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Last $18.39 USD
Change Today -0.34 / -1.82%
Volume 3.1M
TER On Other Exchanges
Symbol
Exchange
Frankfurt
As of 8:04 PM 04/24/15 All times are local (Market data is delayed by at least 15 minutes).

teradyne inc (TER) Snapshot

Open
$18.78
Previous Close
$18.73
Day High
$18.78
Day Low
$18.30
52 Week High
09/17/14 - $20.88
52 Week Low
10/15/14 - $16.02
Market Cap
4.0B
Average Volume 10 Days
2.2M
EPS TTM
$0.66
Shares Outstanding
216.8M
EX-Date
02/25/15
P/E TM
27.9x
Dividend
$0.24
Dividend Yield
1.31%
Current Stock Chart for TERADYNE INC (TER)

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teradyne inc (TER) Details

Teradyne, Inc. provides automatic test equipment worldwide. The company’s Semiconductor Test segment designs, manufactures, sells, and supports semiconductor test products and services for wafer level and device package testing in automotive, industrial, communications, consumer, computer and electronic game applications, and others. This segment offers FLEX test platform systems; Magnum test platform that tests memory devices, such as flash memory and dynamic random access memory; J750 test system to address the highest volume semiconductor devices; and ETS platform for use by semiconductor manufacturers, and assembly and test subcontractors in the low pin count analog/mixed signal discrete markets. It serves integrated device manufacturers (IDMs) that integrate the fabrication of silicon wafers into their business; fabless companies, which outsource the manufacturing of silicon wafers; foundries that cater to the processing and manufacturing of silicon wafers; and outsourced semiconductor assembly and test providers, which offer test and assembly services for the final packaged devices to fabless companies and IDMs. The company’s Wireless Test segment designs, develops, and supports wireless test equipment for developing and manufacturing wireless devices, including smart phones, tablets, notebooks, laptops, personal computer peripherals, and other Wi-Fi, Bluetooth, and cellular enabled devices. This segment offers IQxstream solution for testing GSM, EDGE, CDMA2000, TD-SCDMA, WCDMA, HSPA+, LTE-FDD, TD_LTE, and LTE-A technologies for calibration and verification of smartphones, tablets, and embedded cellular modules; test equipment for connectivity testing; IQfact chipset software; and modular wireless test instruments. The company’s System Test segment offers defense/aerospace test instrumentation and systems; storage test systems; and circuit-board test and inspection systems. The company was founded in 1960 and is headquartered in North Reading, Massachusetts.

3,900 Employees
Last Reported Date: 02/27/15
Founded in 1960

teradyne inc (TER) Top Compensated Officers

Chief Executive Officer, President, Director ...
Total Annual Compensation: $739.0K
Chief Financial Officer, Vice President and T...
Total Annual Compensation: $555.8K
President of Systems Test Group
Total Annual Compensation: $347.9K
President of Wireless Test Division
Total Annual Compensation: $316.2K
Vice President, Secretary and General Counsel
Total Annual Compensation: $413.7K
Compensation as of Fiscal Year 2014.

teradyne inc (TER) Key Developments

Teradyne Inc. Debuts New TestStation Systems for Lean Manufacturing Requirements at NEPCON China 2015

Teradyne Inc. announced its TestStation family of PCB manufacturing test and automation solutions at NEPCON China 2015. Products featured at NEPCON China will include: The TestStation Multi-Site in-circuit test system, which has demonstrated the ability to deliver 2 to 4 times the productivity of conventional single site systems; The TestStation Inline Automated Handler for high-speed, no-touch PCBA test processing; The UltraPin II 128HD channel card featuring 512 hybrid pins per card for high-complexity and high-density applications; The TestStation LH in-circuit test system with support for up to 4,096 test points. TestStation Multi-Site Systems for Higher Productivity PCBA Testing: TestStation Multi-Site in-circuit test systems feature multiple test head support and concurrent test architecture to deliver 2 to 4 times productivity compared to conventional MDA/ICT systems, in a fraction of the equivalent footprint. The systems are easily configured for fully-automated, robotic arm or operator end-use. The TestStation Multi-Site dual-site model supports two concurrently operating test heads in a system footprint under 0.7 square meters, 40% smaller than a single conventional in-circuit test system, yet delivering up to 4 times the unit output per hour. By replacing the capacity of multiple full-size testers with a single system, Multi-Site reduces the operating cost of test from duplicate operators, fixtures, maintenance and factory overhead. TestStation Automation Solutions for Lean Manufacturing Requirements: The TestStation Automated Inline Handler and TestStation Multi-Site Offline systems allow manufacturers to easily move to automated no-touch manufacturing test. The TestStation Automated Inline Handler supports PCBA panels of up to 450mm x 350mm, with up to 5,120 test points. The system has demonstrated the ability to deliver mechanical board transport times of less than six seconds. With dual-site support in a 850mm wide footprint, the TestStation Handler is designed to replace 2 to 4 times as many automatic or manual MDA/ICT systems, yet consumes less than a square meter of production floor space and a fraction of the equivalent electricity. UltraPin II 128HD Increases TestStation System Pin Count to 15,360 Pins. The UltraPin II 128HD high-density channel card effectively doubles system test point counts. TestStation systems configured with 128HD can be configured to 15,360 test points, while preserving support for existing fixtures and programs.

Teradyne, Inc. Drives Chip Test Costs Down with the New ETS-800 Test System

Teradyne Inc. announced the availability of the ETS-800 test system designed to further drive down the cost of test in the linear, power and automotive markets. The system introduction coincides with the availability of a suite of instruments to address the requirements of the analog test market. System shipments began in the third quarter of 2014 and are in production at multiple customers. The platform delivers test cell throughput for complex analog devices through a combination of unique ETS-800 capabilities designed to overcome the high site-count test challenges. These ETS-800 capabilities include: Floating Instrumentation - The SmartPin3 floating architecture minimizes site-to-site interaction and provides voltage and current operating points beyond the capability of any single instrument. This architecture extends the performance range of the system at no additional cost. APEX - An extensive, integrated network of fast switching muxes and matrices minimizes DIB complexity and optimizes instrument utilization, reducing capital cost. ExpanDIB - Three DIB board sizes and test head extension boards allow the application area to scale up for devices that require large test socket areas and extensive device required circuitry. EagleVision MST Software - A powerful software development and debug environment enables rapid completion of high throughput solutions with simple and intuitive programming. Multi-sector Technology - An architecture that delivers >99% parallel test efficiency for lower cost, high site-count analog device test.

Teradyne, Inc. Announces The Availability of Image Sensor Test System IP750Ex-HD for Customer Production Order

Teradyne Inc. announced the availability of the IP750Ex-HD to increase the parallel test capability for both wafer and final test of image sensors using new, High Density (HD) instruments. These instruments are also compatible with over 4,000 installed J750 and IP750 test systems providing added flexibility to test system operators. The IP750Ex-HD can test not just image sensors, but microcontrollers and a wide range of mobile connectivity devices. In today’s production environment with volatile unpredictable demand loading, the IP750Ex-HD’s flexibility helps ensure high test center utilization. New IP750Ex-HD capabilities include: HSD800 Multifunction Instrument. A third generation digital instrument providing 128 high speed digital channels, scalable to 2,048 channels per system. The instrument also introduces DIB Access, an innovative feature allowing unique tester resources including High Voltage and Digital Source and Signal Capture (DSSC) pins to be easily connected without external hardware. DIB Access reduces load board complexity, shortening time-to-market and simplifying concurrent test to increase overall test cell throughput. ICMD. A new LVDS image capture instrument supporting MIPI CSI-2 D-PHY 1.5Gbps speed at 1,2,4 Data Lane CIS and Serial 1 to 16 Lane protocol support capability. This second generation instrument with 24 differential input pairs and available 128M pixel capture memory supports leading image sensors used for smart phones, media tablets and DSC/DSLR. The instrument also offers the software feature 'Protocol Add-in' for custom-made data protocols. The ICMD is completely hardware and software compatible with its predecessor 'ICUL1G' to minimize test program conversion time. IG-XL® 3.60 [4] Software. Mature and user friendly test program development software platform. Zero-footprint, Air-cooled System. Minimizes floor space. Compatible Operation. System Architecture maintains pin and program compatibility with existing IP750Ex Device Programs.

 

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Industry Analysis

TER

Industry Average

Valuation TER Industry Range
Price/Earnings 51.3x
Price/Sales 2.5x
Price/Book 2.0x
Price/Cash Flow 26.7x
TEV/Sales 2.0x
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