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Company Description

Contact Info

1277 Orleans Drive

Sunnyvale, CA 94089

United States

Phone: 408-990-4000

Fax: 408-990-4040

QuickLogic Corporation develops and markets low power customizable semiconductor and software algorithm solutions. The company’s solutions primarily target smartphones, wearable devices, tablets, and the Internet-of-Things (IoT). The company is a fabless semiconductor provider of sensor processing solutions, ultra-low power display bridges, and ultra-low power field programmable gate arrays (FPGAs). Its solutions are created from its silicon platforms, including its EOS, ArcticLink III, PolarPro 3, PolarPro II, PolarPro, and Eclipse II products (which comprise its new product category), its mature products, which are produced on semiconductor processes larger than 180 nanometers, primarily include its pASIC 3 and QuickRAM, as well as royalty revenue, programming hardware and design software. Its sensor algorithm software includes its SenseMe software library. The company provides solutions by first architecting the solution jointly with its customer's or ecosystem partner’s engineering group, selecting the appropriate solution platform and proven system blocks (PSBs), providing custom logic, integrating the logic, programming the device with the PSBs and/or firmware, providing software drivers or application software required for the customer's application, and participating with the customer on-site during integration, verification and testing. The company offers its third generation silicon platform family, ArcticLink III VX, which embeds its Visual Enhancement Engine (VEE)/DPO (Display Power Optimizer) technologies, as well as different combinations of low voltage differential signaling (LVDS) and/or mobile industry processor interface (MIPI). ArcticLink III VX combines mixed signal physical functions and hard-wired logic on one device. The company also offers its fourth generation solution platform family, ArcticLink III BX. The BX family is identical to the VX family with the exception of the VEE/DPO technologies. The BX family was introduced to provide customers with the ability to adopt needed display bridge requirements while evaluating the benefits of the company’s VEE/DPO technologies. During 2013, the company introduced two new silicon platform families, both of which are based on its static random access memory (SRAM) reprogrammable logic technology. The first was PolarPro 3, an ultra-low power FPGA family from which the company creates solutions for the mobile market. The second was the ArcticLink 3 S1 silicon platform family, which is the company’s first family intended to implement sensor hub solutions. In 2014, the company introduced two silicon platform families. The first is PolarPro 3E, which is also based on its SRAM reprogrammable logic technology. The company intends to use this family to create CSSPs for the mobile market. The second is the ArcticLink 3 S2 silicon platform family, its second generation sensor hub. This silicon platform is an integrated sensor hub solution that reduces power consumption by approximately 50% from its first generation sensor hub, ArcticLink 3 S1. In 2015, the company formally introduced its sensor software algorithms to the market as the SenseMe Sensor Software Library. This library is designed to deliver always-on context awareness at low power optimized for the EOS S3 and ArcticLink 3 S2 silicon platform families, as well as the company’s roadmap of sensor processing system-on-a-chip platforms. The company’s PolarPro 3E, PolarPro 3, PolarPro II, and PolarPro solution platforms include a logic cell architecture, which enables the company to deliver twice the programmable logic in the same die size. The company’s EOS S3 and ArcticLink 3 silicon platforms combine mixed signal physical functions and hard-wired logic alongside programmable logic. The company’s EOS S3 and ArcticLink III solution platforms are manufactured on an advanced process node where it could benefit from smaller die sizes. In addition to working directly with its customers, the company partners with other companies that are experts in certain technologies to develop additional intellectual property, reference platforms and system software to provide application solutions. I

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