Last $12.74 USD
Change Today +0.41 / 3.33%
Volume 278.7K
RTEC On Other Exchanges
Symbol
Exchange
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As of 8:04 PM 03/2/15 All times are local (Market data is delayed by at least 15 minutes).

rudolph technologies inc (RTEC) Snapshot

Open
$12.34
Previous Close
$12.33
Day High
$12.77
Day Low
$12.30
52 Week High
03/2/15 - $12.77
52 Week Low
10/15/14 - $8.10
Market Cap
411.2M
Average Volume 10 Days
176.1K
EPS TTM
$0.13
Shares Outstanding
32.3M
EX-Date
--
P/E TM
97.6x
Dividend
--
Dividend Yield
--
Current Stock Chart for RUDOLPH TECHNOLOGIES INC (RTEC)

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rudolph technologies inc (RTEC) Details

Rudolph Technologies, Inc. designs, develops, manufactures, and supports process control defect inspection, advanced packaging lithography, metrology, and process control software systems used in semiconductor device manufacturing. It offers process and yield management solutions used in wafer processing and final manufacturing through standalone systems for macro-defect inspection, lithography, probe card test and analysis, and transparent and opaque thin film measurements. The company’s process control software solutions are used in semiconductor, solar, and LED manufacturing. It markets and sells its products to logic, memory, data storage, flat panel, and application-specific integrated circuit device manufacturers. The company offers its products in the United States, China, Germany, Japan, South Korea, Singapore, Taiwan, and Scotland. Rudolph Technologies, Inc. was founded in 1940 and is headquartered in Flanders, New Jersey.

586 Employees
Last Reported Date: 02/20/15
Founded in 1940

rudolph technologies inc (RTEC) Top Compensated Officers

Chairman and Chief Executive Officer
Total Annual Compensation: $661.2K
Chief Financial Officer, Principal Accounting...
Total Annual Compensation: $303.2K
Chief Operating Officer and Executive Vice Pr...
Total Annual Compensation: $279.6K
Compensation as of Fiscal Year 2013.

rudolph technologies inc (RTEC) Key Developments

Rudolph Technologies Inc. Presents at Stifel, Nicolaus Technology, Internet & Media Conference, Feb-10-2015 01:10 PM

Rudolph Technologies Inc. Presents at Stifel, Nicolaus Technology, Internet & Media Conference, Feb-10-2015 01:10 PM. Venue: The Westin St. Francis, San Francisco, California, United States. Speakers: Steven R. Roth, Chief Financial Officer, Principal Accounting Officer, Senior Vice President of Finance & Administration and Secretary.

Rudolph Technologies Inc. Reports Unaudited Consolidated Earnings Results for the Fourth Quarter and Full Year Ended December 31, 2014

Rudolph Technologies Inc. reported unaudited consolidated earnings results for the fourth quarter and full year ended December 31, 2014. For the quarter, the company reported revenues of $49,591,000 against $44,485,000 a year ago. Operating income was $3,570,000 against $1,872,000 a year ago. Income before income taxes was $2,510,000 against $419,000 a year ago. Net income was $1,494,000 against $2,054,000 a year ago. Diluted net income per share was $0.04 against $0.06 a year ago. Non-GAAP operating income was $8,113,000 against $4,164,000 a year ago. Non-GAAP net income was $4,461,000 against $3,020,000 a year ago. Diluted net income per share was $0.13 against $0.09 a year ago. For the year, the company reported revenues of $181,218,000 against $176,238,000 a year ago. Operating loss was $1,309,000 against operating income of $6,604,000 a year ago. Loss before income taxes was $6,691,000 against income before income taxes of $419,000 a year ago. Net loss was $4,640,000 against net income of $3,458,000 a year ago. Basic and diluted net income per share was $0.14 against $0.10 a year ago. Non-GAAP operating income was $21,445,000 against $14,838,000 a year ago. Non-GAAP net income was $10,366,000 against $8,736,000 a year ago. Basic and diluted net income per share was $0.31 against $0.26 a year ago.

Rudolph Technologies Inc. Ships JetStep Lithography System for High-Volume Fan-Out Packaging Applications

Rudolph Technologies Inc. announced that it has shipped the JetStep Advanced Packaging Lithography System to an outsourced assembly and test (OSAT) facility. This new customer will use the JetStep W Series for fan-out wafer level packaging (FO-WLP) applications. Rudolph’s JetStep Advanced Packaging Lithography Systems have been specifically designed to meet the challenges of newly-developed processes now emerging in back-end manufacturing. The JetStep W Series is intended for use with wafers or other round substrates.

 

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RTEC

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Valuation RTEC Industry Range
Price/Earnings NM Not Meaningful
Price/Sales 2.2x
Price/Book 1.5x
Price/Cash Flow NM Not Meaningful
TEV/Sales 1.0x
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