TSEM On Other Exchanges
Tel Aviv
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Company Description

Contact Info

Ramat Gavriel Industrial Park

20 Shaul Amor Avenue

P.O. Box 619

Migdal Haemek, 2310502


Phone: 972 4 650 6611

Fax: 972 4 654 7788

Tower Semiconductor Ltd., an independent specialty foundry, manufactures semiconductors. The company manufactures semiconductors for its customers primarily based on third party designs. The company offers the process manufacture geometries of 0.35, 0.50, 0.55, 0.60, 0.80-micron and above on 150-mm wafers and 0.35, 0.18. 0.16, 0.13 and 0.11-micron on 200-mm wafers and 65 nanometer and 45 nanometer on 300-mm wafers. The company also provides design support and complementary technical services. Integrated circuits (ICs) manufactured by the company are incorporated into a range of products in various markets, including consumer electronics, personal computers, communications, automotive, industrial and medical device products. Manufacturing Processes and Specialized Technologies The company manufactures ICs on silicon wafers, generally using the customer’s proprietary circuit designs. In some cases, the company uses third-party or its own proprietary design elements. The end product of the company’s manufacturing process is a silicon wafer containing multiple identical ICs. In most cases, the company’s customer assumes responsibility for dicing, assembly, packaging and testing. The company provides wafer fabrication services to fabless IC companies and IDMs, as sole source or second source; and enables smooth integration of the semiconductor design and manufacturing processes. The company manufactures using specialty process technologies, mostly based on CMOS process platforms with added features to enable special and unique functionality, improved size, performance and cost characteristics for analog and mixed-signal semiconductors. The company also offers process transfer services to integrated device manufacturers (IDMs) who wish to manufacture products using their own process and do not have sufficient capacity in their own fabs. The company’s process transfer services are also used by fabless companies that have proprietary process flows that they wish to manufacture at additional manufacturing sites for purposes of geographic diversity or require a new technology node. The company’s process services include development, transfer, and extensive optimization as defined by customer needs. With the company’s engineering team, well established transfer methodologies, and vast manufacturing experience, it offers production lines for core bulk CMOS and specialized technologies, such as RF SOI back-end-of-line (BEOL) magnetoresistive random access memory (MRAM), SiGe and MEMS, among others. The specific process technologies that the company focuses on include radio frequency CMOS (RF CMOS), CMOS image sensors (CIS), advanced analog CMOS,), radio frequency identification (RFID), bipolar CMOS (BiCMOS), silicon germanium (SiGe BiCMOS), high voltage CMOS, silicon-on-insulator (SOI) and power LDMOS. CMOS Image Sensors CMOS image sensors are ICs used to capture an image in various consumer, communications, medical, automotive and industrial market applications, including camera-equipped cell phones, digital still and video cameras, security and surveillance cameras and video game consoles. The company engages in the high-end sensor and applications specific markets, which include applications, such as high end video, high end photography, industrial machine vision, dental X-ray, medical X-ray, automotive sensors, security sensors and three dimensional sensors for entertainment and industrial applications. The company’s services include a range of turnkey solutions and services, including silicon proven pixels services, optical characterization of a CMOS process, patented stitching manufacturing technique and prototype packaging. The CMOS image sensors that the company manufactures deliver outstanding image quality for a spectrum of digital imaging applications. Following the acquisition of TPSCo, the company is offering even more advanced CMOS Image Sensor technology with technologies of 110nm on 200mm wafers and 65nm on 300mm wafers with pixel sizes down to 1.12 micron utilizing dual light pipe technology. Having this new technology, the company is offering its customers pixels for various new


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