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Last 71.40 TWD
Change Today +0.50 / 0.71%
Volume 371.7K
As of 2:32 AM 09/1/15 All times are local (Market data is delayed by at least 15 minutes).

innodisk corp (5289) Snapshot

Open
70.50
Previous Close
70.90
Day High
71.80
Day Low
70.00
52 Week High
04/21/15 - 127.62
52 Week Low
08/25/15 - 61.40
Market Cap
4.4B
Average Volume 10 Days
880.5K
EPS TTM
8.16
Shares Outstanding
62.1M
EX-Date
08/18/15
P/E TM
8.7x
Dividend
4.29
Dividend Yield
6.00%
Current Stock Chart for INNODISK CORP (5289)

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innodisk corp (5289) Details

Innodisk Corporation provides industrial embedded flash and DRAM storage products and technologies in Taiwan. The company offers flash storage products, including SSDs for industrial/embedded, enterprise server, aerospace, defense, and other semi-industrial applications; serial ATA disk on modules; ServerDOM to design servers; SATA Slim for portable/hand-held devices, thin clients, and industrial applications; CFast, a small form factor card for semi-industrial applications; mSATA, a low-profile interface connector that is used in laptops, netbooks, and mobile devices; M.2-SATA, a next generation form factor; Mini PCIeDOM, a flash based disk module; industrial CompactFlash cards for mobile computing and the industrial workplace applications; embedded disk cards; SD and microSD cards for rugged applications; USB/USB embedded disk cards; and nanoSSD, an integrated SATA storage device for miniaturization applications. It also provides embedded DRAM modules for IPC and PC embedded systems; server DRAM modules for multiplex and server level applications; wide temperature DRAM modules for industrial systems; and special customized DRAM modules for rugged environments and special mini-sizes. In addition, the company offers embedded peripherals comprising storage expansion products, disk arrays, display cards, and communication modules, as well as flash storage products with various interfaces and form factors. Innodisk Corporation was founded in 2005 and is headquartered in New Taipei City, Taiwan.

Founded in 2005

innodisk corp (5289) Top Compensated Officers

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Executives, Board Directors

innodisk corp (5289) Key Developments

Innodisk Launches New 16GB DDR4 Memory Modules for Embedded Systems and Servers

Innodisk announced higher capacity 16GB versions of its DDR4 embedded and server unbuffered DRAM series. These 2133MHz UDIMMs and SODIMMS now come in 16GB capacities, allowing more memory to be installed within space constrained embedded systems, industrial PCs and servers. Offering higher performance with lower power consumption compared to DDR3, the new DRAM modules have ECC available for reliability, as well as industrial strength features from Innodisk such as 30µ" Gold Finger connectors, thermal sensors, and protective conformal coatings. The new 16GB modules make Innodisk's range of DDR4 products the most complete line of embedded and server DDR4 memory on the market. With up to 30% better performance with 20% lower power consumption compared to DDR3 memory, Innodisk's unbuffered DDR4 modules and are a natural fit for the embedded industry. At 1.2V they use even less power than the 1.35V DDR3L Low Voltage standard. With the advent of the Intel Skylake platform, Innodisk's 16GB DDR4 UDIMMs and SO-DIMMs will unlock higher performance for memory-constrained embedded and server applications. Reliable Industrial Strength Technology With enhanced error detection and handling capabilities including parity error detection and Cyclic Redundancy Check (CRC), DDR4 improves memory reliability. In addition, Innodisk's 16GB DDR4 modules are infused with its industrial know-how, including robust connectors, thermal sensors, and conformal coatings. An extra proprietary 30µ" Golden Finger connector is 10 times thicker than the JEDEC standard, creating an extra-reliable interface. Thermal sensors on the module alert the system to temperature changes, preventing overheating. Protective conformal coatings are available to guard against a variety of physical and chemical contaminants. Standard profile height of 30.0mm for SODIMM, and 31.25mm for UDIMM; ECC available for data integrity; Single voltage 1.2V; Improved airflow; On-Die Termination; Lead-Free and compliant with RoHS; Average refresh period of 7.8us at 85°C or lower, and 3.9us between 85°C and 95°C.

Innodisk Announces Ruggedized mPCIe CAN Bus Adapter for Industrial and Embedded Systems

Innodisk introduced a new embedded peripheral module that extends embedded systems and industrial PCs with CANBus capability for the Internet of Things. The EMUC-B201 is a ruggedized mPCIe embedded peripheral module that provides dual channel CAN Bus 2.0A/B functionality to an embedded or industrial computer. With CANBus widely used in both vehicle sensor and subsystem communication as well as factory automation and control systems, the EMUC-B201 peripheral enables embedded systems for the Internet of Vehicles and Industrial PCs for Industry 4.0. The EMUC-B201 can interface two CAN Bus channels through either the mPCIe connector or a direct pin header connection for USB 2.0 communication with the main system. Invented originally for automotive subsystem communication and coordination, the CAN Bus is a real-time communication protocol connecting sensors, actuators and electronic control units(ECUs) and is widely used in both vehicles and modern factory control and automation. Both high speed CAN 2.0B and lower speed fault-tolerant CAN 2.0A are supported. The EMUC-B201 enables embedded systems to tap directly into vehicle or factory sensors and subsystems for real time data access and control. The EMUC-B201 can connect to a host system through an mPCIe physical interface or through a direct USB 2.0 pin header connection located on the card. Besides fitting in a standard mPCIe slot, the EMUC-B201 has 3 mounting holes and can be mounted directly onto an embedded motherboard and connected via the USB pin header, allowing it to be installed in systems without a free mPCIe slot. The EMUC-B201 is built to stand up to the harsh physical and electrical conditions of industrial and automotive environments. With an extra thick 30u Gold Finger connector for a good connection, as well as strong shock and vibration resistance, it stands up to the bumps of the road. The CAN Bus connections are galvanic isolated to 2500V, shielding the card from harsh power surge conditions and feature termination resistors for clean signaling without reflection. Finally, with operating temperature from -40° to 85°C the EMUC-B201 can operate across a variety of temperature ranges. Features include: 2 Channel CAN bus (2x DB9); Supports CAN 2.0B & CAN 2.0A; Galvanic isolation to 2500 V; mPCIe form factor; 30u Gold Finger interface for a reliable connection; Wide operating temperature: -40° to 85°C; USB 2.0 interface through mPCIe slot or pin header interface; Extra mounting holes for direct installation.

Innodisk Unveils 16GB DDR3 Memory for Atom Servers

Innodisk announced high capacity 16GB DDR3 Memory modules for Intel Atom Avoton and Rangeley based servers with speeds up to 1600MHz, making Innodisk the first on the market with a 16GB DDR3 ECC UDIMM module capable of 1600MHz. Available in UDIMM, SODIMM and ECC UDIMM. These high capacity, high speed memory modules let users easily maximize memory capacity and performance for servers based on the Atom C2000 Processor family. This means faster speeds and better performance for networking systems, telecommunication infrastructure and more. Innodisk's 16GB modules allow easy maximization of Atom memory performance Atom Servers feature high performance in a small package, but small form factor embedded motherboards and memory controller limitations mean a limited number of slots for DRAM. High capacity DRAM modules allow users of Atom Servers to easily maximize their server memory even with these limitations. With memory often being the performance bottleneck for many server applications such as networking, increasing DRAM is often the most effective and economical way to improve server performance.

 

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5289

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Valuation 5289 Industry Range
Price/Earnings 8.1x
Price/Sales 1.0x
Price/Book 2.2x
Price/Cash Flow 7.9x
TEV/Sales 0.9x
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