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Last $12.88 USD
Change Today +0.01 / 0.08%
Volume 101.3K
RTEC On Other Exchanges
New York
As of 8:04 PM 05/22/15 All times are local (Market data is delayed by at least 15 minutes).

rudolph technologies inc (RTEC) Snapshot

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52 Week High
04/28/15 - $13.84
52 Week Low
10/15/14 - $8.10
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rudolph technologies inc (RTEC) Details

Rudolph Technologies, Inc. designs, develops, manufactures, and supports defect inspection, advanced packaging lithography, thin film metrology, and data analysis systems and software used in microelectronics device manufacturers. It also offers process and yield management solutions used in wafer processing and final manufacturing through standalone systems for macro-defect inspection, lithography, probe card test and analysis, and transparent and opaque thin film measurements. The company’s process control software solutions designed to enhance run-to-run control, fault detection, classification, and tool automation. In addition, it provides spare parts and services. The company markets and sells its products to logic, memory, data storage, flat panel, and application-specific integrated circuit device manufacturers. Rudolph Technologies, Inc. offers its products in the United States, Taiwan, South Korea, Singapore, Austria, Japan, Germany, and China, as well as other European countries. The company was founded in 1940 and is headquartered in Flanders, New Jersey.

586 Employees
Last Reported Date: 02/20/15
Founded in 1940

rudolph technologies inc (RTEC) Top Compensated Officers

Chairman and Chief Executive Officer
Total Annual Compensation: $673.9K
Chief Financial Officer, Senior Vice Presiden...
Total Annual Compensation: $312.7K
Chief Operating Officer and Executive Vice Pr...
Total Annual Compensation: $298.5K
Vice President and General Counsel
Total Annual Compensation: $256.6K
Vice President and General Manager of Lithogr...
Total Annual Compensation: $265.0K
Compensation as of Fiscal Year 2014.

rudolph technologies inc (RTEC) Key Developments

Rudolph Technologies Inc., Annual General Meeting, May 20, 2015

Rudolph Technologies Inc., Annual General Meeting, May 20, 2015., at 10:00 US Eastern Standard Time. Location: One Rudolph Road. Agenda: To elect the two Class I directors named herein to serve for three-year terms expiring upon the 2018 Annual Meeting of Stockholders or until their successors are duly elected and qualified; to cast an advisory (non-binding) vote to approve the compensation of its named executive officers as disclosed in Compensation Discussion and Analysis and in the tabular and accompanying narrative disclosure regarding named executive officer compensation in this proxy statement; to ratify the appointment of Ernst & Young LLP as its independent registered public accounting firm for the year ending December 31, 2015; and to transact such other business as may properly come before the meeting and any adjournment or postponement thereof.

Rudolph Technologies Inc. Reports Unaudited Consolidated Earnings Results for the First Quarter Ended March 31, 2015; Provides Earnings Guidance for the Second Quarter of 2015 and Effective Tax Rate Guidance for the Year 2015

Rudolph Technologies Inc. reported unaudited consolidated earnings results for the first quarter ended March 31, 2015. For the quarter, the company reported revenues of $52,570,000 against $41,649,000 a year ago. Operating income was $5,117,000 against $113,000 a year ago. Income before income taxes was $3,097,000 against income loss income taxes of $1,041,000 a year ago. Net income was $1,848,000 or $0.06 per basic and diluted share against net loss of $724,000 or $0.02 per basic and diluted share a year ago. Non-GAAP operating income was $10,497,000 against $2,898,000 a year ago. Net income was $5,380,000 or $0.17 per diluted share against $999,000 or $0.03 per diluted share a year ago. Capital expenditures for the first quarter were approximately $1.1 million, depreciation expense was $900,000. For the second quarter 2015, the company is forecasting gross margin will be in the range of 52% to 53%. This guidance reflects lower anticipated software revenue as the company believes in second quarter it will be more in line with target model of 10% of revenue. For the second quarter revenues to be up between 5% and 10% with earnings per share to be between $0.16 and $0.19 per share. For the year, the company expected that effective tax rate will be in the range of 35% to 36%, and that rate excludes the R&D tax credit that expired at the end of last year and has not been renewed or reapproved by the U.S. Congress. The R&D tax credit affects overall effective rate by about 3 to 4 percentage points.

Rudolph Wins Lithography and Inspection Orders for Fan-Out Wafer Level Packaging Applications

Rudolph Technologies Inc. announced that a major outsourced assembly and test (OSAT) manufacturer has placed a $12 million order for a follow-on JetStep Advanced Packaging Lithography System and multiple NSX Inspection Systems for use in their planned capacity expansion. The tools, which will ship this quarter and next, will be used in high-performance fan-out wafer level packaging (FOWLP) applications. Further enhancing both the JetStep System and the NSX Systems is Rudolph’s DiscoverYield Management Software, which enables yield improvement through real-time analysis for faster solutions, increasing the productivity of each tool and the overall fab yield. The JetStep Advanced Packaging Lithography Systems have been specifically designed to meet the challenges of back-end manufacturing. The systems address the needs of both the existing flip chip processes (bump and copper pillar), as well as emerging processes, such as fan-out wafer level packaging, interlopers and 3D approaches. The JetStep system is unique in its ability to not only handle standard wafers, but also a wide range of substrates and sizes with significant process-induced warp, while being capable to print fine features for large packages such as interlopers in a single shot. With these capabilities, the system provides the flexibility to meet the diverse manufacturing requirements of advanced packaging with superior throughput when compared to legacy lithography tools initially designed for the front-end, wafer-based processes.


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