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Last $19.93 USD
Change Today +1.32 / 7.09%
Volume 450.2K
TER On Other Exchanges
Symbol
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As of 9:59 AM 07/30/15 All times are local (Market data is delayed by at least 15 minutes).
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Company Description

Contact Info

600 Riverpark Drive

North Reading, MA 01864

United States

Phone: 978-370-2700

Fax:

Teradyne, Inc. operates as a supplier of automatic test equipment worldwide. The company designs, develops, manufactures, and sells automatic test systems and solutions used to test semiconductors, wireless products, hard disk drives (HDDs), solid state disks (SSDs) and circuit boards in the consumer electronics, wireless, automotive, industrial, computing, communications and aerospace and defense industries. The company’s automatic test equipment products and services include semiconductor test (Semiconductor Test) systems; wireless test (Wireless Test) systems; and defense/aerospace (Defense/Aerospace) test instrumentation and systems, storage test (Storage Test) systems, and circuit-board test and inspection (Production Board Test) systems (collectively these products represent System Test). In 2014, the company acquired Avionics Interface Technologies LLC (AIT), a supplier of equipment for testing data communication buses. The acquisition of AIT complements the company’s defense/aerospace line of bus test instrumentation for commercial and defense avionics systems. Segments Semiconductor Test This segment designs, manufactures, sells and supports Semiconductor Test products and services on a worldwide basis. The test systems the company provides are used both for wafer level and device package testing. These chips are used in automotive, industrial, communications, consumer, and computer and electronic game applications, among others. Semiconductor devices span a range of functionality, from very simple low-cost devices such as appliance microcontrollers, operational amplifiers or voltage regulators to complex digital signal processors, microprocessors, and high-density, as well as high-speed memory devices. Semiconductor Test products and services are sold to integrated device manufacturers (IDMs) that integrate the fabrication of silicon wafers into their business, Fabless companies that outsource the manufacturing of silicon wafers, Foundries that cater to the processing and manufacturing of silicon wafers, and outsourced semiconductor assembly and test providers (OSATs) that provide test and assembly services for the final packaged devices to both Fabless companies and IDMs. Fabless companies perform the design of integrated circuits (ICs) without manufacturing capabilities, and use Foundries for wafer manufacturing and OSATs for test and assembly. The company’s FLEX Test Platform architecture advances its core technologies to produce test equipment that is designed for multi-site testing. Multi-site testing involves the simultaneous testing of many devices and functions in parallel. FLEX Test Platform purchases are being made by IDMs, OSATs, Foundries and Fabless customers. The UltraFLEX-M tester extends the FLEX Test Platform into the High Speed DRAM testing market. The FLEX Test Platform has an installed base of approximately 4,400 systems. The company’s J750 test system shares the IG-XL software environment with the family of FLEX Test Platform systems. The J750 is designed to address the highest volume semiconductor devices, such as microcontrollers, that are central to the functionality of almost every consumer electronics product, from small appliances to automotive engine controllers. J750 test systems combine compact packaging, high throughput and ease of production test. The company extended the J750 platform technology to create the IP750 Image Sensor test system. The IP750 is focused on testing image sensor devices used in digital cameras and other imaging products. The company invests in the J750 platform with new instrument releases that bring new capabilities to existing market segments and expand the J750 platform to new devices that include high end microcontrollers and the latest generation of cameras. In 2013, the company introduced the J750 Ex-HD, which includes system enhancements and new high density instruments that enable the J750 test platform to provide higher test cell productivity. The J750 platform has an installed base of approximately 4,600 systems. The company’s Magnum platform addresses the requirements of mass production test of memory devices, such as f

 

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