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Company Description

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4650 Cushing Parkway

Fremont, CA 94538

United States

Phone: 510-572-0200


Lam Research Corporation operates as a supplier of wafer fabrication equipment and services to the semiconductor industry worldwide. The company designs, manufactures, markets, refurbishes, and services semiconductor processing systems that are used in the fabrication of integrated circuits (ICs). The company's products are designed to help its customers build devices that are used in various electronic products, including mobile phones, wearables, tablets, computers, automotive devices, storage devices, and networking equipment. The company's products are used primarily in front-end wafer processing, which involves the steps that create the active components of a device (transistor, capacitor) and their wiring (interconnect). It also addresses processes for back-end wafer-level packaging (WLP), which is an alternative to traditional wire bonding and could offer a smaller form factor, increased interconnect speed and bandwidth, and lower power consumption, among other benefits. In addition, the company’s products are suited for related markets that rely on semiconductor processes and require production-proven manufacturing capability, such as micro-electromechanical systems (MEMS). Products Thin Film Deposition Copper Metal Films—SABRE Product Family Electrofill technology is designed to provide high-throughput, void-free fill with superior defect density performance for advanced technology nodes. SABRE chemistry packages provide fill performance for low defectivity, wide process window, and high rates of bottom-up growth to fill the most challenging HAR features. System capabilities include deposition of copper directly on various liner materials, important for next-generation metallization schemes. The number of yielding ICs per wafer is optimized by increasing the usable die area through process edge exclusion engineering. Applications include copper deposition for both advanced logic and memory interconnect. The company also offers the SABRE 3D system to address TSV and WLP applications, such as copper pillar, RDL, high-density fanout, underbump metallization, bumping, and microbumps used in post-TSV processing. Tungsten Metal Films—ALTUS Product Family The company's ALTUS systems deposit conformal atomic layer films for advanced tungsten metallization applications. The patented Multi-Station Sequential Deposition (MSSD) architecture enables a nucleation layer to be formed using Pulsed Nucleation Layer (PNL) technology and bulk CVD fill to be performed in the same chamber (in situ). PNL, the company’s ALD technology, is used in the deposition of tungsten nitride films to achieve high step coverage with reduced thickness relative to conventional barrier films. PNL is also used to reduce thickness and alter CVD bulk fill grain growth, lowering the overall resistivity of thin tungsten films. The advanced ExtremeFill CVD tungsten technology provides extendibility to fill the most challenging structures at advanced technology nodes. Applications include tungsten plug and via fill, 3D NAND wordlines, low-stress composite interconnects, and tungsten nitride barrier for via and contact metallization. PECVD Dielectric Films—VECTOR Product Family The VECTOR family of PECVD and ALD systems delivers advanced thin film quality, wafer-to-wafer uniformity, productivity, and low cost of ownership. The MSSD architecture combines the required film performance with both sequential and parallel processing to provide flexibility for a range of applications. VECTOR products include specialized systems for logic and memory applications with multiple platform options. VECTOR Express offers a small footprint with four processing stations. VECTOR Excel is a modular tool for advanced technology nodes where pre-and-post film deposition treatments are needed. VECTOR Extreme accommodates up to 12 processing stations for high-throughput applications. VECTOR Q accommodates approximately 16 processing stations for depositing multi-stack films. Applications include deposition of oxides, nitrides, and carbides for hardmasks, multiple patterning films, anti-reflective layers, multi-layer stack films, and diffusion barriers.


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Valuation LRCX Industry Range
Price/Earnings 17.7x
Price/Sales 2.5x
Price/Book 2.5x
Price/Cash Flow 16.2x
TEV/Sales 0.6x

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