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Last $18.52 USD
Change Today -0.295 / -1.57%
Volume 1.4M
TER On Other Exchanges
Symbol
Exchange
New York
Frankfurt
As of 3:31 PM 03/26/15 All times are local (Market data is delayed by at least 15 minutes).

teradyne inc (TER) Snapshot

Open
$18.46
Previous Close
$18.81
Day High
$18.75
Day Low
$18.29
52 Week High
09/17/14 - $20.88
52 Week Low
10/15/14 - $16.02
Market Cap
4.0B
Average Volume 10 Days
1.6M
EPS TTM
$0.66
Shares Outstanding
217.8M
EX-Date
02/25/15
P/E TM
28.0x
Dividend
$0.24
Dividend Yield
1.29%
Current Stock Chart for TERADYNE INC (TER)

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teradyne inc (TER) Details

Teradyne, Inc. provides automatic test equipment worldwide. The company’s Semiconductor Test segment designs, manufactures, sells, and supports semiconductor test products and services for wafer level and device package testing in automotive, industrial, communications, consumer, computer and electronic game applications, and others. This segment offers FLEX test platform systems; Magnum test platform that tests memory devices, such as flash memory and dynamic random access memory; J750 test system to address the highest volume semiconductor devices; and ETS platform for use by semiconductor manufacturers, and assembly and test subcontractors in the low pin count analog/mixed signal discrete markets. It serves integrated device manufacturers (IDMs) that integrate the fabrication of silicon wafers into their business; fabless companies, which outsource the manufacturing of silicon wafers; foundries that cater to the processing and manufacturing of silicon wafers; and outsourced semiconductor assembly and test providers, which offer test and assembly services for the final packaged devices to fabless companies and IDMs. The company’s Wireless Test segment designs, develops, and supports wireless test equipment for developing and manufacturing wireless devices, including smart phones, tablets, notebooks, laptops, personal computer peripherals, and other Wi-Fi, Bluetooth, and cellular enabled devices. This segment offers IQxstream solution for testing GSM, EDGE, CDMA2000, TD-SCDMA, WCDMA, HSPA+, LTE-FDD, TD_LTE, and LTE-A technologies for calibration and verification of smartphones, tablets, and embedded cellular modules; test equipment for connectivity testing; IQfact chipset software; and modular wireless test instruments. The company’s System Test segment offers defense/aerospace test instrumentation and systems; storage test systems; and circuit-board test and inspection systems. The company was founded in 1960 and is headquartered in North Reading, Massachusetts.

3,900 Employees
Last Reported Date: 02/27/15
Founded in 1960

teradyne inc (TER) Top Compensated Officers

Chief Executive Officer, President, Director ...
Total Annual Compensation: $564.4K
Chief Financial Officer, Vice President and T...
Total Annual Compensation: $500.3K
President of Systems Test Group
Total Annual Compensation: $333.8K
Vice President, Secretary and General Counsel
Total Annual Compensation: $374.5K
Compensation as of Fiscal Year 2013.

teradyne inc (TER) Key Developments

Teradyne, Inc. Announces The Availability of Image Sensor Test System IP750Ex-HD for Customer Production Order

Teradyne Inc. announced the availability of the IP750Ex-HD to increase the parallel test capability for both wafer and final test of image sensors using new, High Density (HD) instruments. These instruments are also compatible with over 4,000 installed J750 and IP750 test systems providing added flexibility to test system operators. The IP750Ex-HD can test not just image sensors, but microcontrollers and a wide range of mobile connectivity devices. In today’s production environment with volatile unpredictable demand loading, the IP750Ex-HD’s flexibility helps ensure high test center utilization. New IP750Ex-HD capabilities include: HSD800 Multifunction Instrument. A third generation digital instrument providing 128 high speed digital channels, scalable to 2,048 channels per system. The instrument also introduces DIB Access, an innovative feature allowing unique tester resources including High Voltage and Digital Source and Signal Capture (DSSC) pins to be easily connected without external hardware. DIB Access reduces load board complexity, shortening time-to-market and simplifying concurrent test to increase overall test cell throughput. ICMD. A new LVDS image capture instrument supporting MIPI CSI-2 D-PHY 1.5Gbps speed at 1,2,4 Data Lane CIS and Serial 1 to 16 Lane protocol support capability. This second generation instrument with 24 differential input pairs and available 128M pixel capture memory supports leading image sensors used for smart phones, media tablets and DSC/DSLR. The instrument also offers the software feature 'Protocol Add-in' for custom-made data protocols. The ICMD is completely hardware and software compatible with its predecessor 'ICUL1G' to minimize test program conversion time. IG-XL® 3.60 [4] Software. Mature and user friendly test program development software platform. Zero-footprint, Air-cooled System. Minimizes floor space. Compatible Operation. System Architecture maintains pin and program compatibility with existing IP750Ex Device Programs.

Teradyne to Showcase New Solutions for Integrated Lab and Production Test at SEMICON China 2015

Teradyne Inc. to showcase new solutions for lab and production test in booth #3101 at SEMICON China held in ShanghaiMarch 17-19. Teradyne to display and perform product demonstrations for the J750-LitePoint semiconductor test system and the LitePoint zSeries RF lab test solution. Teradyne'sJ750 test system, first introduced in 1998, is one of the most successful platforms in ATE history. Teradyne has regularly extended the J750's capability with new, higher performance, lower cost instrumentation and data processing. With the addition of LitePoint's low-cost IQseries and zSeries RF instrumentation, the J750 now offers complete production and lab test solutions for global wireless standards. With the use of common hardware and RF measurement science, the J750-LitePoint and LitePoint zSeries systems ensure efficient correlation between the lab and production test. The LitePoint zSeries product line is designed to get accurate characterization data quickly from RF test chips and first silicon back to chip developers. The zSeries is built on a modular PXI-Express frame for fast and inexpensive upgrading, which means it can grow and evolve as test and business needs dictate. The zSeries easily integrates into any existing J750 to ensure early market success and easy production rollout.

Teradyne, Inc. Features TestStation Family of Printed-Circuit Board Systems and Automation Manufacturing Solutions at the IPC APEX EXPO 2015

Teradyne Inc. is featuring its TestStation family of printed-circuit board (PCB) systems and automation manufacturing solutions at the IPC APEX EXPO 2015. Products featured at the IPC APEX EXPO will include: The TestStation Multi-Site in-circuit test systems, which has demonstrated the ability to deliver 2 to 4 times the productivity of conventional systems; The TestStation Automated Inline Handler for true no-touch, high-speed inline test; The UltraPin II 128HD channel card for doubling TestStation systems test point capacity; TestStation LH in-circuit test systems for PCBAs with up to 4,096 test points. Teradyne's TestStation Multi-Site's true parallel test architecture has demonstrated the ability to deliver 2 to 4 times the productivity of conventional MDA/ICT systems. Multi-Site systems are configured as automated inline, automated offline or manual offline use. TestStation inline systems feature a Zero-Footprint design that mates to automated handlers with no incremental floor space consumption. A single Multi-Site offline system can replace the capacity of multiple independent full-size testers, with reduced cost of operators, fixtures, maintenance and factory overhead. The TestStation Automated Handling offers true no-touch, high-speed inline test of PCBA panels of up to 5,120 test points. The Handling sub-system can deliver mechanical board transport cycle-times in less than six seconds. With full dual-site parallel test capability and a 850mm wide footprint, the TestStation Handler is designed to replace 2 to 4 times as many automatic or manual systems, while consuming less than a square meter of costly production floor space and a fraction of the electrical energy. It also allows for more output per hour with less initial capital investment and recurring cost, maximizing factory profitability and flexibility. The UltraPin II 128HD high-density channel card effectively doubles system test point counts. TestStation systems configured with 128HD increase test point maximum from 7,680 to 15,360, increasing system capability and preserving support for existing compatible fixtures and programs. By providing a path to higher total system pin count within existing systems, the new 128HD hybrid channel card supports the test of larger panels, or higher complexity PCBA's. Teradyne's TestStation family offers the industry's broad range of in-circuit and functional test options for production PCBA test. The TestStation Multi-Site architecture extends the TestStation performance to deliver simultaneous, parallel test for complete analog and digital in-circuit test with functional test, boundary scan, flash programming and parametric test options. The new TestStation products will be introduced at Booth #2743 during IPC APEX EXPO 2015 to be held in San Diego, California from February 24-26, 2015.

 

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Industry Analysis

TER

Industry Average

Valuation TER Industry Range
Price/Earnings 51.5x
Price/Sales 2.5x
Price/Book 2.0x
Price/Cash Flow 26.9x
TEV/Sales 2.0x
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