Last $24.30 USD
Change Today -0.03 / -0.12%
Volume 5.7K
TOSYY On Other Exchanges
As of 8:10 PM 03/5/15 All times are local (Market data is delayed by at least 15 minutes).

toshiba corp-unsponsored adr (TOSYY) Snapshot

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52 Week High
07/16/14 - $28.65
52 Week Low
05/7/14 - $22.41
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toshiba corp-unsponsored adr (TOSYY) Details

Toshiba Corporation, together with its subsidiaries, engages in the research and development, manufacture, and sale of electronic and energy products worldwide. It operates through Energy & Infrastructure, Community Solutions, Healthcare Systems & solutions, Electronic Devices & Components, Lifestyle Products & Services, and Others segments. The Energy & Infrastructure segment offers energy-related equipment, transportation systems, etc. The Community Solutions segment offers building facilities, such as elevators, light fixtures, and air-conditioners, as well as offers POS systems, multi-function peripherals, etc. The Healthcare Systems & solutions segment provides medical equipment and healthcare solutions, etc. The Electronic Devices & Components segment offers semiconductors, hard disk drives, etc. The Lifestyle Products & Services segment provides personal computers, visual products, refrigerators, washing drying machines, etc. The Others segment offers cloud solutions, logistics services, etc. The company also manufactures and sells transformers and switchgears. Toshiba Corporation was founded in 1875 and is headquartered in Tokyo, Japan.

200,260 Employees
Last Reported Date: 06/25/14
Founded in 1875

toshiba corp-unsponsored adr (TOSYY) Top Compensated Officers

Chief Executive Officer, President, Represent...
Total Annual Compensation: ¥105.0M
Compensation as of Fiscal Year 2013.

toshiba corp-unsponsored adr (TOSYY) Key Developments

Toshiba Corporation Launches TZ5010XBG, TZ5011XBG, TZ5021XBG and TZ5023XBG

Toshiba Corporation announced that it will expand its line-up of ApP LiteTM processors with the launch of TZ5010XBG, TZ5011XBG, TZ5021XBG and TZ5023XBG targeting the Internet of Things (IoT). These products reduce power consumption using Toshiba proprietary hardware-based power management technology and system integration technology, which enables high memory efficiency and robust security features. Sample shipments start today, with mass production scheduled to start in the end of this month for TZ5010XBG and TZ5011XBG, and in June for TZ5021XBG and TZ5023XBG. The TZ5010XBG and the TZ5011XBG application processors, based on the ARM® Cortex®-A9 dual core processor, incorporate a built-in baseband for high-speed Wi-Fi® 802.11ac, graphics and video engine. These products are suitable for IoT devices where greater data capacity is required for media and high-definition images. They extend CPU performance, memory performance and temperature range and can be used in a broad selection of applications including industrial compared to earlier versions of the product line. The TZ5021XBG and TZ5023XBG support LP-DDR2/3 memory, specialized low-power mode for mobile devices, and a small package size for IoT applications. Additionally, the TZ5023XBG has a low-power DSP, the Cadence®Tensilica® HiFi Mini, which executes voice, audio and sensor processing. Key Features: Built-in communication and signal processing engines specialized for specific applications. The TZ5010XBG and the TZ5011XBG have integrated Wi-Fi 802.11ac 2x2 baseband, a next-generation wireless communication technology enabling a stable, broadband wireless connection. TZ5021XBG and TZ5023XBG have built-in, low-power DSP and support a low-power mode enabling voice, audio and sensor processing. DSP is integrated only in the TZ5023XBG. Achieving high-efficient system performance. These products achieve high-efficiency system performance because of memory efficiency, and low latency processing with a robust security system. These features enable a highly reliable and stable application with a better user experience. Proprietary hardware based low-power technology for heat dissipation. Hardware-based power management technology makes it possible to enter into a low-power mode in microseconds and to transit to low-power mode more easily compared to significantly slower software-based power management technology. It reduces power consumption and contributes to better thermal dissipation for most applications.

Toshiba Corporation Launches 13 Megapixel CMOS Image Sensor

Toshiba Corporation announced the launch of 'T4KB3', a 13 megapixel BSI CMOS image sensor with the optical format of 1/3.07 inch for smartphones and tablets. In the market for mobile devices, a constant target for manufacturers is a small form factor; a final product that is thinner and lower in volume than products from other companies. Toshiba is meeting this need with a new design method that delivers smaller CMOS sensor chips. The new design methodology helps to reduce the power consumption of the new 13 megapixel sensor to 53% of Toshiba’s sensor currently in mass production, to 200mW or less at 30fps. Short exposure time caused by high frame rate in high speed video recording usually produces underexposed images. 'T4KB3' uses 'Bright Mode' technology to boost image brightness up to four times while realizing Full-HD video capture at 120fps equivalent. The sensor incorporates 8Kbit of one-time-programmable (OTP) memory that can store lens shading correction data for two conditions; correction data for indoors and for outdoors, for example, which have different light profiles. These conditions can be separately applied to image correction, and users can switch from one to the other with a simple command for better image capture. Applications: Smartphones and tablets. Key features: Low power circuit design to reduce power consumption to 53% that of Toshiba current product. HD video capture at 120fps; 'Bright Mode' technology to boost image brightness up to four times.

Toshiba Corporation Launches Low-Voltage MOSFET Series with Dual-Sided Cooling Packages

Toshiba Corporation announced the launch of a new surface mount package series in its line-up of low-voltage MOSFET products that use dual-sided cooling to improve heat dissipation. The new devices have a heat sink on both sides of the package to improve heat dissipation, making it possible to realize high-current operations in compact packages. The new MOSFETs share the same 5mm x 6mm footprint as Toshiba's current SOP Advance package, facilitating replacement without any need to modify existing PCB layouts.


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Valuation TOSYY Industry Range
Price/Earnings 20.7x
Price/Sales 0.3x
Price/Book 1.4x
Price/Cash Flow 24.5x
TEV/Sales NM Not Meaningful

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