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Last €14.84 EUR
Change Today -0.30 / -1.98%
Volume 345.0
ORB On Other Exchanges
Symbol
Exchange
Frankfurt
As of 1:36 PM 08/31/15 All times are local (Market data is delayed by at least 15 minutes).
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Company Description

Contact Info

7 Sanhedrin Boulevard

North Industrial Zone

Yavne, 81101

Israel

Phone: 972 8 942 3533

Fax: 972 8 943 8769

range of the company’s FPD-AOI systems by employing high resolution optics and specific algorithms to achieve inspection capabilities required for intricate mobile devices, thus expanding the scope of inspection solutions that the company is able to offer to manufacturers of LCDs, OLEDs, and MEMS displays intended for use in mobile devices. In addition, the company offers complementary features to its FPD-AOI systems that include multi modality classification, mobile and large displays peripheral inspection, variable pattern inspection, advanced video classification (AVC), in-scan classification (ISC), digital macro (DM) inspection, and critical dimension and overlay measurement (CDO). Peripheral Inspection provides full inspection coverage of the non-repetitive pattern of the peripheral area of the panel and features a setup. AVC and ISC both employ scan and microscopic review to enable the automatic classification of defects identified by the company’s FPD-AOI systems during the scanning process. DM inspection and warning are optional add-on features, which obviate the need for manufacturers to purchase a separate macro inspection system. CDO is an optional add-on feature, which enables the measurement of critical elements on the glass panel, such as conductor widths and layer to layer registration. FPD Test The ArrayChecker test systems detect, locate, quantify and characterize electrical, contamination and other defects in active matrix LCD and OLED after array fabrication. These systems use proprietary non-contact voltage imaging technology to provide a high-resolution voltage map of the entire display and proprietary image analysis software, which converts this voltage map into complete pixel defect data. The ArrayChecker test systems determine whether individual pixels or lines of pixels are functional and also identify various subtle defects, such as variations in individual pixel voltage. These defect data files are then used for repair and statistical process control. The company’s new model, ArrayCheckers, supports the advanced small pixel panel designs used for high resolution smartphones and tablets, as well as various OLED panels. FPD Repair The ArraySaver repair systems utilize multiple wavelength laser technology to repair ‘short’ defects in FPDs during and after array fabrication. These systems could use defect data files downloaded from any test and inspection systems to position the panel for repair automatically, thereby saving time, which would otherwise be spent by operators in locating defects. The repair automation function has been further upgraded by the introduction of the Parallel Repair System, which simplifies operator interaction with the system and improves repair tool capacity. Yield Management Systems The company’s EYES-2020 offers an improved process monitoring system providing defect data analysis. It enables process control and improves yields by automatically counting, accumulating and analyzing AOI-generated defect data. SD Applications and Products The company’s SD products include etch, deposition and thermal processing equipment designed to facilitate the advanced packaging of semiconductors and to provide advanced wafer processing technologies for the micro-electronics industry. End-market applications include Advanced Packaging, MEMS, light emitting diodes, high speed radio frequency device ICs and power semiconductors. Advanced Packaging Advanced Packaging refers to semiconductor packaging that employs bumps or Through Silicon Vias (TSVs) (rather than wire-bonding technology) to connect the die to the substrate. The company operates in various segments of Advanced Packaging, such as bumping; 3D wafer level packaging; 2.5 and 3D; and fan out wafer level packaging/embedded chips. 3D wafer level packaging (3DWLP) is used for small, low input/output devices, such as image and fingerprint sensors, and in MEMS devices. In 3DWLP, a TSV connection is made through the silicon wafer from the back of the substrate, to achieve a small form factor. The company serves the 3DWLP segment with PVD, CVD, and etch equipment. In 2.5D, or ‘interposer’ technol

 

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