Aehr Test Systems designs, engineers and manufactures test and burn-in equipment used in the semiconductor industry. Products The company manufactures and markets full wafer contact test systems, test during burn-in (TDBI) systems, test fixtures, die carriers and related accessories. Full Wafer Contact Systems The FOX-1P full wafer parallel test system is designed for massively parallel test in wafer sort. The FOX-1P system is designed to make electrical contact to and test all of the die on a wafer in a single touchdown. The FOX-1P test head and WaferPak contactor are compatible with industry-standard 300 mm wafer probers, which provide the wafer handling and alignment automation for the FOX-1P system. The FOX-1P pattern generator is designed to functionally test industry-standard memory devices, such as flash and DRAMs, plus it is optimized to test memory or logic integrated circuits (ICs) that incorporate design for testability, and built-in self-test. The FOX-1P universal per-pin architecture to provide per-pin electronics and per-device power supplies is tailored to full-wafer functional test. The FOX-1 full wafer parallel test system, the predecessor to the FOX-1P system was designed for massively parallel test in wafer sort. The FOX-XP full wafer contact test and burn-in system is designed for use with wafers that require test and burn-in times typically measured in hours. The FOX-XP system is focused on parallel testing and burning-in up to 18 wafers at a time. For applications, such as automotive, mobile devices, sensors, and SSDs the FOX-XP system is a solution for producing tested and burned-in die for use in multi-chip packages. The FOX-15 full wafer parallel test system, the predecessor to the FOX-XP system was designed for full-wafer test and burn-in. Systems for Packaged Parts TDBI systems consist of various subsystems, including pattern generation and test electronics, control software, network interface and environmental chamber. The test pattern generator allows duplication of most of the functional tests performed by a traditional tester. Pin electronics at each burn-in board (BIB), position are designed to provide signals to the ICs being tested and detect whether a device is failing the test. Test Fixtures The company sells and licenses others to manufacture and sell custom-designed test fixtures for its systems. The test fixtures include BIBs for the Advanced Burn-in and Test System (ABTS) parallel test and burn-in system and for the MAX monitored burn-in system. These test fixtures hold the devices undergoing test or burn-in and electrically connect the devices under test to the system electronics. The company’s DiePak product line includes a family of reusable, temporary die carriers and associated sockets that enable the test and burn-in of bare die using the same test and burn-in systems used for packaged ICs. DiePak carriers offer solutions for providing known-good die (KGD) for most types of ICs, including memory, microcontroller and microprocessor devices. The DiePak carrier consists of an interconnect substrate, which provides an electrical connection between the die pads and the socket contacts, and a mechanical support system. The substrate is customized for each IC product. The DiePak carrier comes in various versions designed to handle ICs ranging from 54 pin-count memory approximately 320 pin-count microprocessors. The company has received patents or applied for patents on certain features of the FOX, ABTS and MAX4 test fixtures. It has licensed or authorized various other companies to provide MAX4 BIBs from which it receives royalties. Strategy A principal element of the company’s business strategy is to increase its presence in the test equipment market through system sales in its FOX wafer-level test and burn-in product family. Customers The company markets and sells its products worldwide to semiconductor manufacturers, semiconductor contract assemblers, electronics manufacturers and burn-in and test service companies. During 2016, Apple Operations and Texas Instruments Incorporated accounted for approximately 47% and 32%, respectively, of the company’s net sales. Sales and Customer Support The company has sales and service operations in the United States, Japan, Germany, and Taiwan, and has established a network of distributors and sales representatives in other parts of the world. Research and Product Development For the year ended May 31, 2016, the company's research and development expenses included $4.3 million. Proprietary Rights As of May 31, 2016, the company held 46 issued United States patents with expiration date ranges from 2017 to 2029 and had various additional United States patent applications and foreign patent applications pending. Competition The company’s competing suppliers of full wafer contact systems include Advantest Corporation; Teradyne Inc.; Micronics Japan Co., Ltd.; and Tokyo Electron Limited. Its competing suppliers of burn-in and functional test systems that compete with ABTS systems include Dong-Il Corporation; Micro Control Company; Incal Technology; and Advantest Corporation. The company’s competing suppliers of full-wafer probe cards include FormFactor, Inc.; Japan Electronic Materials Corporation; and Micronics Japan Co., Ltd. The company's suppliers with products that compete with its DiePak products include Yamaichi Electronics Co., Ltd. History Aehr Test Systems was founded in 1977. The company was incorporated in the state of California in 1977.
aehr test systems
(AEHR:Consolidated Issue listed on NASDAQ Capital Market)
400 Kato Terrace
Fremont, CA 94539
The information and data displayed in this profile are created and managed by Capital IQ, a Standard & Poor's company. Bloomberg.com does not create or control the content.
|No competitor information is available for AEHR.|
|View Industry Companies|
|Price/Cash Flow||NM||Not Meaningful|
Sponsored Financial Commentaries
To contact AEHR TEST SYSTEMS, please visit www.aehr.com. Company data is provided by Capital IQ. Please use this form to report any data issues.