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Last 7.40 TWD
Change Today +0.02 / 0.27%
Volume 13.9M
As of 2:38 AM 04/24/15 All times are local (Market data is delayed by at least 15 minutes).

macronix international (2337) Snapshot

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52 Week High
07/8/14 - 8.74
52 Week Low
12/1/14 - 6.10
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macronix international (2337) Details

Macronix International Co., Ltd. primarily engages in the design, manufacture, and supply of integrated circuits and memory chips in Taiwan, China, and internationally. It provides a range of NOR flash, NAND flash, and ROM products. The company also provides process change notification/end of life products; and green products designed for environmental protection, as well as offers wafer foundry services to IC design and IDM companies. In addition, it offers baseband, analog baseband, and power management chips. Further, the company is involved in the development of integrated circuit system and software; and provision of after-sales services, as well as technical support services of Combi-SIM IC. It serves the consumer, communication, computing, automotive, networking, and other segment markets. Macronix International Co., Ltd. was founded in 1989 and is headquartered in Hsinchu, Taiwan.

Founded in 1989

macronix international (2337) Top Compensated Officers

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macronix international (2337) Key Developments

Macronix International Co. Ltd. Reports Unaudited Consolidated Earnings Results for the Fourth Quarter Ended December 31, 2014

Macronix International Co. Ltd. reported unaudited consolidated earnings results for the fourth quarter ended December 31, 2014. The company announced the fourth quarter net revenues of TWD 5,960 million, an 11% decrease sequentially and increase of 2% year- over-year. The sequential revenue decrease was because of seasonal lower demand in all product lines. Operating income for the fourth quarter was negative TWD 2,155 million compared to negative TWD 1,099 million in the third quarter of 2014 and negative TWD 1,468 million in the fourth quarter of 2013. Net income before tax was negative TWD 2,285 million compared to negative TWD1,100 million in the third quarter of 2014 and negative TWD 1,510 million in the fourth quarter of 2013. EPS was negative TWD 0.65 compared to negative TWD 0.31 in the third quarter of 2014 and negative TWD 0.42 in the fourth quarter of 2013. The book value was TWD 6.4 per share. Net cash flow in operating activities was TWD 1,760 million in the quarter. Capital expenditure for the quarter was TWD 264 million mainly for the related equipment procurement of 12 Fab.

Spansion Inc. and Macronix International Co., Ltd. Reach Settlement Agreement

Spansion Inc. and Macronix International Co. Ltd. have settled all outstanding patent disputes and actions, including their respective complaints at the US International Trade Commission as well as District Court, inter partes review proceedings at USPTO, and Macronix's patent infringement complaint against Spansion in Germany. As part of the settlement, both companies agreed to dismiss all patent cases between them and their downstream customers worldwide. In the agreement, the companies have granted certain rights under the disputed patents to each other. The settlement allows both companies to direct their full attention and resources to continuing to innovate and serving their customers' needs as leaders in the memory semiconductor industry.

Macronix Launches New Family of Wide-Voltage, Ultra-Low-Power Nor Flash Memory Products

Macronix has launched a new family of wide-voltage, ultra-low-power NOR Flash memory products designed for next-generation wearable devices. The MX25R family features power consumption that is 60% lower than that of traditional devices and a Vcc wide-voltage span of 1.7V-3.6V to support diverse requirements of wearable devices. The MX25R family supports the standard Serial NOR Flash memory interface with ultra-small product packages such as USON and WLCSP, and KGD (known good die) products for SIP (system-in-package) solutions. Besides its wide-voltage/ultra-low power MX25R family, Macronix solutions popular in wearable products consist of 1.8V 512Kb-512Mb Serial NOR devices. These are offered in small footprints such as KGD (known good die) and WLCSP (wafer-level chip-scale packages). Macronix MCP (multi-chip package) memory has also been utilized in many smart wearable products. The company's intensive research and development of innovative memory technologies has delivered VG (vertical gate) 3D NAND, using its own patented BE-SONOS technology to break through manufacturing process restrictions; and ReRAM (resistive random-access memory) technology utilizing a simple storage unit structure that features high speed and low power consumption for future wearable applications. Macronix Product Solutions for Wearable Devices: 1.7V ~ 3.6V Serial NOR (MX25R): 512Kb ~ 64Mb; Packages: 8-SOP, 8-WSON, 8-USON, WLCSP, KGD; 64Mb (sampling now); 1.8V Serial NOR (MX25/66U): 512Kb ~ 512Mb; Packages: 2*3/4*3/4*4 USON, 6*5/6*8 WSON, WLCSP, KGD; 1.8V NOR MCP; MX65U (SPI-NOR + pSRAM): 64Mb+32Mb, 128Mb +64Mb; MX69N (AD-Mux PNOR + pSRAM): 64Mb +32Mb; MX69V (AD-MUX PNOR + pSRAM): 128Mb +64Mb; Packages: 6.2*7.7, 6*6 TFBGA; 1.8V NAND MCP; MX63U (SLC NAND + LPDDR2): 4Gb+2Gb, 2Gb+1Gb, 1Gb+1Gb; and Packages: 8*10.5 VFBGA, 8*9 VFBGA.


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