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Last ¥1,988 JPY
Change Today -31.00 / -1.54%
Volume 161.2K
6728 On Other Exchanges
As of 1:34 AM 05/7/15 All times are local (Market data is delayed by at least 15 minutes).

ulvac inc (6728) Snapshot

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52 Week High
06/9/14 - ¥2,345
52 Week Low
10/17/14 - ¥1,168
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ulvac inc (6728) Details

ULVAC, Inc. engages in the development, manufacture, sale, customer support, and import/export of vacuum equipment, peripheral devices, and vacuum components and materials in Japan and internationally. It operates in Vacuum Equipment Business and Vacuum Application Business segments. The company offers various equipments, including sputtering systems, chemical vapor deposition systems, vacuum evaporation systems, vapor deposition polymerization systems, ashing systems, etching systems, ion implantation systems, vacuum furnaces, roll coaters, freeze drying/vacuum drying systems, vacuum distillation systems, automatic leak testers, and others. It also provides components that comprise vacuum pumps, including dry pumps, oil rotary pumps, mechanical booster pumps, ion pumps, turbo molecular pumps, oil diffusion pumps, cryo pumps, and titanium getter pumps; vacuum gauges, such as capacitance manometers, pirani vacuum gauges, extremely high vacuum gauges, and hot cathode type ionization vacuum gauges; process gas monitors; leak detectors; thin film measurement/deposition controllers; optical process monitors; vacuum valves, such as angle, gate, and other types of valves; parts for ultra-high vacuum; power generators; transfer robots; and software products. In addition, the company delivers sputtering targets, high performance materials, and nano-metal inks, as well as offers a range of services, including set-up and operation, field service, analysis, material and parts supply, and vacuum pump maintenance services. It serves display, solar cell, semiconductor, electronics, electrics, metals, machinery, automotive, chemical, food, and pharmaceutical industries, as well as universities and research centers. ULVAC, Inc. was founded in 1952 and is headquartered in Chigasaki, Japan.

5,971 Employees
Last Reported Date: 09/26/14
Founded in 1952

ulvac inc (6728) Top Compensated Officers

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ulvac inc (6728) Key Developments

ULVAC, Inc. and Robert Bosch GmbH Sign Basic Agreement for Joint Development of Piezoelectric Device for MEMS

ULVAC, Inc. and Robert Bosch GmbH announced they have signed a basic agreement to jointly develop piezoelectric device (PZT) for MEMS. Bosch selected ULVAC' SME-200 sputtering system for the development of upcoming leading edge MEMS. With the growth of MEMS technology, sensors and actuators that use piezoelectric device have been developed and commercialized in recent years. ULVAC believe that MEMS manufacturing technology, such as thin-film deposition and dry etching will be the key factor in producing high quality piezoelectric device in years to come.

ULVAC Announces Low Temperature PZT Sputtering Technology

ULVAC, Inc. announced low temperature PZT sputtering technology in mass production scale enabling future advanced MEMS device integrated on CMOS which will be the mainstream of next generation MEMS devices. Many sensors such as accelerometers, gyros, and pressure sensors are widely used inside high performance smart phones, tablet PCs, and automobiles enabling the "Smart society" representing the IoT world. The increasing demand and the key element to enable this functionality, is the piezoelectric MEMS (Micro Electro Mechanical Systems) device, using a piezoelectric thin film material called PZT (lead zirconate titanate, Pb(Zr,Ti)O3). Examples of applications in use are: actuators for auto focus lenses on digital cameras, and inkjet heads for printers. The future holds that, higher performance, multi-functional and smaller piezoelectric MEMS devices for the next generation of advanced sensor technology is rapidly expanding its applications by the integration with CMOS (Complementary Metal Oxide Semiconductor) devices. PZT, Piezo-electric MEMS is one of the most practical MEMS devices available today, however, the process temperature was an obstacle, to integrate the MEMS device directly onto a CMOS device. A CMOS device due to its nature, can only withstand a process temperature of 500 degrees C or lower. A typical crystallization temperature for a PZT thin film is 600 degrees C for sputtering and 700 degrees C for Sol-Gel. ULVAC has developed unique innovative technology allowing integration of the piezoelectric MEMS device onto a CMOS device, thus achieving high level piezoelectric performance, withstand voltage reliability, and cycle performance. This is accomplished by utilizing unique sputtering technology with process temperature below 500 degrees C. The piezoelectric device, using thin film PZT, is formed by five (5) layers which are: an adhesion layer, a lower electrode layer, a buffer layer, a piezoelectric (PZT) layer, and upper electrode layer. All the accumulated layers are formed sequentially, through one single sputtering system developed by ULVAC. This multi-chamber type sputtering system (model SME-200) allows for consistent process flow, optimizing each individual layer inside each process chamber respectively, achieving highly stable repeatability of the stacked layer performance, and also improving throughput, to that which is that is very suitable for mass production purposes. Additionally this system is designed to achieve highly uniform and stable process utilizing 8-inch silicon wafers, the large size substrate available for MEMS device mass production known. Maximum seven (7) process chamber such as DC and RF magnetron sputtering chamber, RTA (Rapid Thermal Annealing) chamber to accelerate crystallization, and a load-lock chamber are utilized. Parameters verified are; piezoelectric constant (e31) - 17 C/m2, dielectric strength voltage +/- 100V, cycle performance >1,011 times (PZT thin film thickness of 2.0 um electrical performance). Highly uniform and stable deposition technology on an 8 inch wafer scale utilizing specially designed sputtering chamber for dielectric materials. High deposition rate and throughput in mass production scale for PZT thin film. ULVAC unique and stable process allowing high performance PZT thin film in mass production scale under 500 degrees C. Highly repeatable accumulation process of PZT thin film piezoelectric device is formed within one system in mass production scale.

ULVAC, Inc. Reports Consolidated Earnings Results for the First Half Ended December 31, 2014; Provides Earnings Guidance for the Year Ending June 30, 2015

ULVAC, Inc. reported consolidated earnings results for the first half ended December 31, 2014. For the half year, the company reported operating income of ¥4,985 million, ordinary income of ¥5,796 million and net income of ¥4,194 million or ¥68.43 per diluted share on net sales of ¥85,299 million compared to operating income of ¥7,203 million, ordinary income of ¥8,098 million and net income of ¥7,073 million or ¥96.44 per diluted share on net sales of ¥91,644 million reported a year ago. For the year ending June 30, 2015, the company expects to report operating income of ¥9,000 million, ordinary income of ¥8,500 million and net income of ¥6,500 million or ¥124.63 per share on net sales of ¥175,000 million.


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6728 Competitors

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AIXTRON SE €6.40 EUR +0.279
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Pfeiffer Vacuum Technology AG €84.19 EUR -2.81
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Valuation 6728 Industry Range
Price/Earnings 15.6x
Price/Sales 0.6x
Price/Book 1.4x
Price/Cash Flow 11.5x
TEV/Sales NM Not Meaningful

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