Applied Materials, Inc. provides manufacturing equipment, services and software to the semiconductor, display, solar photovoltaic (PV) and related industries worldwide. Segments The company operates in four segments: Silicon Systems, Applied Global Services, Display, and Energy and Environmental Solutions. Silicon Systems segment This segment develops, manufactures and sells a range of manufacturing equipment used to fabricate semiconductor chips, also referred to as integrated circuits (ICs). This segment includes semiconductor capital equipment for deposition, etch, ion implantation, rapid thermal processing (RTP), chemical mechanical planarization (CMP), metrology and inspection, and wafer packaging. The majority of the company’s new equipment sales are to major integrated device manufacturers and foundries worldwide. Transistor and Interconnect The company’s transistor and interconnect products and technologies have enabled multiple generations of device scaling from planar transistors to 3D multi-gate FinFET transistors. The company offers products and technologies for transistor and interconnect fabrication, including epitaxy, ion implantation, oxidation and nitridation, RTP, chemical vapor deposition (CVD), physical vapor deposition (PVD), CMP and electrochemical deposition (ECD). Majority of these process steps are used multiple times throughout the semiconductor chip fabrication process. Epitaxy: Epitaxial silicon (epitaxy or epi) is a layer of pure silicon grown in a uniform crystalline structure on the wafer to form a base for the device circuity. Epi technology is used in various IC devices in both the wafer surface and transistor areas of a chip to improve speed. Ion Implant: Ion implantation is a key technology for forming transistors and is used various times during chip fabrication. During ion implantation, wafers are bombarded by a beam of electrically-charged ions, called dopants, which change the electrical properties of the exposed surface films. Oxidation/Nitridation: The company’s systems provide critical oxidation steps, such as memory gate oxide, shallow trench isolation and liner oxide, for advanced device scaling. RTP: RTP is used primarily for annealing, which modifies the properties of deposited films. The company’s single-wafer RTP systems are also used for improving oxide and oxynitride films. PVD: PVD is used to deposit metal films with low resistivity for contact and interconnect devices. Applications include metal gate, silicides, contact liner/barrier, interconnect copper barrier seed and metal hard mask. CVD: CVD is used to deposit dielectric and metal films on a wafer. During the CVD process, gases that contain atoms of the material to be deposited react on the wafer surface, forming a thin film of solid material. CMP: CMP is used to planarize a wafer surface, a process that allows subsequent photolithography patterning and material deposition steps to occur with greater accuracy, resulting in uniform film layers with minimal thickness variations. ECD: ECD is a process by which metal atoms from a chemical fluid (an electrolyte) are deposited on the surface of an immersed object. The company’s products include Centura RP Epi; VIISta Systems; Vantage, Radiance and Centura Systems; Vantage Systems; Endura Systems; Endura and Centura Systems; Reflexion Systems; and Raider Platform. Patterning and Packaging The company offers patterning and packaging products and systems that enable the transfer of patterns onto device structures, making it possible to etch masks used for photolithography, and perform deposition, etching, and related processes. These systems and technologies address requirements resulting from shrinking pattern dimensions and the complexity in vertical stacking found in various advanced semiconductor devices. Atomic Layer Deposition (ALD): ALD technology enables customers to fabricate thin films of either conducting or insulating material with uniform coverage in nanometer-sized structures. CVD: CVD is used to deposit dielectric and metal films on a wafer. During the CVD process, gases that contain atoms of the materia
applied materials inc (AP2:Munich)
3050 Bowers Avenue
PO Box 58039
Santa Clara, CA 95052
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