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Last $11.83 USD
Change Today +0.08 / 0.68%
Volume 339.9K
KLIC On Other Exchanges
Symbol
Exchange
NASDAQ GS
Frankfurt
As of 8:10 PM 07/2/15 All times are local (Market data is delayed by at least 15 minutes).

kulicke & soffa industries (KLIC) Snapshot

Open
$11.80
Previous Close
$11.75
Day High
$11.91
Day Low
$11.77
52 Week High
02/25/15 - $16.54
52 Week Low
06/30/15 - $11.66
Market Cap
908.8M
Average Volume 10 Days
452.0K
EPS TTM
$0.92
Shares Outstanding
76.8M
EX-Date
08/1/85
P/E TM
12.8x
Dividend
--
Dividend Yield
--
Current Stock Chart for KULICKE & SOFFA INDUSTRIES (KLIC)

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kulicke & soffa industries (KLIC) Details

Kulicke and Soffa Industries, Inc. designs, manufactures, and sells capital equipment and expendable tools to assemble semiconductor devices, including integrated circuits, discrete devices, light-emitting diodes (LED), and power modules. It operates in two segments, Equipment and Expendable Tools. The Equipment segment manufactures and sells a line of ball bonders to connect very fine wires made of gold or copper between the bond pads of the semiconductor devices or dies, and the leads on its package; wafer level bonders, which mechanically applies bumps to dies for some variants of the flip chip assembly process; heavy wire wedge bonders to connect semiconductor chips for the power packages, power hybrids, and automotive modules; and manual wire bonders, as well as offers spare parts, equipment repair, and training services. The Expendable Tools segment provides various expendable tools for a range of semiconductor packaging applications. This segment’s products include capillaries for use in ball bonders; bonding wedges for use in heavy wire wedge bonders; dicing blades that are used for cutting silicon wafers into individual semiconductor dies, and semiconductor devices that have been moulded in a matrix configuration into individual units; package singulation blades for the LED markets; and copper capillaries for copper wire bonding applications. The company also services, maintains, repairs, and upgrades its equipment. It serves semiconductor device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers, and automotive electronics suppliers primarily in the United States and the Asia/Pacific region. Kulicke and Soffa Industries, Inc. was founded in 1951 and is headquartered in Singapore.

1,943 Employees
Last Reported Date: 11/12/14
Founded in 1951

kulicke & soffa industries (KLIC) Top Compensated Officers

Chief Executive Officer, President and Direct...
Total Annual Compensation: $690.2K
Chief Financial Officer, Chief Information Of...
Total Annual Compensation: $401.9K
Chief Quality Officer and Senior Vice Preside...
Total Annual Compensation: $299.4K
Senior Vice President of Legal Affairs and Ge...
Total Annual Compensation: $279.7K
Vice President of Global Engineering
Total Annual Compensation: $269.6K
Compensation as of Fiscal Year 2014.

kulicke & soffa industries (KLIC) Key Developments

Kulicke and Soffa Industries, Inc. Reports Unaudited Consolidated Earnings Results for the Second Quarter and Six Months Ended March 28, 2015; Provides Net Revenue Guidance for the Third Quarter Ending June 27, 2015

Kulicke and Soffa Industries, Inc. reported unaudited consolidated earnings results for the second quarter and six months ended March 28, 2015. For the quarter, the company reported net revenue of $145,227,000 compared to $114,206,000 a year ago. Income from operations was $9,791,000 compared to $10,111,000 a year ago. Income from operations before income taxes was $9,928,000 compared to $10,157,000 a year ago. Net income was $7,931,000 or $0.10 per basic and diluted share compared to $9,070,000 or $0.12 per basic and diluted share a year ago. Net cash provided by operating activities was $2,118,000 compared to $41,021,000 a year ago. For the six months period, the company reported net revenue of $252,665,000 compared to $193,319,000 a year ago. Income from operations was $19,517,000 compared to $7,903,000 a year ago. Income from operations before income taxes was $19,613,000 compared to $8,109,000 a year ago. Net income was $15,773,000 or $0.20 per diluted share compared to $7,113,000 or $0.09 per basic and diluted share a year ago. Net cash provided by operating activities was $48,560,000 compared to $78,270,000 a year ago. The company currently expects net revenue in the third fiscal quarter of 2015, ending June 27, 2015, to be in the range of approximately $160 million to $170 million.

Kulicke and Soffa Industries, Inc. Introduces New Offerings at SMT Hybrid Packaging Show

Kulicke and Soffa Industries, Inc. will be showcasing newly launched products and equipment during the SMT Hybrid Packaging show in Germany from May 5-7. The new, enhanced capability, hybrid wedge bonder, the Asterion(TM), was successfully launched in March in China and will be debuting in Europe at the SMT show. The new Configurable High-Power Bond Head will also be introduced at the show along with the iFlex T2, iFlex H1, and Hybrid 3 advanced pick-and-place solutions and the PowerFusion(TM) High Performance Semiconductor wedge bond solution. The Asterion Wedge bonder is built on an enhanced architecture that includes an expanded bond area, new robust pattern recognition capabilities and extremely tight process controls. Together these deliver heightened productivity, bonding quality, and reliability. The enlarged bondable area enhances flexibility and reduces line integration costs. The New Configurable High Power Bond Head addresses the industry’s growing and changing applications needs by handling a multitude of interconnect materials including large and small aluminum wire, copper wire, PowerRibbon(TM), as well as aluminum copper-clad ribbon. PowerFusion High Performance Semiconductor Wedge Bonder is driven by a new powerful direct-drive motion system and expanded pattern recognition capabilities which deliver productivity and reliability. The iFlex T2 and H1 systems offer best in class flexibility, fast changeover and the lowest defect per million (DPM) rates in the industry. These advanced solutions can place all types of passive and discrete SMT components and also handle multifunctional and end-of-line placements. The Hybrid 3 is a multi-application solution for advanced packaging with one of the lowest DPM and throughput in the industry. It delivers a placement accuracy of less than 10 µm, making it ideal for wafer level packaging, FOWLP, SiP, MCM, flip-chip, modules and embedded components. Having evolved from the high speed AX/iX product family, the Hybrid 3 is highly capable of placing both die and passive component with a single machine.

Kulicke and Soffa Industries, Inc. Launches AsterionTM – Drives Enhancements for Hybrid Wedge Bonding

Kulicke and Soffa Industries, Inc. announced the launch of their new, enhanced capability, hybrid wedge bonder, the Asterion. This single platform addresses the industry’s growing and changing applications needs by handling a multitude of interconnect materials including large and small aluminum wire, copper wire, PowerRibbonTM, as well as aluminum copper-clad ribbon. The Asterion hybrid solution expands the Company’s extensive wedge bonding offerings by delivering a list of solution oriented enhancements focusing on: Heightened Productivity with a large bondable area (300mm x 300mm); improved MTBA with enhanced PR plus Geometric Model mode; and faster cycle time with direct drive motion system and advanced PR modes, Improved Performance due to a very stable platform for greater bond placement repeatability; and extremely consistent process results, Advanced capabilities with innovative software and hardware features such as ultrasonic normalization, host communications, common data transfer and traceability functions; a Loop Former option that enables advanced square loop profiles; and advanced interconnect capability with an improved configurable bond head and Ease of Use is given a boost with a new Bond Head Set-up Aid; an Intuitive Graphical User Interface (Windows 7 OS); a Graphical Editor for convenient program editing; Context Sensitive Help; and Easy Program Conversion from 3600/3700Plus to Asterion.

 

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Industry Analysis

KLIC

Industry Average

Valuation KLIC Industry Range
Price/Earnings 12.8x
Price/Sales 1.4x
Price/Book 1.1x
Price/Cash Flow 12.7x
TEV/Sales 0.6x
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