Chipbond Technology Corp

64.30TWD

-0.30-0.46%

Open

63.80

Prev Close

64.60

Volume

4,193,046

Market Cap

41.748B

Day Range

63.20-64.60

52 Week Range

42.90-72.60

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Key Statistics

P/E Ratio18.54

Bloomberg (BEst) P/E Ratio10.6740

Bloomberg (BEst) PEG Ratio--

Shares Outstanding649.26M

Price to Book Ratio1.7179

Price to Sales Ratio2.2655

1 Year Return44.15%

30 Day Avg Volume9,325,717

EPS3.47

Bloomberg (BEst) EPS Curr Yr5.6250

Dividend3.27%

Last Dividend Reported2.1

Earnings Announcement for Period Ending Q1/2018:04/30/2018

Compare
1-Day Performance

Equity

6147:TT

-0.46%

-1.51%

-1.13%

About Chipbond Technology Corp

Chipbond Technology Corporation manufactures semiconductor products. The Company manufactures and markets semiconductor gold bump and eutectic solder bump, as well as provides TCP (tape carrier packaging), COF (chip on film), and COG (chip on glass) services. Chipbond Technology provides chip testing services for customers worldwide.

Address

3 Li-Hsing 5th Road Science-Based Industrial Park Hsin-Chu Taiwan

Phone

886-3-567-8788

Website

www.chipbond.com.tw