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Last 5,048
Change Today -2.00 / -0.04%
Volume 210.7K
TSEM On Other Exchanges
Symbol
Exchange
NASDAQ GS
Tel Aviv
Stuttgart
As of 7:09 AM 09/3/15 All times are local (Market data is delayed by at least 15 minutes).
text size: T | T
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Company Description

Contact Info

Ramat Gavriel Industrial Park

20 Shaul Amor Avenue

PO Box 619

Migdal Haemek, 23105

Israel

Phone: 972 4 650 6611

Fax: 972 4 654 7788

Tower Semiconductor Ltd., an independent specialty foundry, manufactures semiconductors. The company manufactures semiconductors for its customers primarily based on third party designs. The company offers the process manufacture geometries of 0.35, 0.50, 0.55, 0.60, 0.80-micron and above on 150-mm wafers and 0.35, 0.18. 0.16, 0.13 and 0.11-micron on 200-mm wafers and 65 nanometer and 45 nanometer on 300-mm wafers. It also provides design support and complementary technical services. Integrated circuits (ICs) manufactured by the company are incorporated into a range of products in various markets, including consumer electronics, personal computers, communications, automotive, industrial and medical device products. Manufacturing Processes and Specialized Technologies The company manufactures ICs on silicon wafers, generally using the customer’s proprietary circuit designs. In some cases, the company uses third-party or its own proprietary design elements. The end product of the company’s manufacturing process is a silicon wafer containing multiple identical ICs. The company provides wafer fabrication services to fabless IC companies and integrated device manufacturers (IDMs), as sole source or second source, and enables smooth integration of the semiconductor design and manufacturing processes. The company manufactures using specialty process technologies. The company also offers process transfer services to IDMs who wish to manufacture products using their own process and do not have capacity in their own fabs. The company’s process services include development, transfer, and extensive optimization as defined by customer needs. The specific process technologies that the company focuses on include Complementary Metal Oxide Semiconductor (CMOS) image sensors (CIS), advanced analog CMOS, radio frequency CMOS (RF CMOS), RF identification, bipolar CMOS (BiCMOS), silicon germanium (SiGe BiCMOS), high voltage CMOS, silicon-on-insulator (SOI) and power LDMOS. CMOS Image Sensors The company engages in the high-end sensor and applications specific markets, which include applications, such as high end video, industrial machine vision, dental X-ray, medical X-ray automotive sensors and three dimensional sensors for entertainment and industrial applications. The company’s services include a range of turnkey solutions and services, including silicon proven pixels services, optical characterization of a CMOS process, patented stitching manufacturing technique and optical testing and packaging. Specifically, the company’s CIS portfolio includes pixels ranging from 1.12 micron up to 150 micron, all developed by it. The company provides both rolling shutter and global shutter pixels. The latter are used mainly in the industrial sensor and in the three dimensional sensors markets. The company’s advanced photo diode (APD) technology used in CMOS image sensors enables improved optical and electrical performance. In March 2014, the company acquired from Panasonic Corporation (Panasonic) 51% of a newly established company, TowerJazz Panasonic Semiconductor Co., Ltd., (TPSCo), that manufactures products for Panasonic and potentially other third parties, using Panasonic's three semiconductor manufacturing facilities located in Hokuriku Japan (Uozu E, Tonami CD and Arai E). For the X-ray market, the company offers its patented stitching technology on 0.18-micron process and various 15 to 150-micron pixels that are optimized for X-ray applications. In addition, the company offers this technology in TPSCo’s 300mm 65nm fab to create 1 die per wafer products. These pixels are used by the company’s customers in dental and other medical X-ray products. The company’s stitching technology enables semiconductor exposure tools to manufacture single ultra high-resolution CMOS image sensors containing millions of pixels at sizes far larger than their existing field. This technology is also used by the company in the manufacturing of large sensors (up to one die per wafer) on 8 inches and 12 inches wafers and high end large format sensors with special pixels that it has developed specifically for this market. RF CMOS The

 

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