Bloomberg Anywhere Login


Connecting decision makers to a dynamic network of information, people and ideas, Bloomberg quickly and accurately delivers business and financial information, news and insight around the world.


Financial Products

Enterprise Products


Customer Support

  • Americas

    +1 212 318 2000

  • Europe, Middle East, & Africa

    +44 20 7330 7500

  • Asia Pacific

    +65 6212 1000


Industry Products

Media Services

Follow Us

Last $0.46 SGD
Change Today 0.00 / 0.00%
Volume 124.6K
STAT On Other Exchanges
As of 11:09 PM 07/27/15 All times are local (Market data is delayed by at least 15 minutes).
text size: T | T
Back to Snapshot
Company Description

Contact Info

10 Ang Mo Kio Street 65

No 05-17/20 Techpoint

Singapore, 569059


Phone: 65 6824 7777

Fax: 65 6720 7829

STATS ChipPAC, Ltd. provides semiconductor packaging design, bump, probe, assembly, test, and distribution solutions. The company provides a range of semiconductor packaging and test solutions to a global customer base servicing the communications, computing, consumer, and industrial markets. Services The company’s services include Packaging services; Test services; and Pre-production and Post-production services. Packaging Services The company provides leaded, laminate, flip-chip, memory card, and wafer level chip-scale packages (CSPs) to customers with a range of packaging solutions and full backend turnkey services for various electronics applications. It also provides redistribution layers (RDL), integrated passive devices (IPD), and wafer bumping services for flip-chip and wafer level CSPs. Packaging serves to protect the semiconductor die and facilitate electrical connection and heat dissipation. As part of customer support on packaging services, the company also offers package design; electrical, mechanical and thermal simulation; and measurement and design of lead-frames, substrates, and wafer level integrations. The company’s two key types of packaging services include laminate and leaded. Laminate Packaging: Laminate substrate-based packaging is used primarily in computing platforms, networking, hand-held consumer products, wireless communications devices, personal digital assistants, video cameras, home electronic devices, such as digital video discs (DVDs), and game consoles. The company’s Ball Grid Arrays (BGAs) are typically used in semiconductors that require improved performance, including digital signal processors (DSPs), microprocessors and microcontrollers, application-specific integrated circuits (ASICs), field programmable gate arrays (FPGAs), memory, and PC chipsets. The company’s BGA typically have between 16 and 900 balls. 3D Packaging: Three-dimensional (3D) packaging provides a level of functional integration in package families, including BGAs and leadframe packages, by stacking dies, packages or a mix of both, and using a mix of assembly technologies, including wire bonding, flip chip, surface mounted passive components, and IPDs. The types of 3D packages are often characterized by how they are stacked, either as chips, packages or passives. Stacked die (SD) packages consist of bare die stacked and interconnected using wire bond and flip-chip connections in one standard package. 3D solutions include die level stacking of up to nine dies and package level stacking, such as Package-on-Package (PoP), Package-in-Package (PiP), and System-in-Package (SiP) technology that integrates various ICs or passives. Flip-chip: Flip-chip is an interconnect technology that provides a solution for applications requiring a smaller form factor, higher I/O and enhanced thermal and electrical performance. The company has a flip-chip portfolio encompassing single die, multi-die (MD), multi-package and thermally enhanced solutions. Flip-chip technology is used in an array of applications ranging from consumer products to ASICs, PC chipsets, graphics, and memory packages. The company supplies its customers with a range of advanced packaging solutions consisting of: Standard BGA: Standard BGA packaging has a grid array of balls on the underside of the IC, and is used in applications, like PC chipsets, graphic controllers and DSPs. A BGA generally has approximately 100 balls. Chip-scale: Chip-scale packaging includes all packages where the package is less than 1.2 times the size of the silicon die. Chip-scale BGA is a substrate-based package that is designed for memory devices and other medium pin count semiconductors and requires dense ball arrays in very small package sizes, like wireless telephones and mobile hand-held devices, video cameras, digital cameras, and pagers. SiP: SiP is a family of packages that contain various semiconductor dies along with passive components, such as resistors, capacitors and inductors in one package. Dies can either be stacked on top of each other or side by side. These packages are used in wireless handsets, consumer products, and mobile computing applicat


Stock Quotes

Market data is delayed at least 15 minutes.

Company Lookup
Recently Viewed
STAT:SP $0.46 SGD 0.00

STAT Competitors

Market data is delayed at least 15 minutes.

Company Last Change
Hana Microelectronics PCL 31.50 THB 0.00
Macronix International 4.53 TWD +0.06
Powertech Technology Inc 51.00 TWD +1.10
Shinko Electric Industries Co Ltd ¥836.00 JPY -13.00
Winbond Electronics Corp 6.14 TWD +0.17
View Industry Companies

Industry Analysis


Industry Average

Valuation STAT Industry Range
Price/Earnings NM Not Meaningful
Price/Sales 0.5x
Price/Book 0.8x
Price/Cash Flow NM Not Meaningful
TEV/Sales NM Not Meaningful

Sponsored Financial Commentaries

Sponsored Links

Report Data Issue

To contact STATS CHIPPAC LTD, please visit Company data is provided by Capital IQ. Please use this form to report any data issues.

Please enter your information in the following field(s):
Update Needed*

All data changes require verification from public sources. Please include the correct value or values and a source where we can verify.

Your requested update has been submitted

Our data partners will research the update request and update the information on this page if necessary. Research and follow-up could take several weeks. If you have questions, you can contact them at