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Last $2.25 USD
Change Today -0.03 / -1.32%
Volume 11.7K
AEHR On Other Exchanges
As of 8:10 PM 05/22/15 All times are local (Market data is delayed by at least 15 minutes).
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Company Description

Contact Info

400 Kato Terrace

Fremont, CA 94539

United States

Phone: 510-623-9400

Fax: 510-623-9450

Aehr Test Systems develops, manufactures, and sells systems which are designed to reduce the cost of testing and to perform reliability screening, or burn-in, of complex logic and memory devices. These systems can be used to simultaneously perform parallel testing and burn-in of packaged integrated circuits (ICs), singulated bare die, or ICs still in wafer form. Products The company manufactures and markets full wafer contact test systems, test during burn-in systems, test fixtures, die carriers and related accessories. All of the company’s systems are modular, allowing them to be configured with optional features to meet customer requirements. Full Wafer Contact Systems The FOX-1 full wafer parallel test system, introduced in 2005, is designed for massively parallel test in wafer sort. The FOX-1 system is designed to make electrical contact to and test all of the die on a wafer in a single touchdown. The FOX-1 pattern generator is designed to functionally test industry-standard memory, such as flash and DRAMs, plus it is optimized to test memory or logic ICs that incorporate design for testability (DFT), and built-in self-test (BIST). The FOX-1 pin electronics and per-device power supplies are modified to full-wafer functional test. The FOX-15 full wafer contact test and burn-in system, introduced in 2007, is designed for use with wafers that require test and burn-in times typically measured in hours. The FOX-15 is focused on parallel testing and burning-in up to 15 wafers at a time. One of the main components of the FOX systems is the patented WaferPak cartridge system. The WaferPak cartridge contains a full-wafer single-touchdown probe card which is easily removable from the system. Traditional probe cards contact only a portion of the wafer, requiring multiple touchdowns to test the entire wafer. Systems for Packaged Parts Test during burn-in (TDBI) systems consist of several subsystems: pattern generation and test electronics, control software, network interface and environmental chamber. The test pattern generator allows duplication of most of the functional tests performed by a traditional tester. Pin electronics at each burn-in board (BIB) position are designed to provide signals to the ICs being tested and detect whether a device is failing the test. Devices being tested are placed on BIBs and loaded into environmental chambers which operate at temperatures from 25 degrees Celsius (77 degrees Fahrenheit) up to 150 degrees Celsius (302 degrees Fahrenheit) (optional chambers can produce temperatures as low as -55 degrees Celsius (-67 degrees Fahrenheit)). The Advanced Burn-in and Test System (ABTS) was introduced in 2008. The ABTS family of products is based on a completely new hardware and software architecture that is intended to address devices. The ABTS system can test and burn-in both high-power logic and low-power ICs. It can be configured to provide individual device temperature control for devices up to 70W or more and with up to 320 I/O channels. The MAX system family was designed for monitored burn-in of memory and logic devices. It has 96 channels and holds 64 burn-in boards, each of which hold up to 350 or more devices, resulting in a system capacity of up to 22,400 or more devices. The output monitor feature allows the MAX system to perform functional tests of devices and it also supports BIST or other scan features. The MAX4 extends the MAX system family to target devices that require higher current, and can provide up to 227 amps of per BIB position. Test Fixtures The company sells, and licenses others to manufacture and sell, custom-designed test fixtures for its systems. The test fixtures include BIBs for the ABTS parallel test and burn-in system and for the MAX monitored burn-in system. These test fixtures hold the devices undergoing test or burn-in and electrically connect the devices under test to the system electronics. Test fixtures are sold both with new Aehr Test systems and for use with the company’s installed base of systems. Test fixtures are also available from third-party suppliers. The company’s DiePak product line includes a family of reusable, t

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