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Last $1.31 USD
Change Today -0.01 / -0.76%
Volume 14.9K
QUIK On Other Exchanges
As of 5:10 PM 11/27/15 All times are local (Market data is delayed by at least 15 minutes).
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Company Description

Contact Info

1277 Orleans Drive

Sunnyvale, CA 94089

United States

Phone: 408-990-4000

Fax: 408-990-4040

QuickLogic Corporation develops and markets low power customizable semiconductor and software algorithm solutions. The company is a fabless semiconductor company that designs, markets, and supports primarily customer specific standard products (CSSPs), and secondarily, field programmable gate arrays (FPGAs), sensor software algorithms, software drivers, associated design software and programming hardware. The company’s CSSPs are customized semiconductor solutions created from its new solution platforms, including its ArcticLink III, ArcticLink II, ArcticLink, PolarPro 3, PolarPro II, PolarPro, and Eclipse II products (which comprise the company’s new product category); and its mature products primarily include the company’s pASIC 3, QuickRAM, and QuickPCI products, as well as programming hardware and design software. The company provides solutions by first architecting the solution jointly with its customer's or ecosystem partner’s engineering group, selecting the appropriate solution platform and proven system blocks (PSBs), providing custom logic, integrating the logic, programming the device with the PSBs and/or firmware, providing software drivers or application software required for the customer's application, and participating with the customer on-site during integration, verification and testing. The company offers its third generation solution platform family, ArcticLink III VX, which embeds its Visual Enhancement Engine (VEE)/DPO (Display Power Optimizer) technologies, as well as different combinations of low voltage differential signaling (LVDS) and/or mobile industry processor interface (MIPI). ArcticLink III VX combines mixed signal physical layers and hard-wired logic on one device. The company also offers its fourth generation solution platform family, ArcticLink III BX. The BX family is identical to the VX family with the exception of the VEE/DPO technologies. The BX family was introduced to provide customers with the ability to adopt needed display bridge requirements while evaluating the benefits of the company’s VEE/DPO technologies. During 2013, the company introduced two new silicon platform families, both of which are based on its new static random access memory (SRAM) reprogrammable logic technology. The first was PolarPro 3, an ultra-low power FPGA family from which the company intends to create CSSPs for the mobile market. The second was the ArcticLink 3 S1 silicon platform family, which is the company’s first family intended to implement sensor hub solutions. During 2013, the company also announced two Catalog CSSPs, a sensor data buffer solution from the PolarPro 3 family, and an always-on, context aware sensor hub from the ArcticLink 3 S1 family. The company continues to use the PolarPro 3 family as a vehicle for developing CSSPs in the mobile market that require reprogrammability. In 2014, the company introduced two silicon platform families. The first is PolarPro 3E, which is also based on its SRAM reprogrammable logic technology. The company intends to use this family to create CSSPs for the mobile market. The second is the ArcticLink 3 S2 silicon platform family, its second generation sensor hub. This silicon platform is an integrated sensor hub solution that reduces power consumption by approximately 50% from its first generation sensor hub, ArcticLink 3 S1. In 2015, the company formally introduced its sensor software algorithms to the market as the SenseMe Sensor Software Library. This library is designed to deliver always-on context awareness at low power optimized for the ArcticLink 3 S2 silicon platform family, as well as the company’s roadmap of sensor hub silicon platforms. The company’s PolarPro 3E, PolarPro 3, PolarPro II, and PolarPro solution platforms include a logic cell architecture, which enables the company to deliver twice the programmable logic in the same die size. The company’s ArcticLink II and ArcticLink solution platforms combine mixed signal physical layers and hard-wired logic alongside programmable logic. The company’s ArcticLink III solution platform is manufactured on an advanced process node. In addition to working directly with the compan

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