the quality factor for passive devices, reduces parasitic capacitances for active circuits and minimizes the disparity in phase and voltage swing for devices operating in the sub-GHz frequency range. The technology showcases an optimized LNA with leadership noise figure and high ft/fmax supporting diversity receive and main antenna path LNA applications for 4G operating frequencies and future sub-6GHz 5G FEMs.

GLOBALFOUNDRIES Delivers Custom 14nm FinFET Technology for IBM Systems

GLOBALFOUNDRIES is delivering in volume its 14nm High Performance (HP) technology that will enable IBM’s next-generation of processors for server systems. The jointly developed 14HP process is specifically designed to deliver the ultra-high performance and data-processing capacity IBM needs to support its cloud, commerce, and enterprise solutions in the era of big data and cognitive computing. IBM announced general availability of the IBM Z on September 13. The 14HP is the only technology to integrate a three-dimensional FinFET transistor architecture on a silicon-on-insulator (SOI) substrate. Featuring a 17-layer metal stack and more than eight billion transistors per chip, the technology leverages embedded DRAM and other innovative features to deliver higher performance, reduced energy, and better area scaling over previous generations to address a wide range of deep computing workloads. The 14HP technology powers the processors that run IBM’s latest z14 mainframes. The underlying semiconductor process allows IBM customers to enable massive transaction scale of high-volume workloads, apply machine learning to their most valuable data, and rapidly derive actionable insights to enable intelligent decisions—all while delivering pervasive encryption that provides the ultimate in data protection.

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Recent Private Companies Transactions

December 13, 2016
GLOBALFOUNDRIES Inc., Portfolio of Patents

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