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Last €6.38 EUR
Change Today +0.172 / 2.77%
Volume 0.0
SGM On Other Exchanges
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As of 10:09 AM 10/6/15 All times are local (Market data is delayed by at least 15 minutes).

stmicroelectronics nv (SGM) Snapshot

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52 Week High
04/23/15 - €9.29
52 Week Low
10/30/14 - €4.99
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stmicroelectronics nv (SGM) Details

STMicroelectronics N.V. designs, develops, manufactures, and markets various semiconductor integrated circuits and discrete devices worldwide. The company offers a range of semiconductor products, including discrete and standard commodity components, application-specific integrated circuits, full-custom devices and semi-custom devices, micro-electro-mechanical systems, microcontrollers, sensors, digital consumer products, imaging products, memory products, media application processors, and application-specific standard products for analog, digital, and mixed-signal applications, as well as silicon chips and smartcards. It also provides subsystems and modules for the telecommunications, automotive, and industrial markets comprising mobile phone accessories, battery chargers, ISDN power supplies, and in-vehicle equipment for electronic toll payment. The company offers its products for various applications, such as automotive products, computer peripherals, telecommunications systems, consumer products, industrial automation, and control systems through its distributors and retailers. STMicroelectronics N.V. was founded in 1987 and is headquartered in Geneva, Switzerland.

43,620 Employees
Last Reported Date: 03/3/15
Founded in 1987

stmicroelectronics nv (SGM) Top Compensated Officers

Chairman of Management Board, Chief Executive...
Total Annual Compensation: $1.8M
Compensation as of Fiscal Year 2014.

stmicroelectronics nv (SGM) Key Developments

STMicroelectronics In Talks To Sell Digital Product Division

STMicroelectronics NV (ENXTPA:STM) is reportedly in talks with potential buyer, Yazid Sabeq, to sell ST's digital products division, reports the French business magazine, Challenges.

STMicroelectronics and Autotalks to Release Second-Generation V2X Chipset

STMicroelectronics and Autotalks are preparing to release their second-generation V2X chipset and will begin design-ins with the vendors of Smart-Driving systems in 2016. V2X technology connects vehicles to other vehicles (V2V) and infrastructure (V2I) within wireless range for safety and mobility applications, such as sharing advanced warnings of unseen hazards or coordinating with traffic signals to minimize queuing. Using advanced cryptographic engines, the chipset introduces uncompromised verification capacity for 100% of all messages sent over the air, assuring the processing of all required safety messages, while minimizing security risks from unauthorized access. The ST/Autotalks solution is agile and upgradable to support even more complex security schemes as these emerge in the future. The new chipset achieves low power consumption, high temperature range, high integration and efficiency, and is designed to meet the rigorous requirements for safety-critical systems and autonomous vehicles.

STMicroelectronics Drives the Pace of Sat-Nav Progress with Enhanced Support for 3D Apps on TESEO Navigation Engines

STMicroelectronics is bringing next-generation satellite navigation to drivers with the launch of enhanced, always-available, always-accurate 3D positioning on its TESEO III automotive-navigation ICs. The new TESEO DRAW firmware for ST's multi-constellation positioning chips enables navigation devices to provide continuous, accurate location and turn-by-turn instructions even when satellite signals are poor or unavailable, such as in tunnels, covered car parks, or multi-level highways. TESEO DRAW also enhances performance in built-up areas, such as in urban canyons, where conventional navigation systems can lose accuracy. TESEO DRAW merges the satellite information with data from vehicle sensors such as the gyroscope, accelerometer, and wheel-speed sensors, to calculate location accurately in three dimensions including elevation. If the satellite signal is poor, TESEO DRAW compensates for the loss of accuracy, and if the signal becomes unavailable, navigation continues uninterrupted based on calculated location (dead reckoning). Road tests carried out by ST in difficult under-cover and urban environments have demonstrated continuous tracking from entry to exit in complex multi-level car parks, and at street level between tall buildings, where conventional systems have been unable to track the vehicle. GNSS has revolutionized activities such as commercial logistics, asset management, and personal mobility. Over four billion GNSS devices are now in use worldwide. By enabling high-accuracy 3D dead reckoning, TESEO DRAW expands the opportunities for developers to commercialize new applications. TESEO DRAW firmware has multiple modes and is capable of referring to sensors on the vehicle's CAN bus or discrete sensors such as the odometer, reverse sensor, MEMS accelerometer and gyroscope, or MEMS inertial module connected to the TESEO III IC.


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