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Last $18.77 USD
Change Today 0.00 / 0.00%
Volume 0.0
As of 8:10 PM 11/30/15 All times are local (Market data is delayed by at least 15 minutes).
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Company Description

Contact Info

3050 Bowers Avenue

PO Box 58039

Santa Clara, CA 95052

United States

Phone: 408-727-5555

Fax: 408-748-9943

for FinFET and 3D NAND fabrication, including the Applied Producer XP Precision CVD system released in 2014. Copper Interconnect Encapsulation Solutions — In 2014, the company introduced its Endura Volta CVD Cobalt system for encapsulating copper interconnects in logic chips smaller than the 28nm node. Epitaxial Deposition — Epitaxial silicon (epitaxy or epi) is a layer of pure silicon grown in a uniform crystalline structure on the wafer to form a high quality base for the device circuitry. The Applied Centura Epi system integrates pre- and post-epi processes on the same system to improve film quality and reduce production costs. Polysilicon Deposition — The Applied Centura Polygen LPCVD system is a single-wafer, multi-chamber product that deposits thin polysilicon films at high temperatures to create transistor gate structures. Tungsten Deposition — The company has two products for depositing tungsten: the Applied Centura Sprint Tungsten CVD system and the Applied Centura iSprint ALD/CVD system which provide tungsten filling capability to 20nm and below. Electrochemical Deposition Electrochemical Deposition is a process by which metal atoms from a chemical fluid (an electrolyte) are deposited on the surface of an immersed object. Physical Vapor Deposition Physical Vapor Deposition is a physical process in which atoms of a gas, such as argon, are accelerated toward a metal target. The Applied Endura PVD system offers various advanced metal deposition processes, including aluminum, aluminum alloys, cobalt, titanium nitride, tantalum/tantalum nitride, tungsten/tungsten nitride, nickel, vanadium and copper. The Applied Endura CuBS (copper barrier/seed) PVD system is used by customers for fabricating copper-based chips. The Applied Endura CuBS RFX PVD system extends CuBS technology to the 2Xnm node. The Applied Endura Avenir RF PVD system sequentially deposits the multiple metal film layers that form the heart of the metal gate transistors. The Applied Endura iLB PVD/CVD system enables customers to shrink their speed-critical contact structures for 20nm and below devices. In 2014, the company introduced the Endura Ventura PVD system, incorporating the PVD technologies. Endura system also has been used in back-end applications to deposit metal layers before final bump or wire bonding packaging steps are performed. Etch The company offers systems for etching dielectric, metal, and silicon films to meet the requirements of advanced processing. The system also saves on power, water and gas consumption, helping customers to lower operating costs and support their sustainable manufacturing initiatives. Rapid Thermal Processing The Applied Centura RadiancePlus and Applied Vantage RadOx RTP systems feature advanced RTP technology with differing platform designs. The company’s RTP systems address the critical need for controlling wafer temperature to increase chip performance and yield. Ion Implantation The company offers a line of single-wafer ion implantation equipment that covers the entire energy and range required to manufacture advanced devices. The VIISta 3000XP implanter delivers the angle precision required for advanced high-energy applications, while the VIISta 900XP implanter provides medium precision doping. Chemical Mechanical Planarization The Chemical Mechanical Planarization process removes material from a wafer to create a flat (planarized) surface. Its CMP product, the Applied Reflexion LK Prime, is a critical enabler for FinFET gate and 3D NAND staircase structures. Metrology and Wafer Inspection The company offers various products for locating, measuring and analyzing defects and features on the wafer during various stages of the fabrication process. Wafer Inspection — The Applied UVision 6 wafer inspection system detects yield-limiting defects in the critical patterning layers of logic and memory devices. Mask Making The company provides systems for etching and inspecting masks. Its Tetra systems have been used by mask makers worldwide to etch the majority of high-end masks, including 28nm/14nm nodes. Applied Global Services segment T


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