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Last €0.90 EUR
Change Today +0.01 / 1.12%
Volume 415.4K
SOI On Other Exchanges
Symbol
Exchange
OTC US
EN Paris
OTC US
Frankfurt
As of 11:35 AM 03/30/15 All times are local (Market data is delayed by at least 15 minutes).

s.o.i.t.e.c. (SOI) Snapshot

Open
€0.90
Previous Close
€0.89
Day High
€0.91
Day Low
€0.89
52 Week High
06/2/14 - €3.04
52 Week Low
03/19/15 - €0.82
Market Cap
208.1M
Average Volume 10 Days
1.5M
EPS TTM
€-0.85
Shares Outstanding
231.2M
EX-Date
08/12/99
P/E TM
--
Dividend
--
Dividend Yield
--
Current Stock Chart for S.O.I.T.E.C. (SOI)

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s.o.i.t.e.c. (SOI) Details

Soitec S.A. develops, manufactures, and sells semiconductor materials for electronic and energy industries worldwide. The company operates through three segments: Electronics, Solar Energy, and Lighting. It offers silicon-on-insulator (SOI) wafers, such as FD-2D substrates to implement planar fully depleted CMOS technology; FD-3D substrates, which enable FinFET technology; Premium SOI products for use in partially depleted SOI platforms; Wave SOI products for radio frequency (RF) applications; Imager SOI products for back side illuminated image sensor applications; and Smart Power SOI products for analog and power applications. The company’s SOI products are used in various mainstream electronic applications, including mobile and multimedia communications, high-performance microprocessors, game and entertainment systems used in homes, smart power devices in automotive components and display drivers, RF and wireless transmission, and lighting. It also provides substrates for specialty electronics, such as GaAs Epi wafer solutions for pseudomorphic and metamorphic high-electron mobility transistors, heterojunction bipolar transistors, metal-semiconductor field effect transistors, hall sensors, and photo-imaging sensors; GaN HEMT structures on various substrates comprising silicon, silicon carbide, and engineered substrates; and Smart Cut substrates for compound semiconductor devices, as well as develops materials for the production of light emitting diodes. In addition, the company offers processed wafer stacking for imagers, RF, MEMS, and 3D integration applications; engineered bonded structures on various type of wafers; custom layer-transfer services; and concentrator photovoltaic (CPV) systems, as well as provides related services, including project development, financing support, operations and maintenance, and fully-integrated utility-scale CPV power plants for hot and dry climates. Soitec S.A. was founded in 1992 and is headquartered in Bernin, France.

1,223 Employees
Last Reported Date: 05/13/14
Founded in 1992

s.o.i.t.e.c. (SOI) Top Compensated Officers

Chief Executive Officer and Director
Total Annual Compensation: €423.5K
Co-Founder, Chairman of the Board, President ...
Total Annual Compensation: €555.8K
Compensation as of Fiscal Year 2014.

s.o.i.t.e.c. (SOI) Key Developments

Soitec Introduces its eSI90 Substrate

Soitec has introduced its eSI90 substrate, the newest high-end wafer in its radio-frequency silicon-on-insulator (RF-SOI) product family. The eSI90 is designed to improve the RF performance of mobile communication components such as high-linearity switches and antenna tuners that are integrated in high-end smart phones for LTE Advanced networks using carrier aggregation. This enables multiple LTE carriers to be used together, providing higher data rates to enhance user experience. The new wafers are Soitec's second generation of eSI(TM) substrates, based on engineered high-resistivity (HR) substrates. Today, eSI substrates have been widely adopted by leading RF semiconductor companies to address device cost and performance needs for the 3G and 4G/LTE mobile wireless markets. Soitec's eSI90 product exhibits higher effective resistivity than first-generation eSI wafers, enabling a 10-decibel (dB) improvement in linearity performance in RF front-end modules to address the stringent new requirements of LTE Advanced smart phones. Soitec developed a new metrology standard, the Harmonic Quality Factor (HQF), to predict the expected RF linearity of finished ICs. HQF correlates with the second harmonic distortion value of a coplanar waveguide deposited on the substrate. The new eSI90 wafers' HQF maximum value is set to -90 decibel-milliwatts (dBm) compared to -80 dBm for first-generation eSI substrates. The lower limit on eSI90 wafers enables chip makers to take advantage of design and process improvements to increase the RF performance of their semiconductor designs and to meet MIMO (Multi-Input Multi-Output) and Carrier Aggregation LTE Advanced requirements, providing faster data connections. The new eSI90 substrates are already under evaluation at multiple leading chipmakers and foundries. Production-ready samples are now available from Soitec.

Soitec to Axe 100 US Jobs Under Solar Restructuring

Soitec announced that it will restructure its solar business and cut 100 US jobs in the process. The decision, made by Soitec's board, is part of a plan to refocus the company's activities on its core electronics operations. The firm will seek an appropriate way to extract value from its solar assets, it pointed out.

Soitec Reports Consolidated Sales Results for the Third Quarter and Nine Months of Fiscal Year 2015

Soitec reported consolidated sales results for the third quarter and nine months of fiscal year 2015. For the quarter, the company reported total consolidated sales of €48.0 million, up by 45.0% on a yearly basis compared to €33.1 million a year ago. For the nine months, the company reported consolidated sales of €154 million compared to €124.1 million a year ago.

 

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