Last €21.92 EUR
Change Today -0.125 / -0.57%
Volume 0.0
As of 9:57 AM 02/27/15 All times are local (Market data is delayed by at least 15 minutes).
text size: T | T
Back to Snapshot
Company Description

Contact Info

No. 8, Li-Hsin Road 6

Hsinchu Science Park

Hsinchu, 300-78


Phone: 886 3 563 6688

Fax: 886 3 563 7000

Taiwan Semiconductor Manufacturing Company Limited engages in the manufacture, sale, packaging, testing, and computer-aided designing of integrated circuits and other semiconductor devices and the manufacturing of masks. The company offers a range of wafer fabrication processes, including processes to manufacture complementary metal oxide silicon (CMOS) logic, mixed-signal, radio frequency (RF), embedded memory, BiCMOS mixed-signal and other semiconductors. It also offers design, mask making, bumping, probing, assembly, and testing services. Foundry Services Range of Services: The company is able to accommodate customers with various needs at every stage of the overall foundry process. Fabrication Processes: The company manufactures semiconductors using the CMOS and BiCMOS processes. The CMOS process is the major semiconductor manufacturing process. The BiCMOS process combines the high speed of the bipolar circuitry and the low power consumption and high density of the CMOS circuitry. The company uses the CMOS process to manufacture logic semiconductors, mixed-signal/RF semiconductors, which combine analog and digital circuitry in a single semiconductor, micro-electro-mechanical-system, which combines micrometer featured mechanical parts, analog and digital circuitry in a single semiconductor, and embedded memory semiconductors, which combine logic and memory in a single semiconductor. The BiCMOS process is used to make high-end mixed-signal and other types of semiconductors. Types of Semiconductors: The company manufactures different types of semiconductors with different specific functions by changing the number and the combinations of conducting, insulating and semiconducting layers and by defining different patterns in which such layers are applied on the wafer. Logic Semiconductors: Logic semiconductors process digital data to control the operation of electronic systems. Mixed-Signal/RF Semiconductors: Analog/digital semiconductors combine analog and digital devices on a single semiconductor to process both analog and digital data. The company makes mixed-signal/RF semiconductors using both the CMOS and BiCMOS processes. It offers CMOS mixed-signal process down to the 28-nanometer technology for manufacturing mixed-signal/RF semiconductors. The primary uses of mixed-signal/RF semiconductors are in hard disk drives, wireless communications equipment and network communications equipment, with those made with the BiCMOS process occupying the higher end of the mixed-signal/RF market. CMOS Image Sensor Semiconductors: Image sensors are primarily used in camera phones and tablets. The company is the foundry for the production of CMOS image sensors, characterized by technology features, including low dark current, high sensitivity, small pixel size and high dynamic range achieved through integration with mixed mode processes. High Voltage Semiconductors: The company offers a range of high-voltage processes, including high voltage CMOS, bipolar-CMOS-DMOS and ultra-high voltage technology, ranging from 5V to 700V, which are suitable for various panel-size display driver and power IC applications. Design and Technology Platforms: Modern IC designers need design infrastructure to optimize productivity and cycle time. Such infrastructures include design flow for electronic design automation, silicon proven building blocks, such as libraries and IPs, simulation and verification design kits, such as process design kit and tech files. This is the concept of the company’s technology platforms. The company unveiled an open innovation platform (OIP) initiative in 2008 to further enhance its technologies offerings. More OIP deliverables were introduced in 2013. In the design methodology area, the company announced the release of 16-nanometer Fin Field-Effect Transistor (FinFET) and three dimensional integrated circuit (3D-IC) reference flows for design enablement through OIP. Multi-project Wafers Program (CyberShuttle): The company offers a multi-project wafer processing service that allows it to provide multiple customers with circuits produced with the same mask. It has extended this program to all


Stock Quotes

Market data is delayed at least 15 minutes.

Company Lookup
Recently Viewed
TSFA:GR €21.92 EUR -0.125

TSFA Competitors

Market data is delayed at least 15 minutes.

Company Last Change
Danaher Corp $87.28 USD -0.53
QUALCOMM Inc $72.51 USD +0.50
SK Hynix Inc 46,600 KRW -500.00
Texas Instruments Inc $58.80 USD -0.62
Xerox Corp $13.65 USD +0.29
View Industry Companies

Industry Analysis


Industry Average

Valuation TSFA Industry Range
Price/Earnings 14.9x
Price/Sales 5.1x
Price/Book 3.8x
Price/Cash Flow 14.9x
TEV/Sales 4.2x

Sponsored Financial Commentaries

Sponsored Links

Report Data Issue

To contact TAIWAN SEMICONDUCTOR-SP ADR, please visit Company data is provided by Capital IQ. Please use this form to report any data issues.

Please enter your information in the following field(s):
Update Needed*

All data changes require verification from public sources. Please include the correct value or values and a source where we can verify.

Your requested update has been submitted

Our data partners will research the update request and update the information on this page if necessary. Research and follow-up could take several weeks. If you have questions, you can contact them at