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Last $1.13 USD
Change Today -0.075 / -6.25%
Volume 130.0
As of 10:39 AM 02/8/16 All times are local (Market data is delayed by at least 15 minutes).
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Company Description

Contact Info

400 Kato Terrace

Fremont, CA 94539

United States

Phone: 510-623-9400

Fax: 510-623-9450

Aehr Test Systems engages in designing, manufacturing and marketing advanced test and burn-in products to the semiconductor manufacturing industry. The company develops, manufactures, and sells systems, which are designed to perform screening, or burn-in, of complex logic devices, memory integrated circuits (ICs), sensors, and optical devices. These systems could be used to simultaneously perform parallel testing and burn-in of packaged ICs, singulated bare die or ICs still in wafer form. Products The company manufactures and markets full wafer contact test systems, test during burn-in systems, test fixtures, die carriers and related accessories. All of the company’s systems are modular, allowing them to be configured with optional features to meet customer requirements. Full Wafer Contact Systems The FOX-1P full wafer parallel test system, introduced in October 2014, is designed for massively parallel test in wafer sort. The FOX-1P system is designed to make electrical contact to and test all of the die on a wafer in a single touchdown. The FOX-1P test head and WaferPak contactor are compatible with industry-standard 300 mm wafer probers, which provide the wafer handling and alignment automation for the FOX-1P system. The FOX-1P pattern generator is designed to functionally test industry-standard memory devices, such as flash and DRAMs, plus it is optimized to test memory or logic ICs that incorporate design for testability and built-in self-test. The FOX-1P universal per-pin architecture to provide per-pin electronics and per-device power supplies is tailored to full-wafer functional test. The FOX-1 full wafer parallel test system, the predecessor to the FOX-1P system is designed for massively parallel test in wafer sort. The FOX-1 system is nearing the end of its lifecycle and limited shipments are expected in the future. The FOX-15 full wafer contact test and burn-in system is designed for use with wafers that require test and burn-in times typically measured in hours. The FOX-15 system is focused on parallel testing and burning-in up to 15 wafers at a time. For applications, such as automotive, the FOX-15 system is a solution for producing tested and burned-in die for use in multi-chip packages. One of the key components of the FOX systems is the patented WaferPak cartridge system. The WaferPak cartridge contains a full-wafer single-touchdown probe card, which is removable from the system. Traditional probe cards contact a portion of the wafer, requiring multiple touchdowns to test the entire wafer. Systems for Packaged Parts Test during burn-in systems consist of various subsystems, such as pattern generation and test electronics, control software, network interface and environmental chamber. The test pattern generator allows duplication of majority of the functional tests performed by a traditional tester. Pin electronics at each burn-in board (BIB) position are designed to provide accurate signals to the ICs being tested and detect whether a device is failing the test. Devices being tested are placed on BIBs and loaded into environmental chambers, which typically operate at temperatures from 25 degrees Celsius (77 degrees Fahrenheit) up to 150 degrees Celsius (302 degrees Fahrenheit) (optional chambers could produce temperatures as low as -55 degrees Celsius (-67 degrees Fahrenheit)). The Advanced Burn-in and Test System (ABTS) family of products is based on a completely new hardware and software architecture that is intended to address devices. The ABTS system could test and burn-in both high-power logic and low-power ICs. It could be configured to provide individual device temperature control for devices up to 70W or more and with up to 320 I/O channels. The MAX system family, the predecessor to the ABTS family, is designed for monitored burn-in of memory and logic devices. The MAX system is nearing the end of its lifecycle and limited shipments are expected in the future. Test Fixtures The company sells, and licenses others to manufacture and sell, custom-designed test fixtures for its systems. The test fixtures include BIBs for the ABTS parallel test and burn-in system

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