March 17, 2018 5:28 PM ET

Semiconductors and Semiconductor Equipment

Company Overview of Qualcomm Technologies, Inc.

Company Overview

Qualcomm Technologies, Inc. engages in the research, development, and manufacturing of wireless semiconductor chips. The company develops virtual reality software development kit. It has strategic alliances with Google Inc., BlackBerry Limited, Microsoft Corp., Lenovo Group Limited, Google Inc., Advanced Micro Devices, Inc., ARM Holdings plc, Huawei Investment & Holding Co., Ltd., International Business Machines Corporation, Mercedes-AMG Petronas Motorsport, Emirates Telecommunications Group Company PJSC, Sprint Corporation, SoftBank Group Corp., Himax Technologies, Inc., Deutsche Telekom AG, Mellanox Technologies, Ltd., AT&T Inc., Universal Scientific Industrial (Shanghai) Co., Ltd., Telefo...

5775 Morehouse Drive

San Diego, CA 92121

United States

Founded in 2011





Key Executives for Qualcomm Technologies, Inc.

Executive Vice President and President of Global Market Development
Age: 55
Executive Vice President
Age: 47
Senior Vice President of Business Development
Senior Vice-President of Business Development - Cdma Technologies
Compensation as of Fiscal Year 2017.

Qualcomm Technologies, Inc. Key Developments

Qualcomm Introduces New Snapdragon 700 Mobile Platform Series

Qualcomm Incorporated announced that its subsidiary, Qualcomm Technologies, Inc., has introduced the new Qualcomm® Snapdragon 700 Mobile Platform Series, designed to exceed what is expected from high-tier mobile experiences, with features and performance previously only available in the premium Snapdragon 800 Mobile Platform Series. Advances to be expected in the 700 Series include on-device AI supported by the Qualcomm® Artificial Intelligence (AI) Engine, and improvements to camera, device performance and power, supported by the heterogeneous compute power of premium features including the Qualcomm Spectra ISP, Qualcomm® Kryo CPU, Qualcomm® Hexagon Vector Processor and Qualcomm® Adreno Visual Processing subsystem.

Qualcomm Snapdragon 845 Mobile Platform Powers Advanced Connectivity and Immersive Experiences on the Samsung Galaxy S9 and S9+

Qualcomm Technologies, Inc. announced that its premium mobile platform is powering Samsung's latest and most sophisticated flagship smartphone, the Samsung Galaxy S9, for select regions. The Samsung Galaxy S9 and S9+ are powered by the Qualcomm® Snapdragon 845 Mobile Platform, featuring Ultra HD Premium capture for cinema-quality video and Gigabit LTE for lightning-fast connectivity. Thoughtfully designed with tech savvy consumers in mind, Snapdragon 845 utilizes Qualcomm Technologies' cutting-edge wireless heterogenous compute expertise to design a platform for immersive multimedia experiences including eXtended reality (XR), on-device artificial intelligence (AI), and lightning-fast connectivity for premium, flagship mobile devices. The Snapdragon 845 Mobile Platform allows for consumers to capture cinema-grade videos on their Galaxy S9/S9+ and blur the lines between physical and virtual worlds. At the core of the capture experience, the new Qualcomm Spectra 280 ISP features ultra HD premium capture with rich color gamut to support the Galaxy S9 8MP front camera and 12MP rear camera and S9+ 12MP front and rear cameras for the ultimate photography and ultra-high definition videography experience. In addition to advancing the video capture experience, the new Qualcomm® Adreno 630 visual processing subsystem is designed to deliver innovations for new XR designs, like the Samsung Gear VR for Galaxy S9/S9+, including room-scale 6 degrees of freedom (6DoF) with simultaneous localization and mapping (SLAM) and "Adreno foveation" to substantially reduce power consumption and improve XR application performance. These brand-new architectures bring high-performance, true-to-life cinematic video capture, along with superior photography to the Galaxy S9/S9+.

Qualcomm Technologies, Inc. Presents at Embedded World 2018 Conference, Feb-28-2018 11:00 AM

Qualcomm Technologies, Inc. Presents at Embedded World 2018 Conference, Feb-28-2018 11:00 AM. Venue: Nuremberg, Germany. Speakers: Leon Farasati.

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