Inphi Corporation provides high-speed analog and mixed signal semiconductor solutions for the communications, datacenter, and computing markets. The company’s semiconductor solutions are designed to address bandwidth bottlenecks in networks, improve throughput, and minimize latency in computing environments and enable the rollout of next generation communications, datacenter, and computing infrastructures. Its solutions provide a high-speed interface between analog signals and digital information in high-performance systems, such as telecommunications transport systems, enterprise networking equipment, datacenters and enterprise servers, storage platforms, test and measurement equipment, and military systems. The company provides 40G and 100G high-speed analog semiconductor solutions for the communications market and high-speed memory interface solutions for the computing market. The company has ongoing, informal collaborative discussions with industry and technology leaders, such as Advanced Micro Devices, Inc.; Alcatel-Lucent; ARM Ltd.; Ciena Corporation (Ciena); Cisco Systems, Inc. (Cisco); Huawei Technologies Co., Ltd. (Huawei); Juniper Networks Inc. (Juniper); Intel Corporation; Micron Technology, Inc.; Samsung; and SK Hynix Inc. to design architectures and products that solve bandwidth bottlenecks in existing and next generation communications and computing systems. The company’s products are designed into systems sold by original equipment manufacturers (OEMs), including Alcatel-Lucent, Ciena, Cisco, Dell Inc., EMC Corporation, Hewlett-Packard Company, Huawei, International Business Machines Corporation, Juniper, and Oracle Corporation. The company sells both directly to these OEMs and to other intermediary systems or module manufacturers that, in turn, sell to these OEMs. Products The company’s products address bandwidth bottlenecks throughout the network communications and computing infrastructure markets – from ‘fiber to memory’. Its products find application in devices, such as dense wavelength division multiplexers that enable core and aggregation networks, as well as less complex optical interface links within data center communication infrastructures. In addition, the company’s high-speed memory interface products could be found in servers where they allow CPUs to utilize available memory resources. As of December 31, 2013, the company had a range of product portfolio, including products that have commercially shipped, products for which it has shipped engineering samples and products under development, which perform a range of functions, such as amplifying, encoding, multiplexing, demultiplexing, retiming and buffering data and clock signals at speeds approximately 100 gigabits per second. These products are major enablers for servers, routers, switches, storage, and other equipment that process, store, and transport data traffic. The company introduced 20 new products in 2013. It designs and develops its products for the communications and computing markets, which have two to three year design cycles, and product life cycles as long as five years or more. Customers The company sells its products directly to OEMs and indirectly to OEMs through module manufacturers, original design manufacturers, and sub-systems providers. It works with technology leaders, including microprocessor, memory vendors, communications equipment, and optical module companies, to design architectures and products that help solve bandwidth bottlenecks in and between systems. In the server market, the company works with major CPU manufacturers to address the bottleneck between the CPU and the increasing amount of memory attached to it. Its sales into these servers are to memory module companies, including Micron, Samsung, SK Hynix Inc., and others. During the year ended December 31, 2013, the company sold its products to approximately 160 customers. Sales and Marketing The company sells its products worldwide through multiple channels, including its direct sales force and a network of sales representatives and distributors. It operates direct sales offices in Japan, Korea, Singapore, and the United States. Research and Development In 2013, the company’s research and development expenses were $50.5 million. Intellectual Property As of December 31, 2013, the company had 38 issued and allowed patents in the United States and other patent applications pending in the United States. The 38 issued and allowed patents in the United States expire in the years beginning in 2021 through 2029. Competition The company’s major competitors include Broadcom Corporation; Hittite Microwave Corporation; Integrated Device Technology, Inc.; M/A-COM Technology Solutions Inc.; Semtech Corp.; Triquint Semiconductor; and Texas Instruments Incorporated. History The company was incorporated in Delaware in 2000. It was formerly known as TCom Communications, Inc. and changed its name to Inphi Corporation in 2001.
inphi corp (IPHI:New York Consolidated)
2953 Bunker Hill Lane
Santa Clara, CA 95054
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