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Last $5.19 USD
Change Today -0.06 / -1.14%
Volume 990.6K
AMKR On Other Exchanges
As of 8:10 PM 02/11/16 All times are local (Market data is delayed by at least 15 minutes).
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Company Description

Contact Info

2045 East Innovation Circle

Tempe, AZ 85284

United States

Phone: 480-821-5000

Fax: 480-821-8276

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services. The company’s packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology employed, size, thickness and electrical, mechanical and thermal performance. The company provides turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, test, and drop shipment services. Packaging and Test Services The packaging and test services the company provides occur subsequent to wafer fabrication. The wafers that the company receives from its customers are consigned to the company. Packaging and Test Technologies and Processes The company’s packages employ wirebond, flip chip and copper clip interconnect technologies. The company uses leadframe and substrate package carriers, and the company performs various test services. Interconnect Technologies Wirebond: In packages that employ wirebond interconnect technology, the die is mounted face up on the package carrier and the interconnections between the die and package carrier are made through very fine gold, silver or copper wires which are attached from the bond pads of the die to the package carrier. Flip Chip: In packages that employ flip chip interconnect technology, the interconnections between the die and package carrier are made through conductive ‘bumps’ that are placed directly on the die surface utilizing a process called wafer bumping. The bumped die is then ‘flipped over’ and placed face down, with the bumps connecting directly to the package carrier. Flip chip allows a higher number of interconnects than wirebond as it uses the entire surface area of the die, and sometimes the perimeter as well, instead of just the perimeter as used by most wirebond packages. Flip chip also provides enhanced thermal and electrical performance, and enables smaller die and thinner, smaller form factors (or physical package dimensions). The wafer bumping process consists of preparing the wafer for bumping and forming or placing the bumps. Preparation include cleaning, removing insulating oxides and providing a pad metallurgy that would protect the interconnections while making good mechanical and electrical connection between the bump and the wafer. Copper Clip: Copper clip interconnect technology uses a solid copper bridge or ‘clip’ to connect the die to the package carrier. The clip allows a higher level of flow than a wire and also provides a better method of heat transfer from the die. The clip is either spot welded, or more often re-flow soldered, to the die pads and the package carrier pads. Package Carriers Leadframe: A leadframe is a miniature sheet of metal, generally made of copper and silver alloys, on which a pattern of electrical connections (or leads) has been cut. The leads are placed around the perimeter of the leadframe and are used to connect the package to the system board. Substrate: A substrate is a laminate of multiple layers of epoxy resin, woven glass fibers and metal conductors. Bumps provide the electrical connection to the system board. The bumps are distributed evenly across the bottom surface of the substrate (called a ball grid array’ format). This allows greater distance between individual leads and a higher number of interconnects than leadframe packages. Test Services The company provides a complete range of semiconductor testing services including wafer testing or probe and final test. The company offers a range of test software, hardware, integration and product engineering services, and the company supports a range of business models and test capabilities. Wafer Test Services: The company offers a range of wafer test coverage that can be modified based on the cost and complexity of the die, the package and the product. These services range from coarse level screening for major defects all the way up to probing at high digital speeds and can include full radio frequency transmit and receive as well as testing at multiple temperatures. Final Test Services: After the packaging process


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