Taiwan Semiconductor Manufacturing Co., the world’s largest contract chipmaker, plans to invest NT$400 billion ($13.5 billion) expanding its Hsinchu production facility as it seeks to regain momentum amid a slowdown in the global smartphone market.
The plans is still in the preliminary stages as the company still needs the government to help secure land and work on environmental assessments, spokeswoman Elizabeth Sun said by telephone. Hsinchu serves as TSMC’s headquarters, a major production facility and includes its research and development center, where it builds the latest chip technology.
