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Shenzhen Danbond Technology Co Ltd

002618:CH
Shenzhen
11.05
CNY
0.14
1.25%
As of 11:29 PM EDT 7/27/2017
Open
11.23
Day Range
10.91 - 11.33
Volume
2,494,913
Previous Close
11.19
52Wk Range
10.10 - 26.23
1 Yr Return
-48.18%
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Open
11.23
Day Range
10.91 - 11.33
Volume
2,494,913
Previous Close
11.19
52Wk Range
10.10 - 26.23
1 Yr Return
-48.18%
YTD Return
-34.36%
Current P/E Ratio (TTM)
184.75
Earnings per Share (CNY) (TTM)
0.06
Market Cap (b CNY)
6.055
Shares Outstanding (m)
547.920
Price/Sales (TTM)
22.41
Dividend Indicated Gross Yield
0.04%
% Price Change
-0.82%
% Price Change
-1.46%

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Profile
Shenzhen Danbond Technology Company Limited develops, produces and sells flexible packaging substrates for FPC and COF products, and produces COF products.
Address
Danbond Tech Bldg,1st Langshan
High Tech Park,Nanshan Distric
Shenzhen
China
Phone
86-755-2651-1518
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