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Last $11.22 USD
Change Today -0.02 / -0.18%
Volume 133.0K
RTEC On Other Exchanges
New York
As of 8:04 PM 07/31/15 All times are local (Market data is delayed by at least 15 minutes).

rudolph technologies inc (RTEC) Snapshot

Previous Close
Day High
Day Low
52 Week High
04/28/15 - $13.84
52 Week Low
10/15/14 - $8.10
Market Cap
Average Volume 10 Days
Shares Outstanding
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rudolph technologies inc (RTEC) Details

Rudolph Technologies, Inc. designs, develops, manufactures, and supports defect inspection, advanced packaging lithography, thin film metrology, and data analysis systems and software used in microelectronics device manufacturers. It also offers process and yield management solutions used in wafer processing and final manufacturing through standalone systems for macro-defect inspection, lithography, probe card test and analysis, and transparent and opaque thin film measurements. The company’s process control software solutions designed to enhance run-to-run control, fault detection, classification, and tool automation. In addition, it provides spare parts and services. The company markets and sells its products to logic, memory, data storage, flat panel, and application-specific integrated circuit device manufacturers. Rudolph Technologies, Inc. offers its products in the United States, Taiwan, South Korea, Singapore, Austria, Japan, Germany, and China, as well as other European countries. The company was founded in 1940 and is headquartered in Flanders, New Jersey.

586 Employees
Last Reported Date: 02/20/15
Founded in 1940

rudolph technologies inc (RTEC) Top Compensated Officers

Chairman and Chief Executive Officer
Total Annual Compensation: $673.9K
Chief Financial Officer, Senior Vice Presiden...
Total Annual Compensation: $312.7K
Chief Operating Officer and Executive Vice Pr...
Total Annual Compensation: $298.5K
Vice President and General Counsel
Total Annual Compensation: $256.6K
Vice President and General Manager of Lithogr...
Total Annual Compensation: $265.0K
Compensation as of Fiscal Year 2014.

rudolph technologies inc (RTEC) Key Developments

Rudolph Technologies Inc. Appoints David B. Miller to the Board of Directors

Rudolph Technologies Inc. announced the appointment of David B. Miller to the Rudolph Board of Directors, effective July 20, 2015. Mr. Miller currently serves as the President of DuPont Electronics & Communications. He previously served in a variety of roles within DuPont including Group Vice President and Chief Operating Officer of DuPont Electronic & Communication Technologies from June 2007 to October 2009, Vice President and General Manager of DuPont Electronic Technologies from February 2001 until May 2007, Director of DuPont Investor Relations from April 1999 to February 2001 and Managing Director, Asia Pacific of DuPont Photopolymer & Electronic Materials from March 1997 to March 1999. From 1981 to February of 1997, he served in various engineering, sales and management positions within the array of DuPont businesses. In addition to the foregoing, Mr. Miller currently is a member of the Semiconductor Equipment and Materials International (SEMI) board, a member of the NC Chamber of Commerce Board of Directors and a Trustee at the University of Virginia Engineering School.

Rudolph Technologies, Inc. and DISCO Corporation Partner to Improve Wafer Saw Process

Rudolph Technologies Inc. and DISCO Corporation announced a collaborative partnership to deliver hardware and software solutions to optimize the wafer saw unit processes. These comprehensive solutions will enable their customers to consistently improve the quality and productivity of their advanced packaging products. The complete wafer saw solution includes: DISCO's fully automatic dicing saw for high-throughput, dual-cut processing, DISCO's ablation laser saw and stealth dicing saw, Rudolph's NSX® inspection system for post-saw inspection, Rudolph's new Equipment Sentinel fault detection and classification (FDC) software for real time monitoring and feedback of DISCO's dicing tools, and Rudolph's Discover Enterprise yield management software for sophisticated wafer-to-process tool correlations. The evolution of semiconductor device materials for advanced packaging has resulted in more stringent dicing process requirements. Process deviations and excursions during die singulation can result in chips and cracks that impact the long-term reliability of devices. The agreement between DISCO and Rudolph, which took effect June 1, 2015, will drive a new level of innovation in saw processing, including improved kerf control, chipping minimization and overall cost-of-ownership enhancement resulting in solutions that will accelerate advanced packaging adoption.

Rudolph Technologies, Inc. Introduces Equipment Sentinel

Rudolph Technologies Inc. introduced Equipment Sentinel, automated fault detection and classification (FDC) software solution that seamlessly combines key wafer-level data with high-fidelity tool signal and event data into a single framework, giving users a comprehensive, easy-to-understand view of their processes and equipment. Currently installed at multiple beta sites worldwide, fab personnel will use Equipment Sentinel software to extract the maximum value from the voluminous amounts of data generated in today’s semiconductor operations. Rudolph’s new Equipment Sentinel software is truly a next-generation FDC platform with built-in intelligence that can efficiently identify and isolate the cause of abnormal operating conditions and implement corrective actions to reduce product jeopardy and increase overall equipment effectiveness. Equipment Sentinel is the only process control software with a framework that provides global manufacturers of semiconductors, compound semiconductors, LEDs, and flat panel displays with a detailed snapshot of the performance for the process and of all the equipment in their fab. Its bi-directional data flows enable both sensor and product data to be tightly correlated into a single knowledge computing engine, maximizing signal-to-noise ratios, and thus, avoiding the false positives that typically plague many traditional FDC solutions. This is one of the many differentiating capabilities that allow users to quickly detect and resolve actual issues that impact operational performance and product yield. The implementation of Equipment Sentinel software can dramatically improve engineering effectiveness thereby significantly lowering the cost required to resolve complex tool performance issues resulting in improved fab operational efficiency.


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Price/Sales 1.9x
Price/Book 1.3x
Price/Cash Flow 1,800.6x
TEV/Sales 0.8x

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