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micronas semiconductor-reg (MCNSF) Details

Micronas Semiconductor Holding AG designs, manufactures, and sells sensor-based system solutions for automotive and industrial electronics customers worldwide. The company offers hall switches, linear hall sensors, direct angle sensors, current transducers, gas sensors, and embedded microcontrollers for smart actuators. Its products are used in various automotive and industrial applications comprising powertrains, chassis and body, safety and security, heavy machines/factory automation, white goods/home appliances, drivetrains, engine management, and convenience functions, as well as in building, home, and office automation applications. The company was founded in 1989 and is headquartered in Zurich, Switzerland.

922 Employees
Last Reported Date: 07/22/14
Founded in 1989

micronas semiconductor-reg (MCNSF) Top Compensated Officers

Chief Executive Officer and Member of Managem...
Total Annual Compensation: SFr.511.0K
Chief Financial Officer and Member of Managem...
Total Annual Compensation: SFr.225.0K
Compensation as of Fiscal Year 2013.

micronas semiconductor-reg (MCNSF) Key Developments

Micronas Unveils New HAL 15xy Switch Family

Micronas has unveiled HAL 15xy in SOT23 JEDEC package, an ISO 26262 compliant, low-power Hall switch sensor family. ISO 26262 is currently changing the vehicle development in a way, which no-one dared to imagine ten years ago when functional safety was coming more and more to the fore in the automotive industry. To enable most efficient failure localization and elimination, the HAL 15xy family provides a single-point fault metric (SPFM) of more than 60% which exceeds even the standard requirements of an ASIL A classification. The sensor monitors for example internal voltage, current and bias levels which derive from the band gap reference and compares them with predefined reference values in order to supervise the operating conditions of the Hall plate and its signal chain. Besides these monitoring functions, which were considered for the SPFM calculation, the HAL 15xy family features an optional and unique power-on self-test allowing the system to test the full signal path inside the sensor before the ordinary operation starts.

Micronas Announces Proposal for Board Changes

Micronas announced that its board of directors will propose to the next ordinary Shareholders Meeting to elect Stefanie Kahle-Galonske to the Board. She would replace Dr. Stefan Wolf, who will not be standing for re-election. Mrs. Kahle-Galonske has been Vice President & CFO of Markem Imaje (Dover Corporation), Geneva.

Micronas Announces Smallest Integrated Capacitor EMC-Proof Linear Hall Sensor

Micronas announced the first device of its HAL 8xy Hall-effect sensor portfolio with integrated capacitors. The HAC 830 combines the precise and robust functionality of the HAL 83x family with decoupling capacitors integrated into a tiny 3-pin TO92UP package. Based on its proven CMOS technology and designed for junction temperatures of up to 170 °C, the HAC 830 contains the intrinsic benefits of the HAL 83x family, such as higher accuracy and temperature stability for offset and sensitivity under harsh environmental conditions. The two 100 nF integrated capacitors, this sensor achieves an ESD level up to 8 kV and meets all stringent EMC requirements, such as bulk current injection (BCI). The HAC 830 is rated class A for radiated immunity BCI tests up to 300 mA according to ISO 11452-4 (open loop) and PSA B21-7110-C (closed loop) standards. The new HAC 830 with integrated decoupling capacitors brings customers a new range of benefits for their designs. When used in PCB-free applications such as throttle valve or turbo charger, the HAC 830 not only increases EMC performance but also improves reliability and reduces module costs. Due to its TO92UP package, the HAC 830 is the smallest sensor with integrated capacitors on the market thus offering much more design flexibility where space requirements are essential criteria. The TO92UP can be welded or soldered directly to a leadframe, a connector or a terminal, eliminating the need for a printed circuit board (PCB), thus reducing the total system size and cost. Furthermore, by using fewer external components and lowering the number of solder-joints, the overall system long-term reliability is significantly improved. The HAC 830 is qualified according to the AEC-Q100 automotive standard and has passed stringent validation test conditions, such as vibration, high pointcast force on package surface and long exposure to ambient temperatures up to 150 °C. According to the company commitment to protect the environment, TO92UP is realized as fully RoHS-compliant package.


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Valuation MCNSF Industry Range
Price/Earnings 36.5x
Price/Sales 1.0x
Price/Book 1.4x
Price/Cash Flow 36.8x
TEV/Sales 0.0x

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