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Last $18.45 USD
Change Today +0.07 / 0.38%
Volume 12.4M
AMAT On Other Exchanges
Hong Kong
As of 8:10 PM 11/25/15 All times are local (Market data is delayed by at least 15 minutes).
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Company Description

Contact Info

3050 Bowers Avenue

PO Box 58039

Santa Clara, CA 95052

United States

Phone: 408-727-5555

Fax: 408-748-9943

Applied Materials, Inc. provides manufacturing equipment, services and software to the semiconductor, flat panel display, solar photovoltaic (PV) and related industries. Segments The company operates in four segments: Silicon Systems Group, Applied Global Services, Display, and Energy and Environmental Solutions. Silicon Systems Group segment The Silicon Systems Group segment develops, manufactures, and sells manufacturing equipment used to fabricate semiconductor chips, also referred to as integrated circuits (ICs). Most chips are built on a silicon wafer base and include various circuit components, such as transistors and other devices, that are connected by multiple layers of wiring (interconnects). This segment offers systems that perform various processes used in chip fabrication, including chemical vapor deposition (CVD), physical vapor deposition (PVD), etch, electrochemical deposition (ECD), rapid thermal processing (RTP), ion implantation, chemical mechanical planarization (CMP), epitaxy (Epi), wet cleaning, atomic layer deposition (ALD), wafer metrology and inspection, and systems that etch or inspect circuit patterns on masks used in the photolithography process. This segment’s semiconductor manufacturing systems are used by integrated device manufacturers and foundries to build and package memory, logic and other types of chips. The majority of the company's new equipment sales are for technology for advanced 2X nanometer (nm) nodes and smaller dimensions. This segment is a supplier of systems for manufacturing copper-based interconnects, including equipment for depositing, etching and planarizing these multi-layer structures. This segment sells most of its single-wafer, multi-chamber systems on eight basic platforms: the Endura, Centura, Producer, Centris, Reflection, Raider, VIISta and Vantage platforms. The predominant or common wafer size used for volume production of advanced chips is 300 millimeter (mm), or 12-inch, wafers. This segment offers 300mm systems through its Silicon Systems Group segment. In addition, this segment offers earlier-generation 200mm systems, as well as products and services to support all of its systems, which are reported under its Applied Global Services segment. Deposition The company provides equipment to perform four types of deposition: ALD, CVD, ECD and PVD. In addition, its RTP systems can be used to perform certain types of dielectric deposition. Atomic Layer Deposition: The Applied Centura Integrated Gate Stack system features advanced ALD technology that builds ultrathin high-k film layers less than 2nm in thickness. Chemical Vapor Deposition: The company offers the following CVD products and technologies: The Applied Producer CVD platform — The Producer high-throughput platform features Twin-Chamber modules that have two single-wafer process chambers per unit. Low k Dielectric Films — Using conventional CVD equipment, the Applied Producer Black Diamond family of low k systems provides customers with a proven, cost-effective way to integrate various low k films into advanced interconnect structures. In addition, the company offers its Applied Producer Onyx process, a film treatment that optimizes the molecular structure of low k films. Lithography-Enabling Solutions — The company offers technologies on the Producer system to help chipmakers extend their 193nm lithography tools, including a line of Applied APF (advanced patterning film) films and Applied DARC (dielectric anti-reflective coating) films. Gap Fill Films — The company’s advanced gap fill system is its Applied Producer Eterna FCVD system. Strain Engineering Solutions — The Applied Producer HARP system plays a main role in enhancing transistor performance, enabling chipmakers to boost chip speed by depositing strain-inducing dielectric films. The company also offers the Applied Centura SiNgenPlus low pressure CVD system for low temperature silicon nitride films. Through-Silicon Via Films — The company offers products for through-silicon via fabrication, including the Applied Producer InVia system. 3D NAND and FinFET Films — The company offers products


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