KLA--Tencor Corporation Reports Unaudited Consolidated Earnings Results for Third Quarter and Nine Months Ended March 31, 2015; Reports Asset Impairment Charges for Third Quarter Ended March 31, 2015; Reiterates Earnings Guidance for the Fourth Quarter Ending June 2015
Apr 23 15
KLA-Tencor Corporation reported unaudited consolidated earnings results for third quarter and nine months ended March 31, 2015. For the quarter, the company reported total revenues of $738,459,000 against $831,599,000 a year ago. Income from operations was $194,986,000 against $261,163,000 a year ago. Income before income taxes was $166,454,000 against $251,246,000 a year ago. Net income was $131,638,000 or $0.81 per basic and diluted share against $203,581,000 or $1.21 per diluted share a year ago. Non-GAAP net income was $137,362,000 or $0.84 per diluted share against $206,216,000 or $1.23 per diluted share a year ago.
For the nine months, the company reported total revenues of $2,057,717,000 against $2,195,065,000 a year ago. Income from operations was $458,853,000 against $599,056,000 a year ago. Income before income taxes was $259,193,000 against $567,855,000 a year ago. Net income was $224, 139,000 or $1.36 per diluted share against $454,024,000 or $2.70 per diluted share a year ago. Net cash provided by operating activities was $242,417,000 against $237,727,000 a year ago. Capital expenditures, net were $10,326,000 against $18,220,000 a year ago. Non-GAAP net income was $328,937,000 or $1.99 per diluted share against $464,217,000 or $2.76 per diluted share a year ago.
The company reported asset impairment charges for third quarter ended March 31, 2015. For the quarter, the company reported asset impairment charges of $1,698,000.
The company reiterated earnings guidance for the fourth quarter ending June 2015. For the period, the new orders are expected to be in the range of $550 million to $750 million. Revenues are expected in the range of $710 million to $790 million, with non-GAAP earnings per share in the range of $0.78 to $1.02 per share.
KLA-Tencor Corporation Introduces New Portfolio for Advanced Semiconductor Packaging
Apr 17 15
KLA-Tencor Corporation announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP and ICOS T830. Designed for characterization and monitoring of the diverse processes used in wafer-level packaging, CIRCL-AP enables all-surface wafer defect inspection, review and metrology at high throughput. The ICOS T830 provides fully automated optical inspection of integrated circuit packages, leveraging high sensitivity with 2D and 3D measurements to determine final package quality for a wide range of device types and sizes. Both systems help IC manufacturers and outsourced semiconductor assembly and test facilities address challenges, such as finer feature sizes and tighter pitch requirements, as they adopt innovative packaging techniques. The CIRCL-AP includes multiple modules that utilize parallel data collection for fast, cost-efficient process control of advanced wafer-level packaging processes. It supports a range of packaging technologies, including wafer-level chip scale packaging, fan-out wafer-level packaging and 2.5D/3D IC integration using through silicon vias (TSVs). The industry-proven 8-Series serves as the CIRCL-AP's front side defect inspection and metrology module, which couples LED scanning technology with automated defect binning to reduce nuisance and speed detection of critical packaging defects, such as TSV cracks and redistribution layer shorts. The CV350i module, based on KLA-Tencor's VisEdge technology, enables detection, binning and automated review of wafer edge defects and metrology for critical edge trim and bonding steps in the TSV process flow. With multiple imaging and illumination modes, the Micro300 module can produce high precision 2D and 3D metrology for bump, redistribution and TSV processes. Utilizing a flexible architecture, the CIRCL-AP can be configured with one or more modules to address the requirements of specific packaging applications, while the handler supports bonded, thinned and warped substrates. The ICOS T830 extends the ICOS component inspection series to address yield challenges associated with advanced packaging types, including lead frame, fan-out wafer-level, flip-chip and stacked packages. Enhanced package visual inspection capability, xPVI, enables high sensitivity detection of top and bottom component surface defects, such as voids, scratches, pits, chips and exposed wires. To ensure quality standards are being met for edge memory and logic packaged devices, the ICOS T830 offers high speed 3D ball, lead and capacitor metrology, package z-height measurement and component side inspection. The xCrack+ inspection station enables accurate detection of micro-crack defects—a key failure mechanism of thinner components used in mobile applications. The ICOS T830 incorporates high-throughput operation of four independent inspection stations and high-speed sorting of the inspected packaged components to achieve cost-effective component quality control.
KLA-Tencor Corporation Appoints Michael D. Kirk as Executive Vice President, Global Service and Support Division
Apr 16 15
As a result of the realignment of the executive management team of KLA-Tencor Corporation, on April 13, 2015, Michael D. Kirk, Executive Vice President, Global Customer Organization and Global Manufacturing Operations, was named to a newly created position as Executive Vice President, Global Service and Support Division. In this role, Dr. Kirk will lead the Company's enhanced focus on providing innovative and distinctive customer service solutions and support to optimize the effectiveness, performance, and return on investment of customers' installed base of process control equipment. Dr. Kirk will be responsible for all aspects of worldwide customer service, including operations, sales, marketing, as well as customer equipment installations. Dr. Kirk will continue to be a named executive officer of the Company, his compensation is unchanged and he will continue report to the Company's Chief Executive Officer.