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Last $100.00 HKD
Change Today 0.00 / 0.00%
Volume 0.0
4336 On Other Exchanges
Symbol
Exchange
Hong Kong
Munich
NASDAQ GS
As of 4:15 AM 04/1/15 All times are local (Market data is delayed by at least 15 minutes).

applied materials inc (4336) Snapshot

Open
--
Previous Close
$100.00
Day High
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Day Low
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52 Week High
08/20/14 - $165.00
52 Week Low
04/1/15 - $100.00
Market Cap
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Average Volume 10 Days
0.0
EPS TTM
--
Shares Outstanding
1.2B
EX-Date
08/19/15
P/E TM
--
Dividend
$0.40
Dividend Yield
3.10%
Current Stock Chart for APPLIED MATERIALS INC (4336)

applied materials inc (4336) Related Businessweek News

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applied materials inc (4336) Details

Applied Materials, Inc. provides manufacturing equipment, services, and software to the semiconductor, flat panel display, solar photovoltaic (PV), and related industries worldwide. The company’s Silicon Systems Group segment develops, manufactures, and sells a range of manufacturing equipment used to fabricate semiconductor chips or integrated circuits. This segment offers systems that perform primary processes used in chip fabrication, including atomic layer deposition, chemical vapor deposition, physical vapor deposition, etch, electrochemical deposition, rapid thermal processing, ion implantation, chemical mechanical planarization, epitaxy, wet cleaning, and wafer metrology and inspection, as well as systems that etch or inspect circuit patterns on masks used in the photolithography process. Its Applied Global Services segment provides products and services designed to enhance the performance and productivity, and reduce the environmental impact of semiconductor, display, and solar customers' factories. The company’s Display segment offers products for manufacturing liquid crystal displays (LCDs), organic light-emitting diodes, and other display technologies for televisions, personal computers, tablets, smartphones, and other consumer-oriented devices. Its Energy and Environmental Solutions segment provides systems for wafer-based crystalline silicon cells and modules. This segment also offers roll-to-roll vacuum Web coating systems for deposition of various films on roll-to-roll plastic substrates for flexible touch panels, flexible displays, and other applications. The company serves manufacturers of semiconductor wafers and chips, flat panel liquid crystal and other displays, solar PV cells and modules, and other electronic devices. Applied Materials, Inc. was founded in 1967 and is headquartered in Santa Clara, California.

14,000 Employees
Last Reported Date: 12/17/14
Founded in 1967

applied materials inc (4336) Top Compensated Officers

Chief Executive Officer, President and Direct...
Total Annual Compensation: $980.0K
Chief Financial Officer and Senior Vice Presi...
Total Annual Compensation: $575.0K
Chief Technology Officer, Senior Vice Preside...
Total Annual Compensation: $426.2K
Executive Vice President and General Manager ...
Total Annual Compensation: $575.0K
Senior Vice President and General Manager of ...
Total Annual Compensation: $485.4K
Compensation as of Fiscal Year 2014.

applied materials inc (4336) Key Developments

Cadence Design Systems Inc. and Applied Materials Collaborate on Joint Development Program to Optimize Planarization Process Through Advanced CMP Modeling

Cadence Design Systems, Inc. and Applied Materials, Inc. announced the companies are collaborating on a development program to optimize the chemical-mechanical planarization (CMP) process through silicon characterization and modeling for advanced-node designs at 14 nanometer (nm) and below. The program allows design teams to predict the impact of CMP on both functional yield and parametric yield, and for manufacturing teams to boost planarization performance, which is increasingly critical for advanced FinFET architectures. The Cadence® and Applied Materials joint development program is focused on front end-of-line (FEOL) and wafer-level CMP modeling. Applied Materials can use the Cadence CMP Process Optimizer, a tool that allows silicon calibration of semi-physical models and optimization of CMP material and process parameters such as pressure, polish time and overall CMP uniformity, to enhance the precision performance of its Reflexion® LK Prime™ CMP system.

Applied Materials, Inc. Introduces New Physical Vapor Deposition Sytem

Applied Materials, Inc. has introduced the Applied Endura Cirrus HTX PVD, a physical vapor deposition sytem for creating titanium nitride, or TiN, hardmask films that could be used in fabricating 10-nanometer and 7nm chips. As chip features continue to shrink, innovations in hardmask are required to preserve the pattern integrity of tightly packed, tiny interconnect structures. With the introduction of this technology, Applied enables scaling of the TiN metal hardmask - the industry's material of choice - to meet the patterning needs of copper interconnects in advanced microchips. The role of the metal hardmask is to preserve the integrity of these patterned lines and vias in soft ULK dielectrics. However, with scaling, the compressive stress from conventional TiN hardmask layers can cause the narrow lines patterned in ULK films to deform or collapse. The tunable Cirrus HTX TiN hardmask with high etch selectivity delivers superior CD line width control and via overlay alignment resulting in yield improvement. This breakthrough in TiN hardmask is made possible by precision materials engineering at the wafer level to produce a high density, low-stress film. Combining exceptional film thickness uniformity with low defectivity on a proven Endura platform, the Cirrus HTX system addresses the stringent high volume manufacturing needs of patterning multiple interconnect layers.

Applied Materials, Inc. Announces Board Changes

On June 5, 2015, the Board of Directors of Applied Materials, Inc. appointed Willem P. Roelandts as Chairman of the Board, effective immediately. Mr. Roelandts has served as a director of Applied since 2004 and as Lead Independent Director since 2008. Mr. Roelandts succeeds Michael R. Splinter, who retired as director and Chairman of the Board on June 5, 2015.

 

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Industry Analysis

4336

Industry Average

Valuation 4336 Industry Range
Price/Earnings 18.7x
Price/Sales 2.5x
Price/Book 2.8x
Price/Cash Flow 18.6x
TEV/Sales 2.0x
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