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Last $0.46 SGD
Change Today 0.00 / 0.00%
Volume 0.0
As of 5:04 AM 08/27/15 All times are local (Market data is delayed by at least 15 minutes).

stats chippac ltd (STAT) Snapshot

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52 Week High
10/31/14 - $0.58
52 Week Low
12/2/14 - $0.41
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stats chippac ltd (STAT) Details

STATS ChipPAC Ltd., together with its subsidiaries, provides semiconductor packaging design, bump, probe, assembly, test, and distribution services for communications, digital consumer, and computing market applications. Its services include post wafer fab process, and back-end assembly and test. The company offers advanced packaging and wirebond packaging services, including integrated circuit package technology, such as wafer bump, redistribution layer design and fabrication, flip chip interconnect, fan-out wafer level package or embedded wafer level ball grid array, wafer level chip-scale package, through silicon via, integrated passive devices, and wirebond IC packages, such as leaded, laminate, and memory card to customers for various electronics applications. It also provides package design; electrical, mechanical, and thermal simulation; measurement and design of leadframes and laminate substrates; and wafer processing and bumping on 200mm and 300mm wafers with options for wafer repassivation, redistribution, and IPD layers. In addition, the company offers test services, including wafer probe and final testing on a selection of test equipment, such as semiconductors primarily mixed-signal, radio frequency, analog, and high-performance digital devices, as well as provides test-related services, such as burn-in process support, reliability testing, thermal and electrical characterization, dry pack, and tape and reel services. Further, it offers package development, test software and related hardware development, warehousing, drop shipment, administration, and research and development services. The company markets its services through direct sales force in the United States, South Korea, China, Singapore, Taiwan, and Switzerland. STATS ChipPAC Ltd. was founded in 1994 and is headquartered in Singapore. STATS ChipPAC Ltd. operates as a subsidiary of Singapore Technologies Semiconductors Pte Ltd.

Founded in 1994

stats chippac ltd (STAT) Top Compensated Officers

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Executives, Board Directors

stats chippac ltd (STAT) Key Developments

Collabo Innovations Enters into License Agreement with STATS ChipPAC

Collabo Innovations Inc. has entered into a patent license agreement with STATS ChipPAC Ltd. for technology related to semiconductor packaging. This technology is used in a range of electronic devices, such as televisions, computers, and printers.

STATS ChipPAC Ltd. Announces Tender Offer and Consent Solicitation of Outstanding $200 Million of 5.375% Senior Notes Due 2016

STATS ChipPAC Ltd. announced that it has commenced a cash tender offer and consent solicitation in respect of any and all of its outstanding $200 million of 5.375% Senior Notes due 2016 (the "2016 Notes") and any and all of its outstanding $611.152 million of 4.5% Senior Notes due 2018. The tender offer will expire at 5:00 p.m., New York time, on 9 October 2015, unless extended or earlier terminated (such date and time, as may be extended, the "Expiration Date"). Holders who wish to receive the Early Participation Consideration must validly tender their Existing Notes at or prior to 5:00 p.m., New York time, on 25 September 2015 (such date and time, as may be extended, the "Early Tender Date") through the Depository Trust Company. Holders who validly tender their Existing Notes after the Early Tender Date and at or prior to the Expiration Date will receive only the Tender Consideration. The consent solicitation will expire on the Early Tender Date. All holders of Existing Notes who validly tender their Existing Notes at or prior to the Early Tender Date will be deemed to have delivered their consents. Holders may not tender their Existing Notes at or prior to the Early Tender Date without delivering their consents, and holders may not deliver their consents without tendering their Existing Notes.

STATS ChipPAC Ltd. Appoints Han Byung Joon as Executive Director

STATS ChipPAC has appointed Han Byung Joon as Executive Director. The effective date is August 05, 2015.


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