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spansion inc-class a (CODE) Details

Spansion, Inc. designs, manufactures, develops, and sells embedded systems semiconductors. The company offers flash memory, microcontrollers, and analog and mixed-signal products, and embedded system-on-chip solutions. It provides a family of parallel and serial NOR flash memory, as well as a range of lower density NAND and embedded managed NAND flash memory products for non-commodity embedded applications. The company also offers a family of 8-, 16-, 32-bit proprietary and 32-bit ARM based microcontrollers that are used in automotive applications, such as body electronics, chassis and safety, power train and hybrid, home appliances, digital audio/video equipment, and industrial and office equipment. In addition, it provides power management integrated circuits (IC), including DC/DC converters, voltage regulators and supervisors, and power monitoring and reset ICs; and a family of LED lighting driver ICs and energy harvesting solutions. In addition, it is involved in licensing intellectual property to third parties, as well as assisting customers in developing and prototyping their designs by providing software and hardware development tools, drivers, and simulation models for system-level integration. The company markets and sells its products directly or through third-party distributors to original equipment manufacturers, original design manufacturers, distributors, and contract manufacturers in Japan, the Asia Pacific, Europe, the Americas, and South Korea. Spansion, Inc. was incorporated in 2005 and is headquartered in Sunnyvale, California.

3,893 Employees
Last Reported Date: 02/11/15
Founded in 2005

spansion inc-class a (CODE) Top Compensated Officers

Chief Executive Officer, President and Direct...
Total Annual Compensation: $897.4K
Chief Financial Officer, Principal Accounting...
Total Annual Compensation: $439.2K
Compensation as of Fiscal Year 2014.

spansion inc-class a (CODE) Key Developments

Spansion Inc. Introduces HyperRAM Memory

Spansion Inc. announced the first RAM device with the HyperBus interface. The Spansion HyperRAM memory, a companion to HyperFlash memory, enables a simple and cost-effective solution for SoCs and microcontrollers (MCU), where both the flash and RAM are connected on the same 12-pin HyperBus interface. With a read throughput up to 333 megabytes-per-second, the HyperBus devices enable fast boot, graphics display and real-time XIP applications. Spansion HyperRAM memory can operate at frequencies as fast as 166MHz in DDR mode with a fast, random initial access time of 36ns. Faster read access means less compressed, higher resolution graphics can be read, resulting in a sharper display. The combination of HyperFlash and HyperRAM enables simpler board designs and software development, thus enabling faster time to market. Applications which can take advantage of these benefits include automotive instrument clusters, infotainment, navigation systems, advanced driver assistance systems, digital cameras, projectors, factory automation, medical equipment, home automation and appliances, hand-held and other IOT devices. Spansion 64Mb HyperRAM will be sampling in the second quarter of 2015. It will be available in both 3V and 1.8V versions packaged in the market compatible 5x5 array BGA.

Spansion Inc. Launches First Automotive Power Management IC

Spansion Inc. announced its first automotive-grade, six-channel power management IC for advanced driver assistance systems (ADAS). This highly-efficient, multi-rail power management solution features solid control pins for each rail, precise voltage integrity monitors and a windowed watchdog timer to lower the system heat, complexity and solution cost for an ADAS implementation. The product family also supports the automotive safety integrity level-B (ASIL-B) and is available for sampling now. Spansion's S6BP401A series is a secondary power source IC for ADAS systems. This single-chip solution has a 6-channel power output, which includes a 4-channel DC/DC converter and 2-channel LDO. Integrating output setting impedance and phase compensation circuits internally for all channels, the S6BP401A reduces the PCB size and bill of materials, enabling a smaller, cost-effective ADAS. This series of parts is equipped with a built-in windowed watchdog timer, separate pins to turn on/off each channel and dedicated pins to monitor the power integrity of each channel. This ensures a highly reliable system, compliant with automotive safety integrity level-B (ASIL-B). Each output level is compatible with various system requirements and each voltage level is set when the product is shipped from the factory in accordance with customer specifications. Spansion S6BP401A key features: 6-channel PMIC: 4-channel DC/DC converter (factory preset output voltage), 2-channel LDO (factory preset output voltage), and phase compensation circuits for each channel are integrated into a 6x6mm single QFN40 plastic package. S6BP401A supplies all power rails for ADAS reducing PCB area and BOM. Functional safety: S6BP401A equips individual pins to control each channel. It also equips these pins to control their own output voltage integrity for each channel. The pins and a built-in watchdog timer help the users to build a functionally safe system that is as safe as ASIL-B. In addition, S6BP401A includes multiple safeguard features. Electric current provision capacity: S6BP401A is capable of supplying the high current required to support a high-powered SoC and DDR memory built into ADAS (maximum: 3A/channel). The Spansion S6BP401A multi-channel PMIC for ADAS is currently sampling in a 40-pin QFN package. The sample price is $13/unit.

Spansion and XMC Signs 3D NAND Technology Development and Cross-Licensing Agreements

Spansion and XMC reported that the companies have signed 3D NAND technology development and cross-licensing agreements. The explosion of data created by the rapid growth of the Internet of Things and more advanced automotive systems is placing greater demands on storage technologies. 3D NAND will revolutionize how data will be more efficiently stored in the future. XMC will continue to leverage its edge manufacturing capabilities, extensive volume production experience with charge trap technology and world-class R&D team in memory expertise. The first 3D NAND products will be available in 2017.


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