Bloomberg the Company & Products

Bloomberg Anywhere Login


Connecting decision makers to a dynamic network of information, people and ideas, Bloomberg quickly and accurately delivers business and financial information, news and insight around the world.


Financial Products

Enterprise Products


Customer Support

  • Americas

    +1 212 318 2000

  • Europe, Middle East, & Africa

    +44 20 7330 7500

  • Asia Pacific

    +65 6212 1000


Industry Products

Media Services

Follow Us

Last $38.55 USD
Change Today -0.33 / -0.85%
Volume 244.1K
TSRA On Other Exchanges
As of 8:10 PM 05/29/15 All times are local (Market data is delayed by at least 15 minutes).
text size: T | T
Back to Snapshot
Company Description

Contact Info

3025 Orchard Parkway

San Jose, CA 95134

United States

Phone: 408-321-6000

Fax: 408-321-8257

Tessera Technologies, Inc., through its subsidiaries, develops, licenses, and delivers technologies and products for electronic devices. Segments The company operates in two segments, Intellectual Property and DigitalOptics. Intellectual Property The Intellectual Property segment, managed by Tessera Intellectual Property Corp., generates revenue from manufacturers and other implementers that use the company’s technology. The segment includes Tessera, Inc. and Invensas Corporation (Invensas). Tessera, Inc. pioneered chip-scale packaging solutions, which it licenses to the semiconductor industry. Invensas develops and acquires interconnect solutions and intellectual property in areas, such as mobile computing and communications, memory and data storage, and 3-D Integrated Circuit (3DIC) technologies. Tessera, Inc.'s research and development led to significant innovations in semiconductor packaging technology. Semiconductor packaging creates the mechanical and electrical connection between semiconductor chips and systems, such as computers and communication equipment, often via connection to printed circuit boards. The company patented these innovations, often referred to as chip-scale packaging, which were adopted in the industry. Invensas, is a wholly owned subsidiary of Tessera Technologies, Inc. Invensas innovates in three primary areas DRAM and Flash memory, mobile computing and communications, and 3DIC technology. Invensas’s engineering teams develop and prototype these technologies in extensive assembly and test laboratories, as well as performing full product reliability testing and acceptance testing. Within each of these three Invensas sub-portfolios (memory, mobile, and 3DIC), Invensas has created specific product solutions that address critical needs in the market. xFD, Invensas’s multi-chip DRAM technology, was designed to provide a bridge between single-chip DRAM and 3DIC DRAM, and it has gained initial adoption with OEMs and memory module builders. Invensas innovates in the 3DIC space. 3DIC, which incorporates through Silicon Vias, is expected to be the next major inflection in semiconductor packaging, and applicable to multiple markets, including networking, data storage, computing and mobility. Customers: The company’s customers include Intel Corporation, Samsung Electronics Co. Ltd and SK hynix Inc., among others. Research & Development Research and development and other related costs for the Intellectual Property segment were approximately $25.9 million for the year ended December 31, 2013. Intellectual Property Portfolio: As of December 31, 2013, the company’s subsidiaries comprising the Intellectual Property segment owned approximately 1,225 United States patents and patent applications, as well as approximately 919 foreign patents and patent applications. The expiration dates of its issued patents range from 2014 to 2032. Tessera Intellectual Property Corp. evaluates intellectual property portfolios in the field of advanced semiconductor packaging and fields beyond semiconductor packaging technologies, such as circuitry technologies. The company’s evaluation criteria for patent acquisitions include the size of the portfolio, the sales and profitability of the relevant products, its view of the prospects of the market for the relevant products, legal criteria and its assessment of the likelihood of obtaining negotiated licenses. DigitalOptics Segment Through its FotoNation team, which comprise image scientists and advanced mathematicians, the company continues to innovate in product and system-level imaging technologies. Its DigitalOptics patent portfolio consists primarily of assets that address image processing, MEMS and camera modules technologies. FotoNation Solutions FotoNation’s software solutions for mobile imaging include its FaceTools, FotoSavvy , FacePowe, face beautification, red-eye removal, HDR, panorama, and image stabilization products. FaceTools provides face-oriented imaging technology, such as face detection/tracking, smile/blink detection, red-eye removal, face recognition and face beautification. When combined with the company’s ha

Page 12Next Page

Stock Quotes

Market data is delayed at least 15 minutes.

Company Lookup
Recently Viewed
TSRA:US $38.55 USD -0.33

TSRA Competitors

Market data is delayed at least 15 minutes.

Company Last Change
InterDigital Inc/PA $58.63 USD -0.25
Mellanox Technologies Ltd $50.32 USD -0.19
Monolithic Power Systems Inc $54.60 USD -0.35
PMC-Sierra Inc $9.08 USD +0.08
Rambus Inc $15.29 USD +0.37
View Industry Companies

Industry Analysis


Industry Average

Valuation TSRA Industry Range
Price/Earnings 11.6x
Price/Sales 7.5x
Price/Book 3.7x
Price/Cash Flow 10.9x
TEV/Sales 5.9x

Sponsored Financial Commentaries

Sponsored Links

Report Data Issue

To contact TESSERA TECHNOLOGIES INC, please visit Company data is provided by Capital IQ. Please use this form to report any data issues.

Please enter your information in the following field(s):
Update Needed*

All data changes require verification from public sources. Please include the correct value or values and a source where we can verify.

Your requested update has been submitted

Our data partners will research the update request and update the information on this page if necessary. Research and follow-up could take several weeks. If you have questions, you can contact them at