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Last $4.26 USD
Change Today +0.06 / 1.43%
Volume 84.0K
SMI On Other Exchanges
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Exchange
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As of 8:04 PM 09/3/15 All times are local (Market data is delayed by at least 15 minutes).
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Company Description

Contact Info

No. 18 Zhangjiang Road

Pudong New Area

Shanghai, 201203

China

Phone: 86 21 3861 0000

Fax: 86 21 5080 2868

Semiconductor Manufacturing International Corporation provides integrated circuit (IC) foundry and technology services at 0.35-micron to 40-nanometer. The company has a 300mm wafer fabrication facility (fab) and a 200mm mega-fab in Shanghai, a 300mm mega-fab in Beijing, a 200mm fab in Tianjin, and a 200mm fab project under development in Shenzhen. In addition to wafer fabrication, its service offerings include a portfolio consisting of IC design libraries, circuit design blocks, design support, mask-making, wafer probing, and gold/solder bumping. The company also works with its partners to provide assembly and testing services. Products and Services Manufacturing of Wafers and Manufacturing Capacity The company manufactures silicon wafers based on proprietary designs provided by its customers or third party designers. Its factories manufacture various types of semiconductors, such as logic, (including basebands, microprocessors, DSPs, and application processors); mixed-signal and RF (for wired and wireless connectivity applications for communications and consumer electronics); high voltage (for display driver ICs, power supplies, power management, telecommunications, automotive electronics, and industrial controls); memory, (including standalone SRAM, EEPROM and Flash, and embedded NVM for IC cards to be used in transport, banking, social welfare, and national ID); CIS (CMOS Image Sensors that are used in a range of camera-related systems); and others (micro electrical and mechanical system (MEMS) and integrated passive devices). Integrated Solutions In addition to wafer fabrication, the company provides its customers with a range of complementary services, from circuit design support and mask-making to wafer level probing and testing. This range of services is supported by its network of partners that assist in providing design, probing, final testing, packaging, assembly, and distribution services. Design Support Services The company’s design support services provide its customers with access to the fundamental technology files and libraries that facilitate customers’ own IC design. It also offers design reference flows and accesses to its design center alliance, as well as layout services to its customers. In addition, the company collaborates with industry leaders in electronic design automation, library and IP (intellectual property) services to create a worldwide network of expertise, resources, and services that are available to its customers. Libraries and Intellectual Property As part of the fundamental building blocks for the company’s customers’ IC designs, it has a team of engineers who work with its research and development department to develop, license, or acquire from third parties selected key libraries and intellectual property so that its customers could design ICs that utilize its new process technologies. These include standard cell, I/O, memory compilers, embedded memory, high- speed interface, peripheral controllers, embedded processors, and others, using 0.35 micron down to 28 nanometer process technologies. They have been developed primarily through its third party alliances, as well as by its internal research and development team, to facilitate design and integration into the overall design system. The company’s library partners include ARM; Synopsys, Inc.; VeriSilicon; and InnoPower. Mask-making Services The company produces masks for other domestic and overseas fabs as a separate revenue- generating service. Its mask facility also offers mask repair services. Wafer Probing, Assembly, and Testing Services The company has its own probing facility in Shanghai that provides test program development, probe card fabrication, wafer probing, failure analysis, and failure testing. It also outsources these services to its partners. The company has established a network of partners that provide additional probing services, as well as assembly and testing services, to serve its customers. These partners include Amkor Assembly & Test (Shanghai) Co., Ltd. and ST Assembly Test Services Ltd. Customers The company’s customers include integrated device manufacturers, fabless semiconductor companies, and systems companies. Significant events In July 2014, Semiconductor Manufacturing International Corporation and Qualcomm Technologies Inc. have collaborated on 28nm process technology and wafer manufacturing services in China to manufacture Qualcomm Snapdragon processors. Qualcomm Technologies' Snapdragon processors are purpose built for mobile devices. In August 2014, Semiconductor Manufacturing International Corporation and Jiangsu Changjiang Electronics Technology Co., Ltd. jointly announced the formation of a joint venture for 12-inch bumping and related testing, from the previously signed joint venture agreement, which will be established in Jiangyin National High-Tech Industrial Development Zone (JOIND), in Jiangsu Province, China. In November 2014, Semiconductor Manufacturing International Corporation announced in terms of expansion, the company plans to expand Tianjin fab's production capacity to 42,000 8-inch wafers per month and Shenzhen is on track to reach 10,000 wafers per month installed capacity by year-end. Competition The company’s competitors include TSMC, UMC and Global Foundries. History Semiconductor Manufacturing International Corporation was founded in 2000 under the laws of the Cayman Islands.

 

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