Micron Technology, Inc., together with its subsidiaries, provides advanced semiconductor systems worldwide. The company’s portfolio of high-performance memory technologies, including DRAM, NAND Flash, and NOR Flash, is the basis for solid-state drives (SSDs), modules, multi-chip packages (MCPs), and other system solutions. The company’s memory solutions enable the computing, consumer, enterprise storage, networking, mobile, embedded, and automotive applications. The company markets its products through its internal sales force, independent sales representatives and distributors primarily to original equipment manufacturers (OEMs) and retailers located worldwide. Segments The company’s four business units include: Compute and Networking Business Unit (CNBU): This segment includes memory products sold to the compute, networking, graphics and cloud server markets. Storage Business Unit (SBU): This segment includes memory products sold into enterprise, client, cloud, and removable storage markets. SBU also includes products sold to Intel Corporation (Intel) through its IM Flash Technologies, LLC (IMFT) joint venture. Mobile Business Unit (MBU): This segment includes memory products sold into smartphone, tablet, and other mobile-device markets. Embedded Business Unit (EBU): This segment includes memory products sold into automotive, industrial, connected home, and consumer electronics markets. Products DRAM DRAM products are high-density, random access memory devices that provide high-speed data storage and retrieval. DDR3 and DDR4 DRAM are standardized, high-density, high-volume, DRAM products, which offer high speed and high bandwidth. DDR3 and DDR4 products are primarily targeted at computers, servers, networking devices, communications equipment, consumer electronics, automotive, and industrial applications. In 2016, the company offered DDR3 and DDR4 products in 1Gb to 8Gb densities. LPDRAM (Mobile Low-Power DRAM) products offer lower power consumption relative to other DRAM products and are used primarily in smartphones, tablets, automotive applications, laptop computers, and other mobile consumer devices that require low power consumption. The company offers DDR4, DDR3, DDR2, and DDR versions of LPDRAM. The company also offers other DRAM products targeted to specialty markets, including DDR2 DRAM, DDR DRAM, GDDR5 and GDDR5X DRAM, SDRAM, and RLDRAM. These products are used primarily in networking devices, servers, consumer electronics, communications equipment, computer peripherals, automotive and industrial applications, and computer memory upgrades. The company offers Hybrid Memory Cube (HMC) products, which are semiconductor memory devices where vertical stacks of DRAM die that are connected using through-silicon-via interconnects are placed above a small, high-speed logic layer. HMC is targeted primarily at networking and high performance computing applications. Non-Volatile Memory Non-Volatile Memory includes NAND Flash and 3D XPoint memory. Through 2016, substantially all of the company’s Non-Volatile Memory sales were from NAND Flash products. NAND Flash products are electrically re-writeable, non-volatile semiconductor memory devices that retain content when power is turned off. NAND Flash is ideal for mass-storage devices. Embedded NAND Flash-based storage devices are utilized in smartphones, SSDs, tablets, computers, automotive and industrial applications, networking, and other consumer applications. Removable storage devices, such as USB and Flash memory cards, are used with applications, such as PCs, digital still cameras, and smartphones. The company’s NAND Flash products feature a small cell structure that enables higher densities for demanding applications. It offers high-speed single-level cell (SLC), multi-level cell (MLC), and triple-level cell (TLC) planar NAND Flash products that are compatible with advanced interfaces in 1Gb to 128Gb densities. MLC and TLC products have two and three times, respectively, the bit density of SLC products. In 2016, the company began selling commercial volumes of new products featuring its new 3D NAND Flash technology, wh
micron technology inc
(MU:Consolidated Issue Listed on NASDAQ Global Select )
8000 South Federal Way
Boise, ID 83716
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