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infineon technologies ag (IFX) Details

Infineon Technologies AG offers semiconductors and system solutions in Europe, the Middle East, Africa, the Asia-Pacific, and the Americas. It operates through four segments: Automotive, Industrial Power Control, Power Management & Multimarket, and Chip Card & Security. The Automotive segment offers microcontrollers automotive and industrial applications; software development platform; discrete power semiconductors; IGBT modules; voltage regulators; power ICs; bus interface devices; magnetic and pressure sensors; and wireless transmit and receive ICs. Its products used in chassis and comfort electronics, electric and hybrid vehicles, and power trains, as well as safety and security applications. The Industrial Power Control segment provides IGBT modules, discrete IGBTs, bare dies, and driver ICs used in charger station for electric vehicles, energy transmission and conversion, home appliances, industrial drives, industrial vehicles, renewable energy generation, tractions, and uninterruptable power supplies. The Power Management & Multimarket segment offers discrete low-voltage and high-voltage power transistors, driver ICs, control ICs, RF power transistors, CMOS RF switches for antenna modules, antenna tuning ICs, MEMS and ASICs for silicon microphones, and customized chips, as well as small-signal components, such as transient voltage suppressor and low noise amplifiers. Its products are used in a range of applications, including cellular network infrastructure, light management and LED lighting systems, micro-inverter for photovoltaic rooftop systems, mobile devices, and power supplies. The Chip Card & Security segment provides contact-based and contactless security controllers, and dual interface security controllers. Its products are authentication, government identification, health care cards, mobile communication, near field communication, payment system, ticketing access control, and computing applications. The company is headquartered in Neubiberg, Germany.

30,493 Employees
Last Reported Date: 02/3/15

infineon technologies ag (IFX) Top Compensated Officers

Chief Executive Officer, Labor Director and M...
Total Annual Compensation: €1.4M
Chief Financial Officer, Executive Vice Presi...
Total Annual Compensation: €993.0K
Executive Vice President and Member of the Ma...
Total Annual Compensation: €993.0K
Compensation as of Fiscal Year 2014.

infineon technologies ag (IFX) Key Developments

Infineon Technologies AG Unveils New Embedded Security Controllers for Smart Wearables

Infineon Technologies AG has announced its new embedded security controllers for handsets and smart wearables. The new members of the SOLID FLASH-based SLE 97 product family provide industry's high memory capacity of up to 1.5MByte and are available with ultra-small packages. New functionalities require memory capacity to securely store biometric data or encryption keys on the security controller: these include e.g. fingerprint authentication enabling FIDO (Fast IDentity Online), secured cloud services, NFC-based applications or advanced online payment. Furthermore, Infineon has extended its Chip Scale Package (CSP) technology to high-end security controllers, providing a package solution which is considerably smaller than the standard SMD (Surface mounted device) packages. The combination of both - smallest PCB footprints and the flexibility of high-end security controllers – enables system designers as well as equipment manufacturers to address new markets such as smart wearables. The SLE 97 security controller family has explicitly been developed for the maximum performance and for high security to address the high-end UICC (Universal Integrated Circuit Card) and the embedded Secure Element markets. The product family has now been extended by adding security controllers with 1.5MByte and 1.3MByte memory density. Both products are based on an Infineon security chip architecture utilizing an ARM SecurCore SC300 enhanced by Infineon's cache and SOLID FLASH technology. Standard features such as 32kByte RAM and Crypto-coprocessors for both symmetric and asymmetric keys are available on all platforms. An additional 2kByte of internal cache boosts the system performance, which allows the designers to address even the most demanding applications such as fingerprint match-on-card.

Infineon Technologies AG Presents "IBadge" Device Identity Management System for Smart Home Solutions at Embedded World

Infineon Technologies AG presented "iBadge", a partner-developed device identity management solution for smart home applications. "iBadge" is a plug and play solution for secure connection of devices in the Internet of Things (IoT). Due to "iBadge", users can comfortably and securely access their home networks via smart phone apps and cloud-based services to remotely switch on heating on the way home or access video surveillance while travelling. In the IoT, device identification and management is essential to counteract security threats that arise from the use of fake servers or fake devices. To prevent threats, mobile devices, smart cars and even home appliances must be securely identified before being granted access to a connected system. The Infineon OPTIGA(TradeMark) Trust authentication chip is at the core of the "iBadge" solution. When integrated into smart heating or lighting systems or surveillance cameras, this security chip is used to authenticate those devices that are authorized to access the network. Compared to solutions available today, "iBadge" makes device identity management more secure and easier while reducing manual work during the production process. The "iBadge" evaluation board is provided with an IoT system in package (SiP) including the microcontroller unit, a wireless module, a host interface and the OPTIGA Trust authentication chip. Therefore, the solution allows IoT device makers as well as traditional home electronics makers to quickly integrate "iBadge" into their devices.

Infineon Technologies AG Launches an Ultra-High ±5cm Resolution, Miniature MEMS

Infineon Technologies AG has launched an ultra-high ±5cm resolution, miniature MEMS (Micro Electro Mechanical Systems) pressure sensor for use in mobile and wearable gadgets and IoT (Internet of Things) devices. The DPS310 is a low-power digital barometric pressure sensor that enables the development of new and enhanced navigation, location, well-being, gesture recognition and weather monitoring applications. Delivering accurate and stable performance across a wide temperature range, the DPS310 is ideal for indoor navigation and assisted location applications – such as floor detection in shopping malls and parking garages– and outdoor navigation where it can help to improve navigation accuracy or support ‘dead reckoning’ when GPS signal is not available. In addition, the ability to provide accurate data for calculating elevation gain and vertical speed suits activity tracking in mobile and wearable health and sports gadgets, while ultra-precise pressure measurement opens up new possibilities for gesture recognition and the detection of rapid weather changes. The Infineon DPS310 pressure sensor is based on the capacitive sensing principle rather than the piezo-electric principle employed in most other digital pressure sensors. This guarantees high precision across a broad range of temperatures even when temperature changes rapidly. This is clearly an advantage since the temperature inside a mobile device can change quickly due to several heat sources. In high-precision mode the DPS310 can measure heights within ±5cm enabling the exact detection of transient states, which are the biggest challenges of indoor navigation. The high resolution of Infineon’ pressure sensor could help, for example, in identifying when a person is moving from one floor of a building to another and triggering the download of a new floorplan. High-accuracy height measurement is also required by sports and fitness applications that need to differentiate between the different types of ‘steps’ a wearer might be taking and the corresponding calorie ‘burn rate’. For the new pressure sensor Infineon makes use of advanced semiconductor process technologies that were originally developed for the company’s automotive sensors. The sensors are highly reliable and, for example, integrated in safety applications such as airbags. These technologies contribute to both the small device size of 2.0mm x 2.5mm x 1.0mm and its low-power consumption. In low power mode the current consumption is only 3µA at one measurement per second, falling to just less than 1µA in standby mode. An integrated FIFO that stores the last 32 measurements helps to further reduce overall system power consumption by extending the time that a host processor can remain in sleep mode between sensor readouts. The DPS310 provides reliable and accurate performance at pressures from 300hPa to 1200hPa and at temperatures from -40°C to 85°C. Multiple measurement and resolution modes allow the device to be optimized to the target application. For example, one-time measurement can be configured for GPS altitude accuracy, while the option to take several measurements per second will address the needs of gesture recognition. Each sensor is calibrated individually and has onboard the calibration coefficients for accurate compensation of measured pressure and temperature values. Sensor measurement data and calibration coefficients are available through the sensor’s. Availability: Engineering samples of the DPS310 are available in May 2015 with volume production planned for third quarter of 2015. Infineon will support design-in with starter kits and evaluation boards. The DPS310 operates at a supply voltage of 1.7V to 3.6V. It is supplied in a space saving 8-pin LGA package with dimensions of only 2.0mm x 2.5 mm x1.0mm.


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