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Last $65.68 USD
Change Today +1.24 / 1.92%
Volume 2.3M
LRCX On Other Exchanges
As of 8:10 PM 10/2/15 All times are local (Market data is delayed by at least 15 minutes).
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Company Description

Contact Info

4650 Cushing Parkway

Fremont, CA 94538

United States

Phone: 510-572-0200


Lam Research Corporation offers wafer fabrication equipment and services to the semiconductor industry. The company designs, manufactures, markets, refurbishes, and services semiconductor processing systems that are used in the fabrication of integrated circuits. The company’s products are designed to help its customers build the smaller, faster, and more power-efficient devices that are used in various electronic products, including cell phones, tablets, computers, storage devices, and networking equipment. The company’s customer base includes semiconductor memory, foundry, and integrated device manufacturers (IDMs) that make products, such as DRAM, NAND memory, and logic devices. Its products are used primarily in front-end wafer processing, which involves the steps that create the active components of a device (transistor, capacitor) and their wiring (interconnect). The company addresses processes for back-end wafer-level packaging (WLP). Its thin film deposition systems form a device’s sub-microscopic layers of conducting (metal) or insulating (dielectric) materials. The company’s wet spin clean and plasma-based bevel clean products remove particles, residues and film from the wafer surface before or after adjacent processes. The company offers a range of services to deliver value throughout the lifecycle of its equipment, including customer service, spares, upgrades, and refurbishment of its deposition, etch, and clean products. Products Thin Film Deposition Copper Metal Films — SABRE Product Family Electrofill technology provides void-free fill with defect density performance for advanced technology nodes. SABRE chemistry packages provide fill performance for the lowest defectivity, process window, and highest rates of bottom-up growth to fill the most challenging HAR features. The company offers the SABRE 3D system to address (TSV) and WLP applications, such as copper pillar, RDL, high-density fanout, through-silicon via underbump metallization, bumping, and microbumps used in post-TSV processing. Tungsten Metal Films — ALTUS Product Family The company’s ALTUS systems deposit highly conformal atomic layer films for advanced tungsten metallization applications. The patented Multi-Station Sequential Deposition architecture enables a nucleation layer to be formed using Pulsed Nucleation Layer (PNL) technology and bulk chemical vapor deposition (CVD) fill to be performed in the same chamber (in situ). PNL, the company’s atomic layer deposition technology, is used in the deposition of tungsten nitride films to achieve high step coverage with reduced thickness relative to conventional barrier films. Applications include tungsten plug and via fill, 3D NAND wordlines, low-stress composite interconnects, and tungsten nitride barrier for via and contact metallization. Plasma-enhanced CVD (PECVD) Dielectric Films — VECTOR Product Family The VECTOR family of PECVD and atomic layer deposition systems delivers wafer-to-wafer uniformity, productivity, and low cost of ownership. VECTOR products include specialized systems for logic and memory applications with multiple platform options. VECTOR Express offers a small footprint with four processing stations. VECTOR Excel is a modular tool for technology nodes where pre-and-post film deposition treatments are needed. VECTOR Extreme accommodates up to 12 processing stations for high-throughput applications. VECTOR Q accommodates up to 16 processing stations for depositing multi-stack films. Applications include deposition of oxides, nitrides, and carbides for hardmasks; multiple patterning films; anti-reflective layers; multi-layer stack films; and diffusion barriers. Gapfill Dielectric Films — SPEED Product Family The SPEED HDP-CVD products provide void-free gapfill of dielectric films. The source design provides particle performance, while the ability to customize the deposition and in situ etching profile ensures best-of-breed across-wafer thickness and gapfill uniformity. Applications include shallow trench isolation (STI), pre-metal dielectrics, inter-layer dielectrics, inter-metal dielectrics, and passivation layers. Film Treatment — SOL


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