Xintec Inc. operates as a three dimensional (3D) wafer level chip scale packaging company in Taiwan. The company offers optical sensor chip-scale package for applications in image sensors for cellular phones, notebooks, automotives, security, DSC, etc.; ambient light/proximity/gesture sensors; and laser intensity sensors for blue-ray and pico projectors. It also provides PPI and 3D package technologies for applications in integrated passive devices, power discrete, power management ICs and analogue ICs, cellular phone RF ICs, and capacitive couplers; and micro-electro-mechanical systems and sensor packaging services. In addition, the company offers design services, such as re-distribution layer design; mask layout; and tooling preparation in various product segments, including CMOS image sensor chip scale package, wafer level chip scale package, and other wafer level packages. Further, it provides modeling services comprising technical analysis and consulting services, such as thermal resistance; package-level mechanical stress analysis; board-level solder fatigue and drop test analysis; critical net R, L, C extraction; and signal integrity analysis services. Xintec Inc. was founded in 1998 and is headquartered in Taoyuan, Taiwan.
xintec inc (3374:Taiwan)
No. 23, Jilin Road
Phone: 886 3 433 1818
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To contact XINTEC INC, please visit www.xintec.com.tw. Company data is provided by Capital IQ. Please use this form to report any data issues.